toshiba toggle mode nand
Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit
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64M128M
66MHz
100MHz
200MHz)
500/600MHz
800MHz
400MHz
800MHz)
X16/X18X32
PhotoPC550
toshiba toggle mode nand
TC518128
TC518129
TC551001 equivalent
551664
TC518512
sgs-thomson power supply
Toggle DDR NAND flash
jeida 38 norm
APPLE A5 CHIP
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upd23c8000
Abstract: upd4502161 uPD23C8000X uPD4504161 *D431016 uPD23C16000
Text: MENU INDEX QUESTIONNAIRE Dynamic RAM Dynamic RAM Module Static RAM Mask ROM Flash Memory COMBO Memory MCP Flash memory and SRAM Application Specific Memory Users Manual, Application Notes, Information Related References MENU Synchronous DRAM 128M synchronous DRAM -PC100 compliant64M synchronous DRAM -PC100 compliant64M synchronous DRAM (x32) -PC100 compliant16M synchronous DRAM (Revision A)
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-PC100
compliant64M
compliant16M
168-pin
16-bit,
upd23c8000
upd4502161
uPD23C8000X
uPD4504161
*D431016
uPD23C16000
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xdr rambus
Abstract: xdr elpida
Text: XDR DRAM 8x16Mx4 Advance Information Overview XDR DRAM CSP x4 Pinout The 512Mb Rambus XDR DRAM device is a CMOS DRAM organized as 128M words by 4 bits. The use of Differential Rambus Signaling Level DRSL technology permits 4000/ 3200/2400 Mb/s transfer rates while using conventional system and board design technologies. XDR DRAM devices are
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8x16Mx4
512Mb
DL-0211
xdr rambus
xdr elpida
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H660
Abstract: MC100H660 MC10H660
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 4-Bit ECL/TTL Load Reducing DRAM Driver The MC10H/100H660 is a 4–bit ECL input, translating DRAM address driver, ideally suited for driving TTL compatible DRAM inputs from an ECL system. It is designed for use in high capacity, highly interleaved DRAM
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MC10H/100H660
DL122
MC10H660/D*
MC10H660/D
H660
MC100H660
MC10H660
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p2v56s
Abstract: No abstract text available
Text: 256Mb Synchronous DRAM Specification P2V56S20BTP P2V56S30BTP P2V56S40BTP Deutron Electronics Corp. 8F, 68, SEC. 3, NANKING E. RD., TAIPEI 104, TAIWAN, R. O. C. TEL : 886-2-2517-7768 FAX : 886-2-2517-4575 http: // www.deutron.com.tw 256Mb Synchronous DRAM 256Mb Synchronous DRAM
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256Mb
P2V56S20BTP
P2V56S30BTP
P2V56S40BTP
216-WORD
608-WORD
p2v56s
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Untitled
Abstract: No abstract text available
Text: HY57V28420HC 4Banks x 8M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V28420HC is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V28420HC is organized as 4banks of
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HY57V28420HC
HY57V28420HC
728bit
608x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: HY57V1294020 4Banks x 8M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V1294020 is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V1294020 is organized as 4banks of
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HY57V1294020
HY57V1294020
728bit
608x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: HY57V1294020 4Banks x 8M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V1294020 is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V1294020 is organized as 4banks of
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HY57V1294020
HY57V1294020
728bit
608x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: HY57V1294020 4Banks x 8M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V1294020 is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V1294020 is organized as 4banks of
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HY57V1294020
HY57V1294020
728bit
608x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: HY57V28420A 4Banks x 8M x 4bits Synchronous DRAM DESCRIPTION The Hyundai HY57V28420A is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V28420A is organized as 4banks of
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HY57V28420A
HY57V28420A
728bit
608x4.
400mil
54pin
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RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
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BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
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MT4C4256
Abstract: No abstract text available
Text: MT4C4256 883C 256K x 4 DRAM AUSTIN SEMICONDUCTOR, INC. DRAM 256K x 4 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATION PIN ASSIGNMENT Top View • SMD 5962-90617 • MIL-STD-883 20-Pin DIP (D-8) 20-Pin LCC FEATURES • Industry standard pinout and timing
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MT4C4256
MIL-STD-883
20-Pin
175mW
512-cycle
DS000014
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XDR Rambus
Abstract: 8x4Mx16
Text: XDR DRAM 8x4Mx16/8/4/2 Overview XDR DRAM CSP x16 Pinout The Rambus XDR™ DRAM device is a general-purpose highperformance memory device suitable for use in a broad range of applications, including computer memory, graphics, video, and any other application where high bandwidth and low
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8x4Mx16/8/4/2
512Mb
DL-0476
XDR Rambus
8x4Mx16
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HY57V28420AT-H
Abstract: No abstract text available
Text: HY57V28420A 4Banks x 8M x 4bits Synchronous DRAM DESCRIPTION The Hynix HY57V28420A is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V28420A is organized as 4banks of 8,388,608x4.
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HY57V28420A
HY57V28420A
728bit
608x4.
400mil
54pin
HY57V28420AT-H
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HY57V56420A
Abstract: No abstract text available
Text: HY57V56420A 4 Banks x 16M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V56420A is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V56420A is organized as 4banks of 16,777,216x4.
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HY57V56420A
HY57V56420A
456bit
216x4.
400mil
54pin
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HY57V28420AT-H
Abstract: 8MX4
Text: HY57V28420A 4Banks x 8M x 4bits Synchronous DRAM DESCRIPTION The Hynix HY57V28420A is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V28420A is organized as 4banks of 8,388,608x4.
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HY57V28420A
HY57V28420A
728bit
608x4.
400mil
54pin
HY57V28420AT-H
8MX4
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Untitled
Abstract: No abstract text available
Text: HY57V56420AT 4 Banks x 16M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V56420A is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V56420A is organized as 4banks of 16,777,216x4.
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HY57V56420AT
HY57V56420A
456bit
216x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: HY57V56420 4Banks x 16M x 4Bit Synchronous DRAM DESCRIPTION The Hyundai HY57V56420 is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V56420 is organized as 4 banks of
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HY57V56420
HY57V56420
456bit
216x4.
400mil
54pin
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 4 -B it ECL/TTL Load R educing DRAM D river The MC10H/100H660 is a 4-bit ECL input, translating DRAM address driver, ideally suited for driving TTL compatible DRAM inputs from an ECL system. It is designed for use in high capacity, highly interleaved DRAM
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MC10H/100H660
DL122
MC10H660
MC100H660
300pF
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IR3203
Abstract: LR3000
Text: Chapter 4 LR3203 DRAM Controller This chapter describes the LR3203 DRAM Controller. Chapter 4 is orga nized into these sections: • General Description ■ Concepts ■ Configuring the LR3203 ■ Signal Definitions ■ L-Bus Interface ■ DRAM Configurations
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LR3203
LR32D04
IR3203
LR3000
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C1A13
Abstract: LR3000 DRAM controller dram memory 256kx4 lad2 5v LB03 LR3202A LR3203 LR3205 LR32D04
Text: Chapter 4 LR3203 DRAM Controller This chapter describes the LR3203 DRAM Controller. Chapter 4 is orga nized into these sections: • General Description ■ Concepts ■ Configuring the LR3203 ■ Signal Definitions ■ L-Bus Interface ■ DRAM Configurations
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LR3203
LR3203
LR32D04
C1A13
LR3000
DRAM controller
dram memory 256kx4
lad2 5v
LB03
LR3202A
LR3205
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Untitled
Abstract: No abstract text available
Text: MICRON TECHNOLOGY INC Ì7E ß • blllSMT MICRON ■ 00D17Sñ'0 MT4C4256 883C HitMXOC.Y WC MILITARY DRAM 256K X 4 DRAM FAST PAGE MODE DRAM AVAILABLE AS MILITARY SPECIFICATION PIN ASSIGNMENT Top View • SM D (consult factory for reference number) 20U300 DIP
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00D17Sñ
MT4C4256
20U300
175mW
T-46-23-17
MIL-STD-883
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Untitled
Abstract: No abstract text available
Text: SMJ55166 262144 BY 16-BIT MULTIPORT VIDEO RAM SGMS0S7C - APRIL 1998 - REVISED JUNE 199? Organization: - DRAM: 262144 Words x 16 Bits - SAM: 256 Words x 16 Bits Dual-Port Accessibility - Simultaneous and Asynchronous Access From the DRAM and SAM Ports Data-Transfer Function From the DRAM to
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SMJ55166
16-BIT
SGMS057C
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Untitled
Abstract: No abstract text available
Text: AUSTIN SEMICONDUCTOR, INC. AS4C4256 883C 256 X 4 DRAM 256K x 4 DRAM DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATION SMD 5962-90617 MIL-STD-883 PIN ASSIGNMENT Top View 20-Pin LCC FEATURES Industry standard pinout and timing All inputs, outputs and clocks are fully TTL
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OCR Scan
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AS4C4256
MIL-STD-883
20-Pin
175mW
12-cycle
4C4256
DS000014
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PDF
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