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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: a WF1M 32B-XXX5 WHITE /MICROELECTRONICS 1Mx325V/12V FLASH MODULE PRELIMINAR/* FEATURES • Access Times of 100,120ns Organized as 1Mx32, user configurable as 2Mx16 or4Mx8. ■ Commercial, Industrial and Military Temperature Ranges Packaging: • 66-pin, PGA Type, 1.185 inch square, Hermetic


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    32B-XXX5 1Mx325V/12V 120ns 1Mx32, 2Mx16 V/12V 32B-XG2TX5 32B-XHX5 66-pin, 5/12V) PDF

    WF1M32-XXX

    Abstract: No abstract text available
    Text: a WF1M32-XXX WHITE /MICROELECTRONICS 1Mx3212V FLASH MODULE, SMD 5962-94613 FEATURES • Access Times of 100,150ns ■ Organized as 1Mx32, user configurable as 2Mx16 or 4Mx8. ■ ■ Cbmmerdal, Industrial and Military Temperature Fknges F&ckaging: • 66-pi n, FGA Type, 1.385 i nch square, Hermetic


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    WF1M32-XXX 1Mx3212V 150ns 1Mx32, 2Mx16 66-pi JEDEC68 01HXX 100ns WF1M32-XXX PDF

    Untitled

    Abstract: No abstract text available
    Text: a WSF128K32V-XG2TX WHITE /MICROELECTRONICS 128Kx32 SRAM/FLASH 3.3V MODULE ADVANCED* FEATURES FLASH M EM ORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Access Times of 25ns (SRAM ) and 90ns (FLASH) ■ • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square


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    WSF128K32V-XG2TX 128Kx32 120ns 120ns PDF

    WF1M32B-XXX3

    Abstract: No abstract text available
    Text: a WF1M32B-XXX3 WHITE /MICROELECTRONICS 1Mx323.3V FLASH M O DULE PRELIMINARY* FEATURES • Access Times of 100,120, 150ns ■ F&ckaging • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP(G2T), 4.6mm (0.180 inch)


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    WF1M32B-XXX3 1Mx323 WF1M32B-XG2TX3 WF1M32B-XHX3 150ns 66-pin, WF1M32B-XXX3 PDF

    smd 1aw

    Abstract: pm o2 pin detail I01b-1
    Text: a WS512K32-XXX WHITE MICROELECTRONICS 512Kx32SRAM MODULE, SMD 5962-94611 P R E L IM IN A R /* FEATURES • ■ ■ ■ ■ Commercial, Industrial and M ilitary Temperature Flanges TTLCom patible Inputs and Outputs 5 Volt Power Supply Low Power CM OS Built-in Decoupling Caps and M ultiple Ground Pins for L:w


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    WS512K32-XXX 512Kx32SRAM 512Kx32, 05HYX 07HYX 08HYX 09HYX smd 1aw pm o2 pin detail I01b-1 PDF