land pattern BGA 0.75
Abstract: land pattern BGA 0,50 FBGA 63 flip chip
Text: BGA LAND PATTERN DIMENSIONS b2 b e e b2 Unit : mm Land Pattern Dimensions Pin pitch e 1.50 P-BGA 0.63 P-BGA (Flip Chip type) P-BGA(C/D) (Advanced type) P-FBGA P-FBGA (Flip Chip type) T-BGA (TAB type) T-FBGA (Wire type) Land dimeter φ b 2 1.27 1.00 0.80
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pitch 0.75mm BGA
Abstract: BOX21151 LS-BGA54C-61
Text: Tooling hole X2 BGA54C 3.75mm [0.148"] See BGA pattern code to the right for actual pattern layout Y 6.00mm [0.236"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern
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BGA54C
FR4/G10
LS-BGA54C-61
BOX21151
pitch 0.75mm BGA
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bga48
Abstract: BOX21151 LS-BGA48N-61 pitch 0.75mm BGA
Text: Tooling hole X2 BGA48N 5.25mm [0.207"] See BGA pattern code to the right for actual pattern layout Y 3.75mm [0.148"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern
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BGA48N
FR4/G10
LS-BGA48N-61
BOX21151
bga48
pitch 0.75mm BGA
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BGA Package 0.35mm pitch
Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
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CH-1072
BGA Package 0.35mm pitch
E-tec Interconnect
.65mm bga land pattern
1072 Diode, SMD
3M Touch Systems
bpw 50
TEC Driver
8 pin ic base socket round pin type lead
qualitek
BGA reflow guide
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SF-BGA255A-B-11
Abstract: No abstract text available
Text: D SF-BGA255A-B-11 C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X Top View reference only 19.05mm [0.750"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"] [0.210"]
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SF-BGA255A-B-11
FR4/G10
SF-BGA255A-B-11
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sm 0038
Abstract: SF-BGA256B-B-11
Text: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA256B
FR4/G10
SF-BGA256B-B-11
sm 0038
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16X16
Abstract: SF-BGA256F-B-11
Text: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA256F
16X16
SF-BGA256F-B-11
16X16
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16X19
Abstract: SF-BGA303A-B-11
Text: D Package Code: BGA303A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 22.86mm [0.900"] X Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1 3 Top View: Recommended PCB Layout
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BGA303A
16X19
SF-BGA303A-B-11
16X19
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sm 0038
Abstract: SF-BGA252A-B-11
Text: D Package Code: BGA252A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA252A
FR4/G10
SF-BGA252A-B-11
sm 0038
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1.27mm pitch zif socket 3M 21X21
Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •
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SK-MGAxx/xxxx-03
SK-MGAxx/xxxx-01
SK-MGAxx/xxxx-02
MGA10/100A-
1.27mm pitch zif socket 3M 21X21
1155 lga socket pins
17X17* BGA 289
1155 lga socket
PGA zif socket 289
amp bga 25x25
BGA169C
TEXTOOL 15x15 pga
Am29040
BGA432
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LS-BGA860A-41
Abstract: No abstract text available
Text: Top View 0.75mm [0.030"] 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
42x42
LS-BGA860A-41
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LS-BGA1704A-41
Abstract: No abstract text available
Text: Top View 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
42x42
LS-BGA1704A-41
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LS-BGA1696A-41
Abstract: No abstract text available
Text: Top View 42.50mm [1.673"] 0.75mm [0.030"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
42x42
LS-BGA1696A-41
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LS-BGA625C-61
Abstract: No abstract text available
Text: Top View 21mm [0.827"] 0.9mm [0.035"] 0.9mm [0.035"] 21mm [0.827"] 0.8mm typ. 19.2mm square [0.756"] 1 3.52mm [0.139"] 2 1.68mm [0.066"] 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non
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FR4/G10
25x25
LS-BGA625C-61
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land pattern BGA 0.75
Abstract: BGA reflow guide BGA and CSP bo 137
Text: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus
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96GKE/114GKF
com/design/flcomp/packdata/297846
land pattern BGA 0.75
BGA reflow guide
BGA and CSP
bo 137
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Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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AN10343
Solder Paste, Indium 5.8
SOT996-2
VSSOP8
MICROPAK XX
SOT103
WLCSP stencil design
J-STD-020D
SOT996
sot1049
XQFN10U
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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AN-1126
Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
Text: Table of Contents Introduction . 2 Package Overview . 3
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AN-1126
AN-1126
AN-1205
land pattern BGA 0.75
TMCL ACLV
MO-151
fbga Substrate design guidelines
bga Shipping Trays
pcb warpage after reflow
Epoxy, glass laminate
gold embrittlement
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samtec ASP
Abstract: ASP-65067-01 LA-BGA92D-DDR2-SDRAM-01 LS-BGA92D-61 land pattern BGA 0.75 0.8mm pitch BGA Mictor
Text: 30.00mm [1.181"] Top View 11.00mm 35.00mm [1.378"] 19.00mm 1 DDR IC not included Side View SMT interface 3.25mm [0.128"] LS-BGA92D-61 (Sold separately) 2 3 1 4.67mm [0.184"] assembled 2 11.00mm Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"]
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LS-BGA92D-61
63Sn37Pb
FR4/G10
LS-BGA92D-61
LA-BGA92D-DDR2-SDRAM-01
LA-BGA92D-DDR2-SDRAM-01
samtec ASP
ASP-65067-01
land pattern BGA 0.75
0.8mm pitch BGA
Mictor
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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SF-BGA256B-B-05
Abstract: No abstract text available
Text: 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"] 0-80 Threaded Insert
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725mm
FR4/G10
Sn63Pb37
00lating.
SF-BGA256B-B-05
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SF-BGA256B-B-05F
Abstract: No abstract text available
Text: RoHS COMPLIANT 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"]
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725mm
FR4/G10
SF-BGA256B-B-05F
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BGA reflow guide
Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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