copper wire s.w.g 22
Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D
Text: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.
|
Original
|
PDF
|
EN29454.
EN29454
18swg
22swg
PG/0412
copper wire s.w.g 22
swg copper wire
EN29454
EN29453
swg copper wire datasheet
22 swg copper wire
Halide
43C501D
|
EN29453
Abstract: EN29454 Halide soldering wire
Text: SOLDERING HAND SOLDER WIRES, Flux-cored NO CLEAN / LOW RESIDUE FLUX A solder wire using a high purity 60/40 tin/lead alloy employing a reduced level typically 1% of non-corrosive, halide-free flux to EN29454. Leaves a negligible residue on the pcb thereby eliminating
|
Original
|
PDF
|
EN29454.
EN29453
EN29454
EN29454,
EN29453
EN29454
Halide
soldering wire
|
IPC-SF-818
Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC
Text: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
|
Original
|
PDF
|
C400TM
October-2009
C400TM
IPC/J-STD-004
IPC-SF-818
SAC387
SAC305
SAC387 solder
J-STD-004 MSDS
EN29454-1
TR-NWT-000078
Multicore SOLDER
Multicore 96SC
|
SAC387
Abstract: IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS
Text: Technical Data Sheet C502 December-2009 PRODUCT DESCRIPTION C502 provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium • No clean • Clear residue
|
Original
|
PDF
|
December-2009
IPC/J-STD-004
SAC387
IPC-SF-818
J-STD-004 solder wire rom1
C502
Multicore 96SC
J-STD-004 sn60
henkel solder
TR-NWT-000078
SAC387 solder
J-STD-004 MSDS
|
SAC387 solder
Abstract: SAC387
Text: Technical Data Sheet C400 April-2011 PRODUCT DESCRIPTION C400 provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
|
Original
|
PDF
|
April-2011
IPC/J-STD-004
SAC387 solder
SAC387
|
IPC-SF-818
Abstract: SAC387 SAC387 solder
Text: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue
|
Original
|
PDF
|
October-2009
IPC/J-STD-004
IPC-SF-818
SAC387
SAC387 solder
|