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YAGEO Corporation AC1206FR-075R1L Thick Film Resistors - SMD 5.1 Ohms 250 mW 1206 1% AEC-Q200 Standard Power Version
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	AC1206FR-075R1L	Reel			15,000	1 - 10 - 100 - 1000 - 10000 -	Buy Now
TE Connectivity Y8963 Antennas YAGI,FWG,3,896-970MH z,
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	Y8963	Each			4	1 - 10 $112.37 100 $96.39 1000 $96.39 10000 $96.39	Buy Now

G3896 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	PDF	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
49BV040 Abstract: CDIP32 ATMEL CDIP 6G9645 7G9740 6g964 Text: PAGE 1 OF 11 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-49BV040 FLASH MEMORY RELIABILITY DATA - 150°C DYNAMIC OPERATING LIFETEST - 200°C RETENTION BAKE - 125°C OPERATING LIFETEST (PLASTIC) - 150°C RETENTION BAKE (PLASTIC) - 15 PSIG PRESSURE POT	Original	PDF	AT-49BV040 AT-49BV040 6H2447-2 6H2449-7 7G1090-26 7G1040B-26 6H9704 7G9723 7G9724 49BV040 CDIP32 ATMEL CDIP 6G9645 7G9740 6g964
sac 326 Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要	Original	PDF	PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
G43-87 Abstract: G3896 Text: 作成：前回作成： 2001 年 4 月 1998 年 7 月パッケージインフォメーション第 5 章パッケージの熱抵抗本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 5 章部分とな	Original	PDF	G42-96 G38-96 G42-96 G43-87 G3896
QFP160-P-2828-0 Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE	Original	PDF
SMD IC 2025 bl Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 Text: J2T0011-38-60 まえがき平素は「沖半導体製品」を御愛用いただき厚く御礼申し上げます。エレクトロニクス分野におきましては半導体製品の応用はますます広がりをみせており、その性能機	Original	PDF	J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
G43-87 Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0 Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要	Original	PDF	PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0