MO-205
Abstract: LFBGA180
Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U
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LFBGA180:
OT697-1
MO-205
MO-205
LFBGA180
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LFBGA180
Abstract: 11-90 MO-151 sot622
Text: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K
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LFBGA180:
OT622-1
MO-151
LFBGA180
11-90
MO-151
sot622
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA180
OT697-1
OT697-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm A B D SOT785-1 ball A1 index area A E A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C T R P e N M L K J e2 H G 1/2 e F E D C B A ball A1
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LFBGA180:
OT785-1
MO-205
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MO-205
Abstract: LFBGA180
Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N
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Original
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PDF
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LFBGA180:
OT622-1
OUT180
MO-205
MO-205
LFBGA180
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; 12 x 12 x 1 mm A B D SOT933-1 ball A1 index area E A2 A A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C P N M e L K J H e2 G 1/2 e F E D C B A ball A1 index area
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Original
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PDF
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LFBGA180:
OT933-1
MO-205
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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PDF
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LFBGA180
OT622-1
OT622-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm B D SOT785-2 A ball A1 index area A2 A E A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P e N M L K J H G F E D C B A ball A1 index area
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LFBGA180:
OT785-2
MO-205
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V U e T R P N M L e2 K J H 1/2 e G F E D C
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Original
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PDF
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LFBGA180:
OT697-1
MO-205
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1
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LFBGA180:
OT622-1
OT6221
MO-205
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MO-205
Abstract: sot785
Text: PDF: 2002 Oct 02 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm A B D SOT785-1 ball A1 index area A E A2 A1 detail X C e1 e 1/2 ∅v M b e ∅w M y1 C C A B C y T R
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LFBGA180:
OT785-1
MO-205
MO-205
sot785
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MO-151
Abstract: sot697
Text: PDF: 2001 May 04 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A V U T R e P
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LFBGA180:
OT697-1
MO-151
MO-151
sot697
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ym 6631
Abstract: carrier ahu USB ethernet bridge usb to parallel IEEE1284 centronics diagram M1284H uart baud rate spear CP15 IEEE1284 MAC110 SPEAR-07-NC03
Text: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■
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SPEAR-07-NC03
ARM720T
IEEE802
12Mbit/s
115KBaud
LFBGA180
12x12x1
IEEE1284
12x12mm
25MHz
ym 6631
carrier ahu
USB ethernet bridge
usb to parallel IEEE1284 centronics diagram
M1284H
uart baud rate spear
CP15
MAC110
SPEAR-07-NC03
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BF 178 TO-39 CASE connection
Abstract: bit3111 RWR-79 BAX22
Text: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■
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SPEAR-07-NC03
ARM720T
IEEE802
12Mbit/s
115KBaud
IEEE1284
25MHz
48MHz
LFBGA180
BF 178 TO-39 CASE connection
bit3111
RWR-79
BAX22
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LDR 7MM
Abstract: blf 178 carrier ahu ARM720T CP15 IEEE1284 M1284H MAC110 SPEAR-07-NC03 SF 129 C
Text: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■
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Original
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PDF
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SPEAR-07-NC03
ARM720T
IEEE802
12Mbit/s
115KBaud
LFBGA180
12x12x1
IEEE1284
12x12mm
25MHz
LDR 7MM
blf 178
carrier ahu
ARM720T
CP15
M1284H
MAC110
SPEAR-07-NC03
SF 129 C
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