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    E43F2

    Abstract: AG41 AU31 ST BB6 AH42 H42 m7 C37-C39 g18 t40 C1594 AY36
    Text: Ironwood Electronics, Inc. PO Box 21151 • St. Paul, MN 55121 • 651 452-8100 • Fax (651) 452-8400 PA-IPGA503-01, or C1594 Map Rev D PGA Base 1 A B 2 3 4 5 6 1 5 7 9 3 7 8 11 13 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 15 17 19 21 23 25 27 29 31


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    PA-IPGA503-01, C1594 E43F2 AG41 AU31 ST BB6 AH42 H42 m7 C37-C39 g18 t40 AY36 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 1111111111111 111111 1 1111111111111 1 1111111111111 1 1111111111111 1 1 A123456789AABCDCEFCAFBAAAAA A AAAAAAAA A AAAAAAAA A AAAAAAAA A A CA3E 123314567891A758BCD814E1F3D167D1F1C5A36 CDAEA2EA7 !F"#$%&'A7 A 3*+A)BA2EEA#$ACCDCB


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    123456789AABCDCEF 123314567891A758BCD814E1F3 167D1 4D715 1619D7 C75C5 3D791469D815 1A75CD9957 15AD7 19ADD815 PDF

    TLA-6T718

    Abstract: renesas v850e2 hardware manual TLA6T718 V850E2 uPD70F35 V850E2/FL4 E22/6/BSR13/74ABT244/SA6.5CA/54-E3-datasheet
    Text: User’s Manual ユーザーズ・マニュアル V850E2/MN4 Target board QB-V850E2MN4DUAL-TB User’s Manual 動作電圧 ③寸法部品配置など 3.0V~3.6V OSC1:9.6MHz 発振子使用時 79 80 79 80 1 2 1 2 LED4 ACTIVITY LED5 SPEED100 30 40 50 10


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    V850E2/MN4 QB-V850E2MN4DUAL-TB SPEED100 KSZ8041ç V850E2/ 2/ANI08 ANI02 D30/TA2 I14/TA2 D27/TA2 TLA-6T718 renesas v850e2 hardware manual TLA6T718 V850E2 uPD70F35 V850E2/FL4 E22/6/BSR13/74ABT244/SA6.5CA/54-E3-datasheet PDF

    Untitled

    Abstract: No abstract text available
    Text: 2342156758692 755BCA15DAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA EFAAA 3*& D'' # @ / 8B5:7BF9 2A


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    755BCA15DAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA F9/D98 987C53 F95/5EF 5A89A FD543 6789AB8CDB 9F579F5F 55E58 E528E5AR PDF

    9LPR310

    Abstract: 9LPR310-CLK SADQ34 U24E SADQ32 ITE8510 VSS011 AMPLIFIER HY 219 SADQ25 U24g
    Text: Chapter 2 Major Components Page 1 of 40 Chapter 2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 31 2.3. Connector Definition…….………………………………………………. 40


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    P72IA0 318MHz ADM1032 533/667MHZ 9LPR310-CLK Z2407 CON22) CON18) 9LPR310 9LPR310-CLK SADQ34 U24E SADQ32 ITE8510 VSS011 AMPLIFIER HY 219 SADQ25 U24g PDF

    VSS011

    Abstract: IT8510 ALC882H X72IA6 U24E 9LPR310-CLK ich7 HA20 SAMA5
    Text: Chapter 2 Page 1 of 42 Major Components Chapter 2 Major Components 2.1. System Block Diagram ……………………………………………. 3 2.2. Major Component Definition.…….………………………………. 30 2.3. Connector Definition…….………………………………………….


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    X72IA6 ADM1032 318MHz 533/667MHZ Page13 945PM Page26 Page21 CON18) VSS011 IT8510 ALC882H U24E 9LPR310-CLK ich7 HA20 SAMA5 PDF

    P53IA0

    Abstract: 9LPR310 SAMA5 9LPR310-CLK hd51 IT8510 z2508 Z1515 HA20
    Text: Chapter2 Page 1 of 36 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 4 2.3. Connector Definition…….………………………………………………. 28


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    P53IA0 ADM1032 318MHz 533/667MHZ Z2505 QT4532KL080HC Z3418 Z3419 Z3420 P53IA0 9LPR310 SAMA5 9LPR310-CLK hd51 IT8510 z2508 Z1515 HA20 PDF

    XC61CN2702MR

    Abstract: XC61CN2702M XC61CN2702 16gb chip 16GB Nand flash AS3SSD16GB5PBG AB-24 AC18-AC19
    Text: SOLID STATE DISK ON CHIP A STORAGE SOLUTIONS PRODUCT AS3SSDxxGBxPBG 1 / 2 / 4 / 8 & 16GB NAND SLC FLASH MEMORY SUBSYSTEM FEATURES SSDoC Solid State Disk on Chip, a Storage Solutions Product AS3SSDxxGByPBG Equates to the integration of: NAND FLASH Controller


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    512Byte XC61CN2702MR XC61CN2702M XC61CN2702 16gb chip 16GB Nand flash AS3SSD16GB5PBG AB-24 AC18-AC19 PDF

    AA10

    Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA


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    EP20K200E 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


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    EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF

    AJ43

    Abstract: AG43 BA43 transistor bc29 BC33 AA45 AR33 Be43 BA41 BE45
    Text: EPF10K250A Device Pin-Outs ver. 1.0 Pin Name MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)


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    EPF10K250A 599-Pin EPF10K100A 600-pin 240-pin AJ43 AG43 BA43 transistor bc29 BC33 AA45 AR33 Be43 BA41 BE45 PDF

    AR17 datasheet

    Abstract: BA43 AG45 ba43 diode be27 transistor bc29 ba7 transistor A45 so Be43 ba37
    Text: EPF10K130V Device Pin-Outs ver. 1.0 Pin Name MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)


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    EPF10K130V 599-Pin EPF10K100A 600-pin 240-pin AR17 datasheet BA43 AG45 ba43 diode be27 transistor bc29 ba7 transistor A45 so Be43 ba37 PDF

    RT3PE3000L

    Abstract: RT3PE600L CCGA diode t25 4 L9 AG18 AA10 AA13 aa19 896-CCGA IO115NPB3V0
    Text: Radiation-Tolerant ProASIC3 Packaging 3 – Package Pin Assignments 484-Pin CCGA A B C D E F G H J K L M N P R T U V W Y AA AB 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    484-Pin RT3PE600L IO07PDB0V1 IO71NDB4V0 IO11NDB0V1 RT3PE3000L RT3PE600L CCGA diode t25 4 L9 AG18 AA10 AA13 aa19 896-CCGA IO115NPB3V0 PDF

    AA43

    Abstract: AJ43 BE43 AR-23 BF44 bg47 AR33 t35 4 c8 EPF10K200E AY42
    Text: EPF10K200E Device Pin-Outs ver. 1.0 Pin Name 1 MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBUSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4) DATA3 (4) DATA2 (4)


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    EPF10K200E 599-Pin AA43 AJ43 BE43 AR-23 BF44 bg47 AR33 t35 4 c8 AY42 PDF

    Calistoga

    Abstract: ALC861 VSS011 DMI0TXP OZ128TN ALC880 SAMA5
    Text: Chapter2 Page 1 of 45 Major Components Chapter2 Major Components 2.1. System Block Diagram ……………………………………………… 3 2.2. Major Component Definition .…….………………………………. 35 2.3. Connector Definition…….………………………………………….


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    FSB533/667 M52-T SO-DIMM1/533/667 SO-DIMM2/533/667 945PM 16X16 16X16 QT4532KL080HC Z3418 Z3419 Calistoga ALC861 VSS011 DMI0TXP OZ128TN ALC880 SAMA5 PDF

    k2843

    Abstract: NC154 74LV128 NC168 NC108 NC143 C495 transistor NC164 NC132 NC130
    Text: ZLAN-57 ZL50211 2048 Channel VEC System Application Note Contents August 2003 The design contained within this document is intended as reference material only, and not as a fully qualified system. It is intended to be used as a starting point for a customer design.


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    ZLAN-57 ZL50211 ZL50211 16Mbps, k2843 NC154 74LV128 NC168 NC108 NC143 C495 transistor NC164 NC132 NC130 PDF

    AD149

    Abstract: tms 374 con1 AD347 C8816 AD255 PCI9030 con20A la3106 ad1037
    Text: A B C D E VCC3v3 VCC1v8 VCC3V3 C2 MRST- C18 RST tRst- L20 tRst- CS0CS1CS2CS3- B19 A19 B18 A18 CS0CS1CS2CS3- ALE RDWRLW-R C17 B17 A17 E16 ALE RD WR W/R- tCStWRtRDtDBEn tALE tBLast L18 L17 K22 K21 K19 K18 tCStWRtRDtDBEn tALE tBlast tRdy tInt- K17 J22 tRdy tInt-


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    XRT79L74 AD149 tms 374 con1 AD347 C8816 AD255 PCI9030 con20A la3106 ad1037 PDF

    AG31

    Abstract: QSE66 QSE60 QSE64 QSE25 AD32 XpressGXII AF29
    Text: BB_HSI Daughter Board Reference Manual Version 1.0 January 2007 Copyright PLDApplications 1996-2006 BB_HSI Reference Manual BB_HSI Reference Manual Change History Date January 2007 Version Number 1.0 Change ● First Release Table of Contents Chapter 1


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    XpressFX100 XpressFX100. AG31 QSE66 QSE60 QSE64 QSE25 AD32 XpressGXII AF29 PDF

    i960Cx

    Abstract: AA10 V96BMC V96BMC-33LP V96BMC-40LP
    Text: V96BMC Rev. D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR i960Cx/Hx/Jx PROCESSORS • Pin/Software compatible with earlier V96BMC. • Software-configured operational parameters. • Direct interfaces to i960Cx/Hx/Jx processors. • Integrated Page Cache Management.


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    V96BMC i960Cx/Hx/Jx® V96BMC. i960Cx/Hx/Jx 512Mb 24-bit 40MHz 132-pin i960Cx AA10 V96BMC-33LP V96BMC-40LP PDF

    diode t25 4 k8

    Abstract: diode t25 4 B9 diode t25 4 H9 diode t25 4 k5 diode t25 4 L9 diode AA17 diode t25 4 k6 diode t25 4 g8 diode t25 4 G9 T4 w4 DIODE
    Text: Pin Information For The Stratix EP1S10 Device, ver 3.1 Bank Number B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B1 B1 VREF Bank Pin Name/Function Optional Function s


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    EP1S10 diode t25 4 k8 diode t25 4 B9 diode t25 4 H9 diode t25 4 k5 diode t25 4 L9 diode AA17 diode t25 4 k6 diode t25 4 g8 diode t25 4 G9 T4 w4 DIODE PDF

    A3PE600L

    Abstract: 896-Pin FBGA 896 A3PE3000L A3P1000 IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29
    Text: Military ProASIC3/EL Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .


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    208-Pin A3P1000 IO199PDB3 IO162RSB2 A3PE600L 896-Pin FBGA 896 A3PE3000L IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29 PDF

    896-pin

    Abstract: FBGA 896 AA13 E20 L27 AF29 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1
    Text: IGLOOe Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    256-Pin AGLE600 IO13NDB0V2 GAA0/IO00NDB0V0 GAC0/IO02NDB0V0 896-pin FBGA 896 AA13 E20 L27 AF29 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 PDF

    FBGA 896

    Abstract: AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
    Text: IGLOO e Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    256-Pin AGLE600 IO13NDB0V2 GAA0/IO00NDB0V0 GAC0/IO02NDB0V0 FBGA 896 AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1 PDF

    H1AA2

    Abstract: equivalent for S AV36 AK17 XC4000D AY42 AF38 BG560 AJ32
    Text: £ XILINX XC4000XV Family Field Programmable Gate Arrays November 21,1997 Version 0.9 Advance Product Specification XC4000XV Family FPGAs XC4000XV Electrical Features Note: This data sheet describes the XC4000XV Family devices. This information does not necessarily apply to the


    OCR Scan
    XC4000XV XC4000, XC4000A, XC4000D, XC4000H, XC4000L, XC4000E, XC4000EX, H1AA2 equivalent for S AV36 AK17 XC4000D AY42 AF38 BG560 AJ32 PDF