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    p15890

    Abstract: P-16100 P-15830 P-15890 p1565 DK53 dk52 C19517 P1537 P-16400
    Text: RELIABILITY MONITOR SUMMARY DATA STRESS: PRODUCT DS21S07A DS21S07A DS21S07A DS21S07A DS21S07A DS80C320 DS1302 DS1302 DS1302 DS1302 DS1302 DS1302 DS21S07A DS80320 DS80320 Burn-in 125°C, 7.0 V. 6.0 V. DS1302 MONITOR DATE JOB NO. Mar-95 May-95 Jul-95 Sep-95


    Original     		PDF Mar-95 May-95 Jul-95 Sep-95 Nov-95 Jan-95 p15890 P-16100 P-15830 P-15890 p1565 DK53 dk52 C19517 P1537 P-16400

    Untitled

    Abstract: No abstract text available
    Text: RMP TRENDS CUMULATIVE DATA DS1000 125°C, 7.0 V 0.40% 10 8 6 0.20% 4 HV. Life, 1000 hrs 0.10% 2 Inf. Life, 48 hrs 0.00% May-95 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Jul-95 Sep-95 Feb-96 May-96 Aug-96 CUMULATIVE DATA DS1232 125°C, 7.0 V 0.40% HV. Life, 1000 hrs


    Original     		PDF DS1000 May-95 Jul-95 Sep-95 Feb-96 May-96 Aug-96 DS1232 Nov-95 Jan-96

    Untitled

    Abstract: No abstract text available
    Text: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 0.40% 15 HV. Life, 1000 hrs 12 Inf. Life, 48 hrs 9 0.20% 6 0.10% Start Dec 95 Data Limited 3 0.00% Jun-96 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Sep-96 Dec-96 Mar-97 Jun-97 Sep-97 CUMULATIVE DATA DS1000 125°C, 7.0 V


    Original     		PDF DS232A Jun-96 Sep-96 Dec-96 Mar-97 Jun-97 Sep-97 DS1000 May-96 Aug-96

    Untitled

    Abstract: No abstract text available
    Text: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 1.20% 32 0.90% 24 Inf. Life, 48 hrs 0.60% 0.30% 16 Start Dec 95 Data Limited HV/L Fits 60% Cf I/L % Def 90% Cf HV. Life, 1000 hrs 8 0.00% Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 CUMULATIVE DATA DS1000 125°C, 7.0 V


    Original     		PDF DS232A Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 DS1000 Sep-95 Feb-96 May-96

    Untitled

    Abstract: No abstract text available
    Text: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 1.20% 24 Start Dec 95 Data Limited HV. Life, 1000 hrs Inf. Life, 48 hrs 0.60% 16 0.30% 8 0.00% Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 HV/L Fits 60% Cf I/L % Def 90% Cf 0.90% 32 Mar-97 CUMULATIVE DATA DS1000 125°C, 7.0 V


    Original     		PDF DS232A Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 Mar-97 DS1000 Sep-95 Feb-96

    P2272

    Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
    Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)


    Original     		PDF DS1210S DN801581AAC P22330 P22398 P22690 P22728 P22729 P22730 P22731 P2272 P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q

    74 HTC 192

    Abstract: DS2165Q
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA HOUR99 DS87C520 DN825394AAB J-STD-020 30C/60% 74 HTC 192 DS2165Q

    dn729

    Abstract: P2254 P22154 P22264 P22328 P2252
    Text: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)


    Original     		PDF DS1210S DS1210 DN738347AAA P21776 P22233 P22310 P22312 P22230 P22309 P22311 dn729 P2254 P22154 P22264 P22328 P2252

    dallas ds1280

    Abstract: DS80320 DS1280 DS1283 DS1384 DS2148 DS2151 DS80C320 DS83C520 DS89C420
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 9/7/00 PRODUCT CHANGE NOTICE – I000702 Subject: Assembly Site Change – 44 pin TQFP Description of Change:


    Original     		PDF I000702 DS1280 DS1384 DS2151 DS80320 DS80C320 DS83C520 DS89C420 DS1283 DS2148 dallas ds1280 DS80320 DS1280 DS1283 DS1384 DS2148 DS2151 DS80C320 DS83C520 DS89C420

    Ablebond

    Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC


    Original     		PDF B70302 8361J DS1212 DS2012 DS1284 DS2130 DS1285 DS2141 DS2009 DS2143 Ablebond ABLEBONd 84-1 Ablebond 8361J DS83520 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130

    P21096

    Abstract: 208-MIL P2075
    Text: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		PDF DS1000M-25 DS1000 DD711504ABA P20931 P20962 P21300 P21353 P21354 P21355 P21356 P21096 208-MIL P2075

    P22328

    Abstract: P22157 p22230 mar 9746
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292


    Original     		PDF DS2153 DS2153Q P22294 P22292 P22556 DN725561AAB DN720030AAB DN733468AAB P22328 P22157 p22230 mar 9746

    DS87520

    Abstract: P2305 P23855
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855

    P22157

    Abstract: P21637 9744 P2220 P22200 P22123 208mil
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292


    Original     		PDF DS2153 DS2153Q P22294 P22292 DN725561AAB DN720030AAB DS1302 DS1315 DS17485 P22157 P21637 9744 P2220 P22200 P22123 208mil

    P22243

    Abstract: DS1267E DN7-36 P22154 P21256
    Text: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		PDF DS1000M-25 DS1000 DD740614ABA P21467 P21488 P21893 P21964 P21965 P21966 P21967 P22243 DS1267E DN7-36 P22154 P21256

    DS1620 C2

    Abstract: 9814 DS1621 P22328 DS2165Q
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti


    Original     		PDF DM821478AIB DS2502 P23041 DS2153Q P23108 P22556 DN811539AAB DN733468AAB DS2108 DS1620 C2 9814 DS1621 P22328 DS2165Q

    DM92

    Abstract: DM-92 472E-06
    Text: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT


    Original     		PDF DS1232L DL829603AAC DM92 DM-92 472E-06

    DS87520

    Abstract: dm8304 P2271 DS2165Q
    Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1232L DL817678ABB P22755 P22778 J-STD-020 DS87520 DN825394AAB DS87C520 P23306 dm8304 P2271 DS2165Q

    DS1235YW

    Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
    Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885


    Original     		PDF DS87520 DS87523 DS87530 DS2118 DS1302 DS1315 DS17485 DS1721 DS83CH20 DS1235YW ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A

    P2215

    Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS


    Original     		PDF DS2250T P22125 DS1210 DS1210S P2215 P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403

    h 9740

    Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS


    Original     		PDF DS2250 DS2290 P21100 P20430 DS80320 P20461 h 9740 dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code

    P22518

    Abstract: mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -55 TO 125°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA AICL DN801581AAC 16 PIN SOIC 300 40 DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA (AICL)


    Original     		PDF DS1210S DS1232L DS1232S DS1233 DS1233Z P22518 mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q

    P21256

    Abstract: P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS


    Original     		PDF DS2250T P22125 DS1000 DS1210 P21256 P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308

    Untitled

    Abstract: No abstract text available
    Text: RMP TRENDS CUMULATIVE DATA DS1000 125°C, 7.0 V 0.40% 10 8 6 0.20% 4 HV. Life, 1000 hrs 0.10% 2 Inf. Life, 48 hrs 0.00% May-95 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Jul-95 Sep-95 Feb-96 May-96 Aug-96 CUMULATIVE DATA DS1232 125°C, 7.0 V 0.40% HV. Life, 1000 hrs


    Original     		PDF DS1000 May-95 Jul-95 Sep-95 Feb-96 May-96 Aug-96 DS1232 Nov-95 Jan-96