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    FD040H02A5P

    Abstract: MIL-HDBK-263 S1025 for IR hexfet die
    Text: Bulletin I0164J FD040H02A5F FRED Die in Wafer Form z z z 200V VF = 1.0V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VRRM IRM trr RthJC


    Original     		PDF I0164J FD040H02A5F 12-Mar-07 FD040H02A5P MIL-HDBK-263 S1025 for IR hexfet die

    MIL-HDBK-263

    Abstract: S1025
    Text: Bulletin I0164J 09/04 FD100N06A5B FRED Die in Wafer Form z 600V VF = 1.1 V max. 5" Wafer 100% Tested at Probe (*) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter VFM VFM VRRM IRM Description Maximum Forward Voltage Maximum Forward Voltage


    Original     		PDF I0164J FD100N06A5B 12-Mar-07 MIL-HDBK-263 S1025