Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
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OCR Scan
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26x26
15X15
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PDF
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Untitled
Abstract: No abstract text available
Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers
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W3630A
U4154A
5990-3179EN
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PDF
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337 BGA
Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –
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EP20K200C
208-Pin
240-Pin
484-Pin
356-Pin
652-Pin
672-Pin
337 BGA
U212-25
AA10
AA23
E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
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PDF
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35 x 35 PBGA, 580 100 balls
Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8
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C13550EJ1V0PF00
35 x 35 PBGA, 580 100 balls
Enplas drawings
HG7900
BGA Ball Crack
153pin
NEC stacked CSP 2000
PEAK TRAY bga
BGA-35
Lead Free reflow soldering profile BGA
NEC stacked CSP
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PDF
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XC95216-20PQG160I
Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but
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XC95216
352-pin
XC95288
XCN07010
352-pin
XC95216-20PQG160I
XC95216-15PQ160I
471 E25
XC95216 Family
XC95216-10PQ160C
XC95216-10PQ160I
XC95216-15PQG160C
XC95216-15PQG160I
XC95216-10PQG160I
XC9500
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PDF
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EIA-364 65A
Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •
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8-1773444-1-CC
LH-PDF-07/06
EIA-364 65A
lga components
LGA resistance
EIA-364-65A
0.5mm pitch BGA
EIA-364-27
EIA-364-28
EIA-364-31
EIA-364-32
LGA PACKAGE thermal resistance
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PDF
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Untitled
Abstract: No abstract text available
Text: Product Number: 582-11-441-11-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 441-11-005 21 X 21
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C17200)
64-56A
64-22A/31A
65-17A
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PDF
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E2677A
Abstract: No abstract text available
Text: W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address
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W2635A
W2636A
W2635A
JESD79-3C)
5989-7643EN
E2677A
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PDF
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Untitled
Abstract: No abstract text available
Text: Product Number: 587-10-441-11-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 441-11-005 21 X 21 # Of Pins Mill-Max Part Number 441 587-10-441-11-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
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C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
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PDF
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HXC125
Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The
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1654563-CC
CE-PDF-07-08
HXC125
mm1764
1-1640294-0
1mm pitch BGA socket
1024 ball bga
1640302-3
MM1089
441 ball bga
bga 1296
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PDF
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Untitled
Abstract: No abstract text available
Text: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2
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W2630
signal69
5989-5964EN
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PDF
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AH35
Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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EP20K1000C
652-Pin
672-Pin
020-Pin
AH35
AA10
AM11
AN10
AN11
817 g24
b34 844
AB30
af31
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AA10
Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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EP20K600C
652-Pin
672-Pin
020-Pin
AA10
AE10
AF10
AG10
AJ10
AK10
AF31
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PDF
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TEXTOOL
Abstract: land pattern BGA 0,50 3M 2380
Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm
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TS-9100-06
TEXTOOL
land pattern BGA 0,50
3M 2380
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CE51484
Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.
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CG/CE46
CG/CE51
S-19176
ASIC-TB-20033-9/95
CE51484
micron 100 ball BGA
BGA256
BGA 256 PACKAGE power dissipation
CG51114
BGA352
BGA576
CE51364
CG51284
BGA-576
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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PDF
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AG10
Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
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020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
AG10
AJ10
AK10
b3640
b1333
B10-301
B9432
b12123
B8528
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PDF
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V54C3128
Abstract: LA5A6
Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
LA5A6
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PDF
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MSAB
Abstract: No abstract text available
Text: MOSEL VITELIC V54C3128 16/80/40 4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
MSAB
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PDF
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B8530
Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
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020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
B8530
OAH29
B13101
AG10
AJ10
B10-276
B8472
B1370
B3640
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PDF
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LA5A6
Abstract: V54C3128
Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3
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V54C3128
128Mbit
LA5A6
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PDF
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AA10
Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA
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Original
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EP20K200E
208-Pin
240-Pin
484-Pin
356-Pin
652-Pin
672-Pin
AA10
AA23
E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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F33 1067
Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6
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EP20K1500C
652-Pin
020-Pin
F33 1067
1010 817 f15
AA10
AM11
AN10
837 B34
AM3 940
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