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    BGA 441 Search Results

    BGA 441 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    BGA 441 Price and Stock

    Renesas Electronics Corporation UPD78F0441GB-GAH-AX

    8-bit Microcontrollers - MCU 8BIT MCU 78K0/LX3 16K LFQFP64 -40TO85C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics UPD78F0441GB-GAH-AX
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    BGA 441 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan
    26x26 15X15 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers


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    W3630A U4154A 5990-3179EN PDF

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


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    EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


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    C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    XC95216-20PQG160I

    Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
    Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but


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    XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500 PDF

    EIA-364 65A

    Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
    Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •


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    8-1773444-1-CC LH-PDF-07/06 EIA-364 65A lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-441-11-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 441-11-005 21 X 21


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    C17200) 64-56A 64-22A/31A 65-17A PDF

    E2677A

    Abstract: No abstract text available
    Text: W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address


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    W2635A W2636A W2635A JESD79-3C) 5989-7643EN E2677A PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-441-11-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 441-11-005 21 X 21 # Of Pins Mill-Max Part Number 441 587-10-441-11-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


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    C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


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    1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296 PDF

    Untitled

    Abstract: No abstract text available
    Text: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2


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    W2630 signal69 5989-5964EN PDF

    AH35

    Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
    Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    EP20K1000C 652-Pin 672-Pin 020-Pin AH35 AA10 AM11 AN10 AN11 817 g24 b34 844 AB30 af31 PDF

    AA10

    Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
    Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    EP20K600C 652-Pin 672-Pin 020-Pin AA10 AE10 AF10 AG10 AJ10 AK10 AF31 PDF

    TEXTOOL

    Abstract: land pattern BGA 0,50 3M 2380
    Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm


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    TS-9100-06 TEXTOOL land pattern BGA 0,50 3M 2380 PDF

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


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    CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576 PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


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    025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    AG10

    Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
    Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    020-Pin 672-Pin TRACEPKT10 TRACEPKT11 AG10 AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528 PDF

    V54C3128

    Abstract: LA5A6
    Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3


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    V54C3128 128Mbit LA5A6 PDF

    MSAB

    Abstract: No abstract text available
    Text: MOSEL VITELIC V54C3128 16/80/40 4(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3


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    V54C3128 128Mbit MSAB PDF

    B8530

    Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
    Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    020-Pin 672-Pin TRACEPKT10 TRACEPKT11 B8530 OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 PDF

    LA5A6

    Abstract: V54C3128
    Text: MOSEL VITELIC V54C3128 16/80/40 4V(BGA) 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4 PRELIMINARY 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3


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    V54C3128 128Mbit LA5A6 PDF

    AA10

    Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA


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    EP20K200E 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


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    PDF

    F33 1067

    Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
    Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6


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    EP20K1500C 652-Pin 020-Pin F33 1067 1010 817 f15 AA10 AM11 AN10 837 B34 AM3 940 PDF