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    Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1690B00

    Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 169R
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    Mouser Electronics MF0W8FF1690B00 3,000
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    Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1692B00

    Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 16.9K
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    Mouser Electronics MF0W8FF1692B00 1,000
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    Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1691B00

    Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 1.69K
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    Mouser Electronics MF0W8FF1691B00
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    Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1691A10

    Metal Film Resistors - Through Hole 250 mW (1/4 W) 1% 1.69K
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    Mouser Electronics MF0W4FF1691A10
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    Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1692A10

    Metal Film Resistors - Through Hole 250 mW (1/4 W) 1% 16.9K
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics MF0W4FF1692A10
    • 1 -
    • 10 -
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    FF169 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PK065

    Abstract: No abstract text available
    Text: R FF1696: Plastic Flip-Chip BGA Package PK065 v1.0 October 30, 2002 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF FF1696: PK065 PK065

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    Untitled

    Abstract: No abstract text available
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit FF1148) FF1517) FF1696) DS083-4

    Untitled

    Abstract: No abstract text available
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.3 November 20, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit DS083-4

    QF32

    Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
    Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)


    Original     		PDF TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176

    AB38R

    Abstract: tag l9 225 400 XC2VP20 XC2VP50
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on


    Original     		PDF DS083-1 18-bit and255-7778 DS083-4 AB38R tag l9 225 400 XC2VP20 XC2VP50

    xc2vp1257

    Abstract: 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.2 September 27, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four Rocket I/O™ embedded


    Original     		PDF DS083-1 18-bit XC2VP30, FF1152 DS083-4 xc2vp1257 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50

    vhdl code for uart communication

    Abstract: XC2VP50
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit FG676 XC2VP20, XC2VP30, XC2VP40. FF1517 vhdl code for uart communication XC2VP50

    vhdl code for uart communication

    Abstract: XC2VP50 XC2VP70 FF1704 pinout
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit DS083-4 vhdl code for uart communication XC2VP50 XC2VP70 FF1704 pinout

    ra1613

    Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
    Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations


    Original     		PDF 210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27

    Untitled

    Abstract: No abstract text available
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on


    Original     		PDF DS083-1 18-bit

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    cmos 556 timer

    Abstract: powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG
    Text: ` 8 Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v3.1.1 March 9, 2004 Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty RocketIO™ embedded multi-gigabit


    Original     		PDF DS083-1 18-bit cmos 556 timer powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    apple ipad schematic drawing

    Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller
    Text: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG012 apple ipad schematic drawing xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller

    XC2VP70 FF1704 pinout

    Abstract: XC2VP20-FF896 FG25 vhdl code for uart communication vhdl code for 8-bit calculator XC2VP50
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit DS083-4 XC2VP70 FF1704 pinout XC2VP20-FF896 FG25 vhdl code for uart communication vhdl code for 8-bit calculator XC2VP50

    verilog hdl code for uart

    Abstract: XC2VP70 FF1704 pinout XC2VP50
    Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 March 9, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics


    Original     		PDF DS083 DS083-1 DS083-3 Des05/19/03 DS083-4 verilog hdl code for uart XC2VP70 FF1704 pinout XC2VP50

    Virtex-II Pro xc2vp70ff1517

    Abstract: XC2VP70 FF1704 pinout RXRECCLK
    Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 April 22, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics


    Original     		PDF DS083 DS083-1 DS083-3 Des05/19/03 DS083-4 Virtex-II Pro xc2vp70ff1517 XC2VP70 FF1704 pinout RXRECCLK

    Virtex-II Pro xc2vp50ff1152

    Abstract: XC2VP50 250v ACE 69 XC2VP30 IOL29 ultra fine pitch BGA DS083 FF1148 FF672 FG676
    Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 February 19, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics


    Original     		PDF DS083 DS083-1 DS083-3 DS083-4 Virtex-II Pro xc2vp50ff1152 XC2VP50 250v ACE 69 XC2VP30 IOL29 ultra fine pitch BGA FF1148 FF672 FG676

    XC3S1000-FT256

    Abstract: XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676
    Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15µm structured ASIC • Platform for high-performance 1.5V/1.2V ASICs and FPGA-to-ASIC conversions • NRE and production cost savings • Significant time-to-market advantages


    Original     		PDF 210MHz 500MHz 332kbits 18kbit 330MHz XC3S1000-FT256 XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676

    Untitled

    Abstract: No abstract text available
    Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 September 10, 2003 Advance Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics


    Original     		PDF DS083 DS083-1 DS083-3 DS083-4

    RSN 310 R37

    Abstract: Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T
    Text: Virtex-5 FPGA Packaging and Pinout Specification UG195 v4.6 May 5, 2009 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG195 RSN 310 R37 Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T