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    AP Memory APS512XXN-OBR-BG

    DRAM IoT RAM 512Mb OPI (x8,x16) DDR 200MHz, 1.8V, Ind. Temp., BGA24
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics APS512XXN-OBR-BG 98
    • 1 $6.64
    • 10 $6.07
    • 100 $5.3
    • 1000 $4.74
    • 10000 $4.74
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    AP Memory APS512XXN-OB9-WB

    DRAM IoT RAM 512Mb OPI (x8,x16) DDR 250MHz, 1.8V, Ind. Temp., WLCSP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics APS512XXN-OB9-WB
    • 1 $5.51
    • 10 $4.89
    • 100 $4.39
    • 1000 $3.89
    • 10000 $3.89
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    PS512X Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    A2631

    Abstract: No abstract text available
    Text: DENSE-PAC M ie R O S ì S 16 Megabit High Speed CM OS SRAM D PS512X32C V3 i li M S D E S C R IP T IO N : The DP5512X32CV3 "VERSA-STACK" module is a revolutionarynew high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ


    OCR Scan     		PDF PS512X32C DP5512X32CV3 DPS512X32CV3 500mV 30A044-13 30A044-1 A2631

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF PS512X32M DPS512X32MKV3 surfa85 3QA128-02

    ersa ms 8000

    Abstract: No abstract text available
    Text: □PM PS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		PDF DPS512X32V3 PS512X32V ersa ms 8000

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 8 Megabit High Speed CMOS SRAM D PS512X 16C n 3/D P S512X 16B n 3 DESCRIPTIO N : The D P S 5 12 X 16Cn3/DPS512 X 16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS512X16Cn3/DPS512X16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin DPS512X1 6Cn3/DPS512X16Bn3 275T41S

    Untitled

    Abstract: No abstract text available
    Text: □PM PS512X16A3 Dense-Pac Microsystems, Inc. CERAMIC 512KX 16 CMOS SRAM MODULE O PRELIMINARY D ESC R IP TIO N : The D PS512X16A3 "D EN SE-STA CK" module is a re v o lu tio n a ry n e w m e m o ry su b sy ste m using Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		PDF DPS512X16A3 512KX PS512X16A3 DPS512X16A3 30A045-10

    32A18

    Abstract: No abstract text available
    Text: DENSE-PAC 16 Megabit C M O S SRAM D PS512X32M L/D PS512X32M W M I C R O S Y S T E M S P R ELIM IN A R Y DESCRIPTION: PIN-OUT DIAGRAM The PS512X32ML/PS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing


    OCR Scan     		PDF PS512X32M DPS512X32ML/DPS512X32MW 30A148-00 32A18

    Untitled

    Abstract: No abstract text available
    Text: «ffí 1 £ 1993 □PM D P S 5 1 2 X 1 6 n 3 Dense-Pac Microsystems, Inc. Ceramic, S12Kx16 SRAM Stack Modules O D E S C R IP T IO N : The D PS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight


    OCR Scan     		PDF S12Kx16 PS512X16n3 50-pin 100ns 120ns 150ns 125-C 30A097-08

    DPS512X32BV3

    Abstract: No abstract text available
    Text: PEN SE-PAC M IC R O SYS T \.i 16 Megabit High Speed CMOS SRAM MS D PS512X32 BV3 DESCRIPTION: The D P S 512X 32B V 3 "VE R S A -S TA C K ” m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less


    OCR Scan     		PDF DPS512X32BV3 DPS512X32BV3 500mV 30A044-12

    Untitled

    Abstract: No abstract text available
    Text: D E N S E -P A C 16 Megabit CMOS SRAM MICROSYSTEMS PS512X32V3 DESCRIPTION: The D PS512X32V3 'V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic substrate. It offers


    OCR Scan     		PDF DPS512X32V3 DPS512X32V3 3QAD44-10

    Untitled

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. PS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The PS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


    OCR Scan     		PDF DPS512X32V3 PS512X32V3 30A044-10

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS PS512X 16Cn3/PS512X 16Bn3 DESCRIPTION: The PS512X16Cn3/PS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS512X 16Cn3/DPS512X 16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin -t-85 3QA097-38

    Untitled

    Abstract: No abstract text available
    Text: □PM PS512X16AA3 Dense-Pac Microsystems. Inc. HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The PS512X16AA3 "DEN SE-STACK" module is a revolutionary new high speed mem ory subsystem using Dense-Pac M icrosystem s' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired


    OCR Scan     		PDF DPS512X16AA3 PS512X16AA3 102Chip 30A045-11

    1431 T

    Abstract: 56TAL
    Text: DENSE-PAC 16 Megabit CM O S SRAM M I C R O S Y S T E M S D P S 5 1 2 X 3 2 M L /D P S 5 12 X 3 2 M W PR ELIM IN A R Y D ESCRIPTIO N : P IN -O U T DIAGRAM The PS512X32M L/PS512X 32M W is a 512K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended


    OCR Scan     		PDF DPS512X32ML/DPS512X32MW DPS512X32ML/DPS512X32MW 72-Pin 30A148-00 D001fl3M 1431 T 56TAL

    48-PIN

    Abstract: No abstract text available
    Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead


    OCR Scan     		PDF PS128M PS3232V DPS128X16CJ3/BJ3 PS128X16CH DPS128X16Y3 PS128X16H PS128X24BH PS512S8BN PS512S8N 48-PIN

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 M egabits CMOS SRAM PS512X16n3 M I C R O S Y S T E M S D ESCRIPTIO N : The PS512X16n3 SRAM “ ST A C K" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded


    OCR Scan     		PDF DPS512X16n3 DPS512X16n3 50-pin PS512X16n3 120ns 150ns -t-125