Untitled
Abstract: No abstract text available
Text: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and
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WED3C7410E16MC-XBHX
7410E
7410E/SSRAM
WED3C7410E16M-XBX,
WED3C7558M-XBX
WED3C750A8M-200BX
WED3C7410E16MC-XBHX
63Pb/37SN)
63Sn/37Pb)
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WED3C7410E16MC-XBHX
Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
Text: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited
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WED3C7410E16MC-XBHX
7410E
WED3C7410E16MC-XBHX
7410E/SSRAM
16Mbits
200MHz
7410E
WED3C7410E16M-XBX
WED3C750A8M-200BX
WED3C7558M-XBX
90Pb
WED3C7410E16MC
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PDF
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7410E
Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
Text: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited
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WED3C7410E16M-XBHX
7410E
WED3C7410E16M-XBHX
7410E/SSRAM
400MHz
450MHz
16Mbits
200MHz
WED3C7410E16M-XBX
WED3C750A8M-200BX
WED3C7558M-XBX
90Pb10Sn
block diagram of automatic flush system
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:
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WED3C755E8M-XBHX
755E/SSRAM
WED3C755E8M-XBHX
128Kx72
21mmx25mm,
300MHz/
150MHz,
350MHz/175MHz)
66MHz
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PDF
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7410
Abstract: 7410E WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola
Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache
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7410E
WED3C7410E16M-XBHX*
256Kx72
25x21mm,
625mm2
352mm2
1329mm2
525mm2
x64/x72
7410
WED3C7410E16M-XBHX
WED3C750A8M-200BX
WED3C7558M-XBX
90Sn10Pb
63SN 37PB
CBGA 255 motorola
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PDF
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Untitled
Abstract: No abstract text available
Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache
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7410E
WED3C7410E16M-XBHX*
256Kx72
625mm2
352mm2
1329mm2
525mm2
x64/x72
WED3C7410HITCE
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PDF
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Untitled
Abstract: No abstract text available
Text: WED3C755E8MC-XBHX 755E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and
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Original
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WED3C755E8MC-XBHX
755E/SSRAM
WED3C7558MC-XBX
WED3C755E8MC-XBHX
128Kx72
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PDF
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WED3C755E8MF
Abstract: 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX
Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:
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WED3C755E8M-XBHX
755E/SSRAM
WED3C755E8M-XBHX
WED3C755E8MF
90Pb
WED3C750A8M-200BX
WED3C7558M-XBX
WED3C755E8MF-XBX
WED3C755E8M-XBX
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entek Cu-56
Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.
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20ppm/
5989-0834EN
AV02-0769EN
entek Cu-56
bga thermal cycling reliability
Solder Paste, Indium, Type 3
pcb warpage* in smt reflow
Solder Paste Indium reflow process control
BGA Solder Ball 1mm
BGA PACKAGE thermal profile
BGA cte
BGA Ball Crack
JEDEC SMT reflow profile
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PDF
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TEA 2025 equivalent
Abstract: atmel 528 24 c01 abb main switch ABB 14 11 09 Tag 225 600 replacement TMS 320 C 6X processor datasheet JESD51-2 TSPC603R atmel part marking c08
Text: Features • • • • • • • Superscalar 3 Instructions per Clock Peak Dual 16 KB Caches Selectable Bus Clock 32-bit Compatibility PowerPC Implementation On-chip Debug Support Nap, Doze and Sleep Power Saving Modes Device Offered in Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255
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32-bit
SPECint95,
SPECfp95
64-bit
5410B
TSPC603R
TEA 2025 equivalent
atmel 528 24 c01
abb main switch
ABB 14 11 09
Tag 225 600 replacement
TMS 320 C 6X processor datasheet
JESD51-2
TSPC603R
atmel part marking c08
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C7410E16M-400BHXX RISC Microprocessor HiTCE Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BHXX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is
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WED3C7410E16M-400BHXX
7410E/SSRAM
WED3C7410E16M-400BHXX
7410E
256Kx72
21mmx25mm,
400MHz
200MHz
100MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C755E8M-XBHX ADVANCED* 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:
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WED3C755E8M-XBHX
755E/SSRAM
WED3C755E8M-XBHX
128Kx72
21mmx25mm,
300MHz/
150MHz,
350MHz/175MHz)
66MHz
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PDF
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BGA PROFILING
Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.
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20ppm/
AV02-0768EN
BGA PROFILING
BGA Ball Crack
OSP FLIPCHIP CRACK
pcb warpage after reflow
0711m
BGA PACKAGE thermal profile
expansion joint
JEDEC SMT reflow profile
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PDF
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7410E
Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
Text: White Electronic Designs WED3C7410E16M-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited
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WED3C7410E16M-XBHX
7410E
WED3C7410E16M-XBHX
7410E/SSRAM
7410E
133MHz
WED3C7410E16M-XBX
WED3C750A8M-200BX
WED3C7558M-XBX
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PDF
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HITCE
Abstract: No abstract text available
Text: HITCE Package Electrical Parameters Application Bulletin 101 Purpose This document provides Resistance, Inductance and Capacitance RLC estimates for High Thermal Coefficient of Expansion (HITCE) packages. Printed circuit board designers may use these numbers to
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5988-6281EN
HITCE
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radix-8 FFT
Abstract: DBGA KD 472 M mov CMAC A15B2 sc sf 12A H4 17ER CI23 honeywell hx3000 HX3000
Text: DSP Architectures RHDSP24 Radiation Hardened Scalable DSP Chip Transform Your WorldTM Data Sheet Real 24 PORT A Imag 24 RHDSP24 Imag 24 24 24 X INPU TB US Y INPUT BU S O U TP U TB US 24 48 Imag 24 Scheduler/ Controller X Y Memory A 24 Memory B 24 System Controls
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RHDSP24
RHDSP24-Y-75-M
DSPA-RHDSP24DS
radix-8 FFT
DBGA
KD 472 M mov
CMAC
A15B2
sc sf 12A H4
17ER
CI23
honeywell hx3000
HX3000
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hirel
Abstract: tkf 912
Text: PC7410 PowerPC 7410 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • • • 22.8 SPECint95 estimated , 17SPECfp95 at 500 MHz (estimated) 917MIPS at 500 MHz Selectable Bus Clock (14 CPU Bus Dividers Up To 9x)
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PC7410
SPECint95
17SPECfp95
917MIPS
64-bit
32-bit
F-91572
0832G
hirel
tkf 912
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PDF
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PC7448
Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)
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PC7448
MPx/60x
64-bit
36-bit
Hz/166
0814D
microprocessor
DIODE 921
LGA PACKAGE thermal resistance Freescale
powerpc 7448
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PDF
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microprocessor
Abstract: G172
Text: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)
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PC755/745
1SPECint95,
SPECfp95
PC755)
7SPECint95,
9SPECfp95
PC745)
64-bit
microprocessor
G172
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PDF
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PC8640
Abstract: openpic
Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)
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PC8640
PC8640D
Dual-e600
125Gbaud)
64-bit
0948C
openpic
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PDF
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pc2ad
Abstract: powerpc dhrystone
Text: PC8548E PowerQUICC III Integrated Processor Datasheet - Preliminary Specification Features • Embedded e500 Core, Initial Offerings up to 1.2 GHz • • • • • • • • • • • • • • • • • – Dual Dispatch Superscalar, 7-stage Pipeline Design with out-of-order Issue and
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PC8548E
36-bit
Cache-32
Cache-512
KB/256
KB/128
KB/64
0831B
pc2ad
powerpc dhrystone
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PDF
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PC8540
Abstract: microprocessor
Text: PC8540 Integrated Processor Datasheet - Preliminary Specification Features • Embedded e500 Book E-compatible Core Available up to 833 MHz • • • • • • • • • – 32-bit, Dual-issue, Superscalar, Seven-stage Pipeline – 1850 MIPS at 800 MHz Est. Dhrystone 2.1
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PC8540
32-bit,
64-bit,
0881B
PC8540
microprocessor
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PDF
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0828H
Abstract: No abstract text available
Text: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)
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PC755/745
1SPECint95,
SPECfp95
PC755)
7SPECint95,
9SPECfp95
PC745)
64-bit
0828H
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PDF
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pci slot pinout
Abstract: e2v GTX 120 PC8640
Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)
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PC8640
PC8640D
Dual-e600
125Gbaud)
64-bit
Chan49
0948E
pci slot pinout
e2v GTX 120
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PDF
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