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    BGA 176 BALL PACKAGE Search Results

    BGA 176 BALL PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 176 BALL PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA 176 ball package datasheet

    Abstract: BGA 176 ball package BGA 176 datasheet BGA176
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC To Top / Package Lineup / Package Index BGA-176P-M01 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plastic mold BGA-176P-M01 176-pin plastic FBGA (BGA-176P-M01)


    Original     		PDF BGA-176P-M01 176-pin BGA-176P-M01) B176001S-1C-1 BGA 176 ball package datasheet BGA 176 ball package BGA 176 datasheet BGA176

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


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    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    UBGA49

    Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
    Text: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm


    Original     		PDF 100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE

    BGA 176 ball package

    Abstract: EPF10K50A EPF10K50E EPF10K50S EPF6010A EPF6016 EPF6016A EPF6024A EPM7064AE EPM7128AE
    Text: SameFrame Pin-Out Design for FineLine BGA Packages September 2000, ver. 1.01 Introduction Application Note 90 A key advantage of designing with programmable logic is the flexibility which allows designers to quickly modify or add features to a design. When modifying a design, it is often necessary to move to a larger or


    Original     		PDF

    EMP7128

    Abstract: 256-pin BGA EPF6016 100 PINOUT EPF10K50S BGA 176 ball package datasheet BGA Package EPF10K200E EPF10K50E EPF6010A EPF6016
    Text: SameFrame Pin-Out Design for FineLine BGA Packages June 1999, ver. 1 Introduction Application Note 90 A key advantage of designing with programmable logic is the flexibility which allows designers to quickly modify or add features to a design. When modifying a design, it is often necessary to move to a larger or


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    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    A12B11

    Abstract: d-t pt 5000VA 5256VA 5384VA 5512VA 5512VA-110LB388 208pin PQFP
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		PDF 5512VA 0212/5512va ispLSI5512VA-110LB272 272-Ball 5512VA-110LB388 388-Ball 5512VA-110LQ208 208-Pin 5512VA-100LB272 A12B11 d-t pt 5000VA 5256VA 5384VA 5512VA 5512VA-110LB388 208pin PQFP

    TE32882E

    Abstract: DDR3 DIMM pinout TE32882 DDR3 pcb layout DDR3 sdram pcb layout guidelines SSTE32882 dimm pcb layout DDR3 DIMM 240 pinout
    Text: SN74SSQE32882 www.ti.com . SCAS857A – MARCH 2008 – REVISED OCTOBER 2008 28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST


    Original     		PDF SN74SSQE32882 SCAS857A 28-BIT 56-BIT SSTE32882 TE32882E DDR3 DIMM pinout TE32882 DDR3 pcb layout DDR3 sdram pcb layout guidelines dimm pcb layout DDR3 DIMM 240 pinout

    5000VA

    Abstract: A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		PDF 5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23

    5000VA

    Abstract: 5256VA 5384VA 5512VA
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		PDF 5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA 5256VA 5384VA 5512VA

    DDR3 DIMM 240 pinout

    Abstract: DDR3-1066 DDR3-1333 SN74SSQE32882 SN74SSQE32882ZALR DDR3 DIMM pinout SCAS857 DDR3 pcb layout guidelines TE32882
    Text: SN74SSQE32882 www.ti.com . SCAS857 – MARCH 2008 28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST


    Original     		PDF SN74SSQE32882 SCAS857 28-BIT 56-BIT DDR3 DIMM 240 pinout DDR3-1066 DDR3-1333 SN74SSQE32882 SN74SSQE32882ZALR DDR3 DIMM pinout SCAS857 DDR3 pcb layout guidelines TE32882

    XC95216-20PQG160I

    Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
    Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but


    Original     		PDF XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500

    Untitled

    Abstract: No abstract text available
    Text: ispLSI 5256VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		PDF 5256VA 0212/5256VA 5256VA-125LB272 272-Ball 5256VA-125LQ208 208-Pin 5256VA-125LB208 208-Ball 5256VA-100LB272

    t04 68 3 pin controller

    Abstract: 5256VA 5384VA 5512VA CLK32
    Text: ispLSI 5256VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		PDF 5256VA 0212/5256VA 5256VA-125LB272 272-Ball 5256VA-125LQ208 208-Pin 5256VA-125LB208 208-Ball 5256VA-100LB272 t04 68 3 pin controller 5256VA 5384VA 5512VA CLK32

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer

    MSS30

    Abstract: CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard
    Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V


    Original     		PDF ASIC-FS-20655-11/99 MSS30 CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard

    Untitled

    Abstract: No abstract text available
    Text: Lattice ; ; ; ; Semiconductor •• ■■ Corporation is p L S r 5 512 VA VANTI S In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore


    OCR Scan     		PDF ispLSI5512VA-110LB272* 272-Ball 5512VA-110LB388 388-Ball 5512VA-110LQ208* 208-Pin 5512VA-100LB272* 5512VA-100LB388

    Untitled

    Abstract: No abstract text available
    Text: Lattice ; ; ; ; Semiconductor •• ■■ Corporation ispLSr 5256VA VANTI S In-System Programmable 3.3V SuperWIDE High Density PLD Superior Quality of Results Tightly Integrated with Leading CAE Vendor Tools Productivity Enhancing Timing Analyzer, Explore


    OCR Scan     		PDF 5256VA 5256VA-125LB272 272-Ball 5256VA-125LQ208 208-Pin 5256VA-125LB208 208-Ball 5256VA-100LB272 5256VA-100LQ208