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    BOND WIRE CU BGA Search Results

    BOND WIRE CU BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MP-5XRJ11PPXS-014 Amphenol Cables on Demand Amphenol MP-5XRJ11PPXS-014 Flat Silver Satin Modular Crossed wiring Cable, RJ11 / RJ11 14ft Datasheet
    MP-64RJ4528GB-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GB-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Blue 3ft Datasheet
    MP-64RJ4528GG-014 Amphenol Cables on Demand Amphenol MP-64RJ4528GG-014 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Green 14ft Datasheet
    MP-64RJ4528GR-007 Amphenol Cables on Demand Amphenol MP-64RJ4528GR-007 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Red 7ft Datasheet
    MP-64RJ4528GY-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GY-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Yellow 3ft Datasheet

    BOND WIRE CU BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    KE-G1250

    Abstract: KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800
    Text: Pericom Semiconductor Corp. • 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 10-04 Means of Distinguishing Changed Devices: Date Issued: September 10, 2010 Product Mark Product(s) Affected: PI7C8150x (see affected part number list)


    Original     		PI7C8150x KE-G1250 PD-2016 MS-034B/AAF-1 256-Pin, KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800 PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    TCR500

    Abstract: SiCr wire bond 60k4
    Text: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.


    Original     		S-PMC00M107-N TCR500 SiCr wire bond 60k4 PDF

    3S110

    Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
    Text: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.


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    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 PDF

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G PDF

    BGA 23X23

    Abstract: 324PBGA 324 PBGA 23x23 22X22 23X23 PBGA 23X23 Solder Balls
    Text: 324 PBGA / TEPBGA Wire Bond Daisy Chain Test Board and Package Traces: Looking Through Package and at Test Board Perimeter Balls 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 A B C D E Common F G H J K L M N P Thermal Balls R T U V W Y AA AB Slide 1


    Original     		22x22 23x23 Defined24 BGA 23X23 324PBGA 324 PBGA 23x23 PBGA 23X23 Solder Balls PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		DS550R PDF

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


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    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576 PDF

    Untitled

    Abstract: No abstract text available
    Text: Cypress Semiconductor Product Qualification Report QTP# 99256 VERSION 1.0 September, 2000 Robo Clock II High-Speed Multi-Phase PLL Buffer Clock B53D-3 Technology, Fab 1 CY7B993V CY7B994V 12 – 100 MHZ Output Frequency operation 24 – 185 MHZ Output Frequency operation


    Original     		B53D-3 CY7B993V CY7B994V CY7B993/CY7B994 N1942384 CY7B994V-AC 30C/60% CY7B993V-AC PDF

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: Freescale process 0.18 um CMOS parameters tepbga-2
    Text: Platform SoC Quarter 2, 2006 SG1015Q22006 Rev 0 Platform SoC OVERVIEW FREESCALE DESIGN SERVICES Freescale Semiconductor offers highly integrated, customized System - on - Chip SoC solutions for the printing and imaging, broadband, network and multimedia markets. The


    Original     		SG1015Q22006 SG1015Q22006 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Freescale process 0.18 um CMOS parameters tepbga-2 PDF

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF

    CDA 194

    Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
    Text: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.


    Original     		D2863-77, CDA 194 jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108 PDF

    Freescale process

    Abstract: 0.18 um CMOS parameters SG1015-3
    Text: SemiCustom/SoC Quarter 3, 2005 SG1015Q32005 Rev 0 SemiCustom/SoC OVERVIEW FREESCALE DESIGN SERVICES Freescale Semiconductor offers SemiCustom as well as highly integrated, customized System - on - Chip SoC solutions for the printing and imaging, broadband, network and


    Original     		SG1015Q32005 SG1015Q32005 Freescale process 0.18 um CMOS parameters SG1015-3 PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    TSMC 0.35um

    Abstract: tsmc 0.18um Intersil marking code TSMC 0.25Um vanguard 0.35Um tsmc 0.18-um utac qfn TSMC 90nm TW6818-LA1-GR
    Text: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the


    Original     		TW6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR 1-888-INTERSIL TSMC 0.35um tsmc 0.18um Intersil marking code TSMC 0.25Um vanguard 0.35Um tsmc 0.18-um utac qfn TSMC 90nm PDF

    entek Cu-56

    Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
    Text: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The


    Original     		PDF

    TSMC 0.18Um

    Abstract: No abstract text available
    Text: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the


    Original     		6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR 1-888-INTERSIL TSMC 0.18Um PDF

    gold metal detectors

    Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


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