copper wire s.w.g 22
Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D
Text: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.
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EN29454.
EN29454
18swg
22swg
PG/0412
copper wire s.w.g 22
swg copper wire
EN29454
EN29453
swg copper wire datasheet
22 swg copper wire
Halide
43C501D
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EN29453
Abstract: bar led 68011 EN294
Text: SOLDERING SOLID SOLDER BARS WAVE / FLOW LEAD-FREE EXTRUDED SOLDER Solid bars of high purity lead-free extruded solder alloy, each polythene protected, with a choice of alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars.
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45E501A
45E102C
PG/0526
EN29453
bar led
68011
EN294
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EN29453
Abstract: EN29454 Halide soldering wire
Text: SOLDERING HAND SOLDER WIRES, Flux-cored NO CLEAN / LOW RESIDUE FLUX A solder wire using a high purity 60/40 tin/lead alloy employing a reduced level typically 1% of non-corrosive, halide-free flux to EN29454. Leaves a negligible residue on the pcb thereby eliminating
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EN29454.
EN29453
EN29454
EN29454,
EN29453
EN29454
Halide
soldering wire
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EN29453
Abstract: 20swg 68011 22swg Rosin Activated Core Wire
Text: SOLDERING SOLDER WIRES, Flux-cored HAND GENERAL PURPOSE High purity solder wire carefully formulated to meet the exacting standards of the UK manufacturing industry. Suitable for all general electronic assembly work and precision applications. 60/40 tin/lead alloy with non-corrosive rosin flux available in single core or multiple core 4 core .
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EN29453
EN29453
20swg
68011
22swg
Rosin Activated Core Wire
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GR-78-CORE
Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased
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MP200
ANSI/J-STD-004
GR-78-CORE
J-STD-005
multicore solder paste
GR78-CORE
GR-78-CORE PCB
solder powder
J-STD-004 paste
J-STD-004 MSDS
bellcore GR-78
MCF800
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EN29453
Abstract: 680102 68010 183C
Text: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin
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45A50ns.
45A501A
45A102C
EN29453,
45B501A
45B102C
EN29453
680102
68010
183C
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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GR-78-CORE
Abstract: No abstract text available
Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and
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WS200â
June-2009
GR-78-CORE
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