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    BGA-176 WEIGHT Search Results

    BGA-176 WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA-176 WEIGHT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DDR3 DIMM 240 pinout

    Abstract: DDR3 DIMM 240 clock layout DDR3 layout TI DDR3 layout dimm pcb layout DDR3 pcb layout DDR3 pcb layout guidelines ddr3 rdimm 244 pin layout DDR3 sdram pcb layout guidelines SN74SSQE32882ZALR
    Text: SN74SSQE32882 www.ti.com . SCAS857A – MARCH 2008 – REVISED OCTOBER 2008 28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST


    Original     		PDF SN74SSQE32882 SCAS857A 28-BIT 56-BIT SSTE32882 DDR3 DIMM 240 pinout DDR3 DIMM 240 clock layout DDR3 layout TI DDR3 layout dimm pcb layout DDR3 pcb layout DDR3 pcb layout guidelines ddr3 rdimm 244 pin layout DDR3 sdram pcb layout guidelines SN74SSQE32882ZALR

    DDR3 DIMM 240 pinout

    Abstract: DDR3-1066 DDR3-1333 SN74SSQE32882 SN74SSQE32882ZALR ddr3 rdimm 244 pin layout DDR3 pcb layout guidelines TE32882E
    Text: SN74SSQE32882 www.ti.com . SCAS857 – MARCH 2008 28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST


    Original     		PDF SN74SSQE32882 SCAS857 28-BIT 56-BIT DDR3 DIMM 240 pinout DDR3-1066 DDR3-1333 SN74SSQE32882 SN74SSQE32882ZALR ddr3 rdimm 244 pin layout DDR3 pcb layout guidelines TE32882E

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    LCD 320X240

    Abstract: FJDL675021-02 XA21
    Text: お客様各位 資料中の「沖電気」「ＯＫＩ」等名称の OKI セミコンダクタ株式会社への変更について 2008 年 10 月 1 日を以って沖電気工業株式会社の半導体事業は OKI セミコン ダクタ株式会社に承継されました。 従いまして、本資料中には「沖電気工業株


    Original     		PDF FJDL675021-02 ML675021 CMOS32 64MHz 64MHz 176pin LCD 320X240 FJDL675021-02 XA21

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA43A TSB43CA42

    Untitled

    Abstract: No abstract text available
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA42

    ARM7 interfacing

    Abstract: No abstract text available
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA42 ARM7 interfacing

    Untitled

    Abstract: No abstract text available
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA43A TSB43CA42

    IEC60958

    Abstract: IEC61883-4 TSB43CA42 TSB43CA42GGW TSB43CA42PGF TSB43CA43A TSB43CB43A
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA43A TSB43CA42 IEC60958 IEC61883-4 TSB43CA42GGW TSB43CA42PGF TSB43CB43A

    Untitled

    Abstract: No abstract text available
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA42

    IEC60958

    Abstract: IEC61883-4 TSB43CA42 TSB43CA42GGW TSB43CA42PGF TSB43CA43A TSB43CB43A
    Text: TSB43CA43A TSB43CB43A TSB43CA42 www.ti.com SLLA211 – JUNE 2006 iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution FEATURES • • • • 1394 Features – Integrated 400 Mbps 3-port PHY – Compliant with IEEE 1394-1995 and IEEE 1394a-2000 standards


    Original     		PDF TSB43CA43A TSB43CB43A TSB43CA42 SLLA211 1394a-2000 TSB43CA43A TSB43CA42 IEC60958 IEC61883-4 TSB43CA42GGW TSB43CA42PGF TSB43CB43A

    TE32882E

    Abstract: DDR3 DIMM pinout TE32882 DDR3 pcb layout DDR3 sdram pcb layout guidelines SSTE32882 dimm pcb layout DDR3 DIMM 240 pinout
    Text: SN74SSQE32882 www.ti.com . SCAS857A – MARCH 2008 – REVISED OCTOBER 2008 28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST


    Original     		PDF SN74SSQE32882 SCAS857A 28-BIT 56-BIT SSTE32882 TE32882E DDR3 DIMM pinout TE32882 DDR3 pcb layout DDR3 sdram pcb layout guidelines dimm pcb layout DDR3 DIMM 240 pinout

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A

    Sis 968

    Abstract: EPF10K100GC503-4 EPM7160 Transition altera TTL library EPF6024AQC208 EPM7128 EPLD epm7192 PL-BITBLASTER PLMG7192-160 PLMQ7192/256-160NC
    Text: Newsletter for Altera Customers ◆ First Quarter ◆ February 1998 Altera’s 3.3-V ISP-Capable MAX 7000A Devices In recent years, an increasing number of engineers have moved their designs to a 3.3-V supply voltage environment. See Figure␣ 1. However, because the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TM September 2013 • Freescale 32-bit Body Legacy • MPC5510/Fado/Bolero Family of Products • Next Gen Body Market Trends and Challenges • MPC5748G Body Control Module/Gateway Family TM 2 • Freescale is a Leader in the 32-bit body MCU space − Three


    Original     		PDF 32-bit MPC5510/Fado/Bolero MPC5748G MPC5510 16/32bi MPC574xG AUT-T0502 AUT-T0526 AUT-T0503

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 7, 05/2013 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • • • • • • • • • • • • • • • Single issue, 32-bit CPU core complex e200z0h


    Original     		PDF MPC5607B MPC5607B 32-bit e200z0h) 16-bit

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 8, 04/2014 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • • • • • • • • • • • • • Single issue, 32-bit CPU core complex e200z0h


    Original     		PDF MPC5607B MPC5607B 32-bit e200z0h) 16-bit

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"