Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1210 Oct-97 9643 C1 HYUNDAI DL728002AAC 3.0µ OX/NI 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Bake, 125°C, 24 Hr
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Oct-97
DL728002AAC
DS1210
P-20676
P-20755
P-20756,
P-20809
P-20810
P-20811
C/100%
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P21096
Abstract: 208-MIL P2075
Text: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1
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DS1000M-25
DS1000
DD711504ABA
P20931
P20962
P21300
P21353
P21354
P21355
P21356
P21096
208-MIL
P2075
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h 9740
Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320
Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS
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DS2250
DS2290
P21100
P20430
DS80320
P20461
h 9740
dallas date code ds12887
P21256
9735 h
P21490
P2070
P22149
B1 9742
dallas date code
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DS80320
Abstract: P21091
Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153Q A7 DEC.'97 P21120 9730 ANAM-KOREA AICL DN718550AAE 44 PIN PLCC 48 233 DS2153Q A7 MAR '98 P22292
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DS2153Q
P21120
P22292
DN718550AAE
DN720030AAB
P21171
DS80320
P21091
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