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    IRGC75 Price and Stock

    Infineon Technologies AG IRGC75B60UB

    IGBT CHIP
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    Infineon Technologies AG IRGC75B60KB

    IGBT CHIP
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    Infineon Technologies AG IRGC75B120UB

    IGBT CHIP
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    IRGC75 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IRGC75B120KB International Rectifier IGBT Original PDF
    IRGC75B120UB International Rectifier IGBT Original PDF
    IRGC75B120UKB International Rectifier Die in Wafer Form Scan PDF

    IRGC75 Datasheets Context Search

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    IRGC75B120KB

    Abstract: 0443 IC HA-1370S
    Text: PD - 93872 IRGC75B120KB Die in Wafer Form Features • • • • • 1200V IC nom = 75A VCE(on) typ.= 2.1 V @ IC(nom) @ 25°C Motor Control IGBT Short Circuit Rated 150mm Wafer C GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10µs Short Circuit Capability


    Original     		PDF IRGC75B120KB 150mm IRGC75B120KB 0443 IC HA-1370S

    IRGC75B120UB

    Abstract: No abstract text available
    Text: PD - 93871 IRGC75B120UB Die in Wafer Form Features • • • • • G Benefits • • • • 1200V IC nom =75A VCE(on) typ.= 3.1V @ IC(nom) @ 25°C UltraFast IGBT Short Circuit Rated 150mm Wafer C GEN5 Non Punch Through (NPT) Technology UltraFast 10µ s Short Circuit Capability


    Original     		PDF IRGC75B120UB 150mm 20KHz IRGC75B120UB

    Untitled

    Abstract: No abstract text available
    Text: PD - 94617 IRGC75B60KB Die in Wafer Form Features • • • • • GEN5 Non Punch Through NPT Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient • • • • Benchmark Efficiency for Motor Control Applications


    Original     		PDF IRGC75B60KB 150mm

    IRGC75B60

    Abstract: IRGC75 5646
    Text: PD - 94656 HF75E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR Benefits • • • • • • Benchmark Efficiency for UPS and Welding Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF75E060ACE 125mm 12-Mar-07 IRGC75B60 IRGC75 5646

    IRG41BC20W

    Abstract: IRG41BC20UD Drive circuit for IGBT using IR2130 IR2184 application notes IR2110 driver CIRCUIT FOR INVERTERS DC MOTOR SPEED CONTROL USING IGBT IRG41BC30W IR2181 application notes IR2103 bldc driver 1KW dc motor
    Text: TABLE OF CONTENTS Selection Guides Fast Diode Die Data Sheets FRED Die Data Sheets HEXFET Power MOSFET Die Data Sheets HEXFRED® Rectifier Die Data Sheets IC Data Sheets IGBT Die Data Sheets IGBT Modules for Motor Drive & UPS IGBT Modules for Motor Drives in Industrial Electric Vehicles


    Original     		PDF O-220 IR2130 230VAC IR2133 460VAC IR2233 IR2137/IR2171 IRG41BC20W IRG41BC20UD Drive circuit for IGBT using IR2130 IR2184 application notes IR2110 driver CIRCUIT FOR INVERTERS DC MOTOR SPEED CONTROL USING IGBT IRG41BC30W IR2181 application notes IR2103 bldc driver 1KW dc motor

    HA-1370S

    Abstract: HF70D120ACE IRGC75B120KB hexfred gen3
    Text: PD - 93878 HF70D120ACE Hexfred Die in Wafer Form Features • • • • • GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF70D120ACE 125mm 12-Mar-07 HA-1370S HF70D120ACE IRGC75B120KB hexfred gen3

    Untitled

    Abstract: No abstract text available
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF 125mm HF75D060ACE IRGC75B60K

    HA-1370S

    Abstract: IRGC75B120KB HF70D120ACE
    Text: PD - 93878 HF70D120ACE Hexfred Die in Wafer Form Features • • • • • GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF70D120ACE 125mm IRGC75B120KB HA-1370S IRGC75B120KB HF70D120ACE

    IRGC75B60K

    Abstract: IRGC75B60 9381-8
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF75D060ACE 125mm 12-Mar-07 IRGC75B60K IRGC75B60 9381-8

    IRGC75B120UB

    Abstract: No abstract text available
    Text: PD - 93871 IRGC75B120UB In te rn a tio n a l R ectifier Die in Wafer Form Features 1200V • GEN5 Non Punch Through NPT Technology • Ultra Fast • 10 |js Short Circuit Capability • Square RBSOA • Positive V C E(on) Temperature Coefficient lc(nom )- 7 5 A


    OCR Scan     		PDF 20KHz IRGC75B120UB 150mm IRGC75B120UB