cq837
Abstract: No abstract text available
Text: 4J« *- »t TOSHIBA HYBRID D IG ITA L INTcGRATED CIRCUIT INTEGRATED CIRCUIT TO SHIBA THM 364080AS THM 364080ASG TECHNICAL DATA - 60. 70. 80, 10 - 60, 70, 80. 10 TENTATIVE DATA 4*194,304 W O R D S X 36 BIT D YN AM IC RA M MODULE DESCRIPTION The THM364080AS/ASG is a 4,194,304 words by 36 bits dynamic RA M module which assembled 36
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364080AS
364080ASG
THM364080AS/ASG
TC514100ASJ
364080ASG
A0-A10
THM36408QAS
THM364080AS
THM364080ASG
cq837
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KMM366S403BTN-G2
Abstract: KMM366S403BTN-G0
Text: KMM366S403BTN NEW JEDEC SDRAM MODULE KMM366S403BTN SDRAM DIMM 4Mx64 SDRAM DIMM based on 2Mx8, 4K Refresh, 3.3V Synchronous DRAMs with SPD GENERAL DESCRIPTION FEATURE The Samsung KMM366S403BTN is a 4M bit x 64 Synchronous Dynamic RAM high density memory module. The Samsung
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KMM366S403BTN
KMM366S403BTN
4Mx64
400mil
168-pin
DD373b2
KMM366S403BTN-G2
KMM366S403BTN-G0
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Untitled
Abstract: No abstract text available
Text: »HYUNDAI HYM536A414B M-Series 4M X 36-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM536A414B is a 4 M x 36-bit EDO mode CMOS DRAM module consisting of nineHV5117404B in 24/26 pin SOJ on a 72 pm glass-epoxy printed circuit board. O.inF and O.OlnF decoupling capacitor is mounted for each
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HYM536A414B
36-bit
nineHV5117404B
HYM536A414BM/BSLM
HYM536A414BMG/BSLMG
A0-A10)
DQ0-DQ35)
1CE16-10-APR96
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Untitled
Abstract: No abstract text available
Text: «HYUNDAI HYM5V72A414A K-Series Unbuffered 4M x 72-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION The HYM5V72A414A is a 4M x 72-bit EDO mode CMOS DRAM module consisting of eighteen HY51V17404A in 24/26 SOJ or TSOP-II and one 2048 bit EEPROM on a 168 pin glass-epoxy printed circuit board. 0.22nFdecoupiing
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HYM5V72A414A
72-bit
HY51V17404A
22nFdecoupiing
HYM5V72A414AKG/ATKG/ASLKG/ASLTKG
010TO
nn47H
4b75Gfifl
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870Q
Abstract: mrs 751
Text: 144pin SDRAM SOD1MM KMM466S203CT KMM466S203CT SDRAM SODIMM 2Mx64 SDRAM SODIMM based on 2Mx8, 4K Refresh, 3.3V Synchronous DRAMs with SPD GENERAL DESCRIPTION FEATURE The Samsung KMM466S203CT is a 2M bit x 64 Synchronous Dynamic RAM high density memory module. The Samsung
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KMM466S203CT
KMM466S203CT
144pin
2Mx64
400mil
144-pin
870Q
mrs 751
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Untitled
Abstract: No abstract text available
Text: » H Y U N D A I H Y M 5 V 7 2 A 4 0 4 A K -S e rie s Unbuffered 4M x 72-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION Tine HYM5V72A404A is a 4M x 72-bit EDO mode CMOS DRAM module consisting of eighteen HY51V16404A in
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72-bit
HYM5V72A404A
HY51V16404A
2048bit
22nFdecoupling
HYM5V72A404AKG/ATKG/ASLKG/ASLTKG
03g4/-o
331MIN.
1EC07-10-JAN96
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Untitled
Abstract: No abstract text available
Text: •H Y U N D A I HYM564414A K-Series Unbuffered 4M x 64-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION H ie HYM564414A is a 4M x 64-bit EDO mode CMOS DRAM module consisting of sixteen HY5117404A in 24/26 pin SOJ or TSOP-II and one 2048 bit EEPROM on a 168 pin glass-epoxy printed circuit board. 0.1 nF and 0.01 nF
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HYM564414A
64-bit
HY5117404A
HYM564414AKG/ATKG/ASLKG/ASL7KG
A0-A10)
DQ0-DQ63)
1CE1S-10-APR96
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Untitled
Abstract: No abstract text available
Text: , ^ e . „ , ^ G M M 2644233D N T G 4,194,304 w ords x64bit SYNCHRONOUS DYNAMIC RAM MODULE L G o e m ic o n C o . , L t d . Description The GMM2644233DNTG is a 4M x 64bits Synchronous Dynamic RAM MODULE which is assembled 16 pieces of 2M x 8bits Synchronous DRAMs in 44 pin TSOP II
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2644233D
x64bit
GMM2644233DNTG
64bits
GMM2644233DNTG
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Untitled
Abstract: No abstract text available
Text: KMM5322000AV/AVG DRAM MODULES 2Mx32 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Perform ance range: The Samsung KMM532200QAV is a 2M bitsx32 Dynamic RAM high, density memory module. The Samsung KMM5322000AV consist of sixteen CMOS 1M x4 bit DRAMs in 20-pin SOJ package mounted on a 72-pin
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KMM5322000AV/AVG
2Mx32
KMM532200QAV
bitsx32
KMM5322000AV
20-pin
72-pin
KMM5322000AV-
150ns
180ns
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KM M 3 6 6 F 4 0 8 4 B S1 Unbuffered 4Mx64 DIMM (4Mx16 base) Revision 0.0 Dec. 1997 L££TRt»ü£S DRAM MODULE KM M 3 6 6 F 4 0 ( 8 ) 4 B S1 Re v is io n H is to ry Version 0.0 (Dec. 1997) • R em oved tw o A C p aram eters t cacp (access tim e from C A S ) and
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4Mx64
4Mx16
KMM366F40
KMM366F404BS1
-KM416V4104BS
KMM366F484BS1
-KM416V4004BS
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HYM540A100MG
Abstract: No abstract text available
Text: “H YUN D AI HYM540A100 M-Series 1M X 40-blt CMOS DRAM MODULE DESCRIPTION The HYM540A100 is a 1M x 40-bit Fast page mode CMOS DRAM module consisting of ten HY514400A in 20/26 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22pF decoupling capacitor is mounted for each DRAM.
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HYM540A100
40-blt
40-bit
HY514400A
HYM540A100M/LM
HYM540A100MG/LMG
00Q3M3S
1CC06-01-FEB94
HYM540A100MG
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ADQ37
Abstract: No abstract text available
Text: KMM466F104BT1-L KMM466F124BT1-L DRAM MODULE KM M 466F104BT1-L & KMM466F124BT1-L EDO Mode 1M x 64 DRAM SODIMM using 1Mx16, 1K/4K Refresh 3.3V, Low power/Self-Refresh GENERAL DESCRIPTION FEATURES The Samsung KMM466F10 2 4BT-L is a 1Mx64bits Dynamic RAM high density memory module. The Samsung
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KMM466F104BT1-L
KMM466F124BT1-L
466F104BT1-L
KMM466F124BT1-L
1Mx16,
KMM466F10
1Mx64bits
1Mx16bits
400mil
ADQ37
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Untitled
Abstract: No abstract text available
Text: HYM7V73AC801BTHGC 8Mx72, 8Mx8 based, PC133 DESCRIPTION The Hynix HYM7V73AC801B H-Series are 8Mx72bits ECC Synchronous DRAM Modules. The modules are composed of nine 8Mx8bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, two 18bits driver ICs in 56pln TSSOP
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HYM7V73AC801BTHGC
8Mx72,
PC133
HYM7V73AC801B
8Mx72bits
400mil
54pin
18bits
56pln
24pin
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Untitled
Abstract: No abstract text available
Text: HYM7V65801BTFG 8Mx64, 8Mx8 based, PC100 DESCRIPTION The Hynix HVM7V65801B F-Series are 8Mx64bits Synchronous DRAM Modules. The modules are composed of eight 8Mx8bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on
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HYM7V65801BTFG
8Mx64,
PC100
HVM7V65801B
8Mx64bits
400mil
54pin
168pin
HYM7V65801B
64Mbytes
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