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Text: 16 Megabit CMOS SRAM DPS512X32V3 DESCRIPTION: The DPS512X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPS512X32V3
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Text: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic
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Abstract: No abstract text available
Text: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless
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Text: □PM V Dense-Pac Microsystems, Inc. DPS512X32V3 CERAMIC 512K X 32 CMOS SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS512X32V3 "VER SA -ST A C K" module is a re v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless
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Text: □P M DPS512X32V3 Dense-Pac Microsystems, Inc. CERAMIC 512K X 32 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D P S 5 1 2 X 3 2 V 3 “V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless
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Text: DENSE-PAC 16 Megabit CM OS SRAM DPS512X32V3 M I C R O S Y S T E M S DESCRIPTION: T h e DPS512X32V3 "VERSA-STACK" m od ule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired ceram ic
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Text: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. CERAMIC 512K X 32 CMOS SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless
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Text: DENSE-PAC 16 Megabit CMOS SRAM MICROSYSTEMS DPS512X32V3 D E SC R IPT IO N : The DPS512X32V3 "VERSA -STA C K" module is a re v o lu tio n a r y n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic
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Text: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32V3 M I C R Ö S Y S T E M S DESCRIPTION: The DPS512X32V3 "VERSA-STACK” module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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Text: D E N S E -P A C 16 Megabit CMOS SRAM MICROSYSTEMS DPS512X32V3 DESCRIPTION: The D PS512X32V3 'V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic substrate. It offers
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DPS512X32V3
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3QAD44-10
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DP5Z
Abstract: No abstract text available
Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS
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128Kx8,
64Kx16,
256Kx8,
384Kx8,
DP5Z
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48-PIN
Abstract: No abstract text available
Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead
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PS128M
PS3232V
DPS128X16CJ3/BJ3
PS128X16CH
DPS128X16Y3
PS128X16H
PS128X24BH
PS512S8BN
PS512S8N
48-PIN
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A273D
Abstract: 16J3 512X32 48pin
Text: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32
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26-Pin
72-Pin
A273D
16J3
512X32
48pin
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