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Catalog Datasheet	MFG & Type	Document Tags	PDF
copper wire s.w.g 22 Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D Text: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.	Original	EN29454. EN29454 18swg 22swg PG/0412 copper wire s.w.g 22 swg copper wire EN29454 EN29453 swg copper wire datasheet 22 swg copper wire Halide 43C501D	PDF
EN29453 Abstract: EN29454 Halide soldering wire Text: SOLDERING HAND SOLDER WIRES, Flux-cored NO CLEAN / LOW RESIDUE FLUX A solder wire using a high purity 60/40 tin/lead alloy employing a reduced level typically 1% of non-corrosive, halide-free flux to EN29454. Leaves a negligible residue on the pcb thereby eliminating	Original	EN29454. EN29453 EN29454 EN29454, EN29453 EN29454 Halide soldering wire	PDF
IPC-SF-818 Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC Text: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue	Original	C400TM October-2009 C400TM IPC/J-STD-004 IPC-SF-818 SAC387 SAC305 SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC	PDF
SAC387 Abstract: IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS Text: Technical Data Sheet C502 December-2009 PRODUCT DESCRIPTION C502 provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium • No clean • Clear residue	Original	December-2009 IPC/J-STD-004 SAC387 IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS	PDF
SAC387 solder Abstract: SAC387 Text: Technical Data Sheet C400 April-2011 PRODUCT DESCRIPTION C400 provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue	Original	April-2011 IPC/J-STD-004 SAC387 solder SAC387	PDF
IPC-SF-818 Abstract: SAC387 SAC387 solder Text: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue	Original	October-2009 IPC/J-STD-004 IPC-SF-818 SAC387 SAC387 solder	PDF