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    Infineon Technologies AG IRGC75B60UB

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    Infineon Technologies AG IRGC75B60KB

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    IRGC75B60 Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: PD - 94617 IRGC75B60KB Die in Wafer Form Features • • • • • GEN5 Non Punch Through NPT Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient • • • • Benchmark Efficiency for Motor Control Applications


    Original     		PDF IRGC75B60KB 150mm

    IRGC75B60

    Abstract: IRGC75 5646
    Text: PD - 94656 HF75E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR Benefits • • • • • • Benchmark Efficiency for UPS and Welding Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF75E060ACE 125mm 12-Mar-07 IRGC75B60 IRGC75 5646

    Untitled

    Abstract: No abstract text available
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF 125mm HF75D060ACE IRGC75B60K

    IRGC75B60K

    Abstract: IRGC75B60 9381-8
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF75D060ACE 125mm 12-Mar-07 IRGC75B60K IRGC75B60 9381-8