Untitled
Abstract: No abstract text available
Text: W PS1M 36-XM SCXXX W hite El e c t r o n ic D esigns C o r p o r a t i o n 1Mx36 SRAM MODULE p r e lim in a r y * FEATURES • A cce ss Tim es of 1 5 , 1 7 , 20, 25, 35ns ■ Three S ta te Outputs. ■ Packaging ■ TTL C o m p a tib le Inputs and Outputs
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36-XM
1Mx36
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PDF
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Untitled
Abstract: No abstract text available
Text: D EN SE-PA C 8 Megabit CMOS SRAM M I C R O S Y S T E M S PS1MS8MP DESCRIPTION: The D PS1M S8M P is a IM eg x 8 high-density, low-power static RAM module comprised of two 512K x 8 monolithicSRAM's,an advanced high-speed CMOS decoder and decouplingcapacitors surface mounted on
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600-mil-wide,
32-pin
30A143-00
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PDF
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c040
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 16 Megabit High Speed C M O S SRAM 1 DPS M X 16 M K n 3 SLCC Stack D E S C R IP T IO N : The D PS1M X16M K n3 High Speed S R A M "S T A C K " modules area re volu tion ary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.
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16-Megabits
500mV
30A129-04
c040
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PDF
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Untitled
Abstract: No abstract text available
Text: 8 Megabit CMOS SRAM M I C R O S Y S T E MS PS1MS8MP DESCRIPTION: The D PS1M S8M P is a 1Meg x 6 high-density, low-power static RAM module comprised of two 512K x 8 monolithic SRAM's, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on
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600-mil-wide,
32-pin
30A143-00
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit High Speed C M O S S R A M MICROS Y STEM S PS1M X8M KN3 D E S C R IP T IO N : The D PS1M X 8M KN 3 High Speed SR A M "ST A C K " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC mounted on a co-fired
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600-mil-wide,
32-pin
30A129-12
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PDF
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PS1J
Abstract: ps1m
Text: PS1A THRU PS1M SURFACE MOUNT SUPER PLASTIC RECTIFIER VOLTAGE:50 TO 1000V CURRENT: 1.0A FEATURE GF1/DO—214BA Ideal for surface mount pick and place application Low profile package Built-in strain relief High surge capability High temperature soldering guaranteed
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/10sec/at
GF1/DO--214BA
UL-94
PS1J
ps1m
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 32 Megabit CMOS SRAM D PS1M X 32M L/D P S1M X 32M W PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The PS1M X32M L/PS1MX32MW is a 1 Meg x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high perform ance computers and digital signal processing
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L/DPS1MX32MW
DPS1MX32ML/DPS1MX32MW
DPS1MX32ML/DPS1MX32MW
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PDF
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Untitled
Abstract: No abstract text available
Text: D E N S E -P A C 32 Megabit High Speed CMOS SRAM M ICRO SYSTEM S PS1MK32MKV3 PRELIMINARY DESCRIPTION: The D PS1M K32M KV3 "V E R S A -S T A C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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DPS1MK32MKV3
30A12S-14
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 32 Megabit C M O S SRAM D P S1M X32M L/D PS1M X32M W PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The D P S 1 M X 3 2 M L /D P S 1 M X 3 2 M W is a 1 M e g x 32 high density, high-speed Static Random Access M em ory SRAM module, intended
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30A147-00
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PDF
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Untitled
Abstract: No abstract text available
Text: a M/HITE /MICROELECTRONICS 1M x36 SRAM MODULE W PS1M 36-XM SCXXX p r e lim in a r y * FEATURES • A cce ss Tim es of 17, 20, 25, 35ns ■ Three S ta te Outputs. ■ Packaging ■ TTL C o m p a tib le Inputs and Outputs • M o d u le is m a n u fa c tu re d w it h nine 1 M x 4 SR A M m em ory
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36-XM
1Mx36
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit CMOS SRAM MICROSYSTE M S DESCRIPTION: The D PS1M X 32M L/D PS1M X 32M W is a 1 Meg x 32 high density, high-speed Static Random A ccess M em ory SRAM m odule, intended for high p e rfo rm an ce co m p u te rs and d igital sig n al p ro ce ssin g
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anMX32MW
30A147-00
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PDF
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Untitled
Abstract: No abstract text available
Text: ca W PS1M32-XXC M/HITE /M IC R O E L E C T R O N IC S 1Mx32 SRAM MODULE ADVANCED ' FEATURES • A cce ss Tim es o f 17, 20, 25, 35ns ■ C om m ercial T e m p era ture Range ■ Packaging ■ TTL C om p a tib le Inputs and O utputs ■ 5 V o lt Po w e r Supply
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PS1M32-XXC
1Mx32
WPS1M32-XXC
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PDF
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PS1M
Abstract: No abstract text available
Text: a M/HITE /MICROELECTRONICS 1M x36 SRAM MODULE W PS1M 36-XM SCXXX p r e lim in a r y * FEATURES • A cce ss Tim es of 17, 20, 25, 35ns ■ Three S ta te Outputs. ■ Packaging ■ TTL C o m p a tib le Inputs and Outputs • M o d u le is m a n u fa c tu re d w it h nine 1 M x 4 SR A M m em ory
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36-XM
1Mx36
PS1M
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PDF
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Untitled
Abstract: No abstract text available
Text: ca WH ITE /M ICROELECTRONICS 1Mx32 SRAM MODULE W PS1M 32-XXC ADVANCED* FEATURES • Access Times of 17, 20, 25, 35ns ■ Commercial Temperature Range ■ Packaging ■ TTL Compatible Inputs and Outputs • Module is manufactured with eight 1Mx4 SRAM memory
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1Mx32
32-XXC
1Mx32
WPS1M32-XXC
15b3b
00Q1130
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PDF
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SH72533
Abstract: R5F72533KFPU
Text: User's Manual The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH72533 32 User’s Manual: Hardware Renesas 32-Bit RISC Microcomputer SuperHTM RISC engine Family SH72533 R5F72533KFPU
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SH72533
32-Bit
SH72533
R5F72533KFPU
SH72533D
R5F72533DKFPU
R01UH0401EJ0300
R5F72533KFPU
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PDF
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Untitled
Abstract: No abstract text available
Text: a PS1M32V-XXC M/HITE /MICROELECTRONICS 1Mx32SRAM 3.3V MODULE ADVANCED* FEATURES • ■ A ccess Tim es of 17, 20, 25, 35ns ■ C om m ercial Tem pe ratu re Range Packaging ■ T T L C o m p a tib le Inputs and O utputs • M o d u le is m a nufa cture d w ith eig h t 1M x4 SRAM m em ory
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WPS1M32V-XXC
1Mx32SRAM
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PDF
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gcu 101 setting manual
Abstract: No abstract text available
Text: User's Manual The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7724 32 User’s Manual: Hardware Renesas 32-Bit RISC Microcomputer SH7780 Series R8A7724 Cover [Portions omitted in accordance with NDA]
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SH7724
32-Bit
SH7780
R8A7724
ope00,
R01UH0174EJ0200
REJ09B0560-0100)
gcu 101 setting manual
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PDF
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CHN T4 1060
Abstract: prma 1824 MN103S AM32 MN103S00 MN103S33N AN-1998 932DM t509 r5 cpu am32
Text: MICROCOMPUTER MN103S00 MN103S33N/F33N LSI 説明書 Pub.No.23233-011 PanaXSeriesは松下電器産業株式会社の商標です。 その他記載された会社名及びロゴ、製品名などは該当する各社の商標または登録商標です。
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MICROCOMPUTERMN103S00
MN103S33N/F33N
14PWM
23ROM
CHN T4 1060
prma 1824
MN103S
AM32
MN103S00
MN103S33N
AN-1998
932DM
t509 r5
cpu am32
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PDF
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Untitled
Abstract: No abstract text available
Text: Female Header 2.54mm 1 Row H=9.50mm SMT Type Specifications Current Rate:3 AMP Insulation Resistance:1000MΩ Min. Contact Resistance:20mΩ Max. Dielectric Voltage:1000V AC for one minute Operation Temperature:-40°C to +105°C 2 3 1 2 3 A TYPE A TYPE 2.54
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1000MÎ
54xNo
PS1M95-1XX-U
PS1M95-2XX-U
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PDF
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91d6
Abstract: CHL 8266 LDR SPECIFICATION used in street light monitoring mn1a7t0200 eagle arm P2M SCR s2mc AH5p 2000404
Text: MICROCOMPUTER MN1A7 MN1A7T0200 LSI User’s Manual Pub.No.26002-0211E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks
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MN1A7T0200
26002-0211E
91d6
CHL 8266
LDR SPECIFICATION used in street light monitoring
mn1a7t0200
eagle arm
P2M SCR
s2mc
AH5p
2000404
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PDF
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MN1020012A
Abstract: MN1020012 cbx5 MN1020012AFA PS1M KI70 MN10200 sram 2dm BC10 MN102L
Text: M IC R O C O M P U T E R M N 102L00 MN1020012 LSI 説明書 Pub.No.22212-031 PanaXSeriesは松下電器産業株式会社の商標です。 その他記載された会社名及びロゴ、製品名などは該当する各社の商標または登録商標です。
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102L00
MN1020012
00FE80'
00FEFF'
MN10200
MN10200
MN1020012A
MN1020012
cbx5
MN1020012AFA
PS1M
KI70
sram 2dm
BC10
MN102L
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PDF
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PS1M
Abstract: No abstract text available
Text: □PM Dense-Pac Microsystems, Inc. PS1M S16P 1024K X 16 CM OS SRAM MODULE O DESCRIPTION: The D P S1 M S1 6 P is a 16 megabit, low-power static RA M module. The module is comprised of sixteen 128K X 8 SRA M devices and two high-speed decoders. The D PS1 M S1 6 P can
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1024K
2048K
S16XP)
500mV
DPS1MS16P
DPS1MS16XP
30A04700
PS1M
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PDF
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Untitled
Abstract: No abstract text available
Text: Female Header 2.54mm 1 Row H=8.5mm Y Contact SMT Type Material Insulator:Polyester,UL 94V-0 ˖Standard:Nylon 6T Terminal:Copper Alloy Plating:Gold Plated Specifications Current Rate:3 AMP Insulation Resistance:1000MΩ Min. Contact Resistance:20mΩ Max. Dielectric Voltage:1000V AC for one minute
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1000MÎ
PS1M85-1XX-U
PS1M85-2XX-U
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PDF
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xl 3358
Abstract: philips tea 1090 7 segment display LT 542 capacitor a475 ic tea 1090 SAB 8048 P 220 SM 590 R8A77301C266FPV TEA 1091 IC data book free download LT 542 seven segment display data sheet
Text: REJ09B0359-0100 SH7730Group 32 Hardware Manual TM SuperH Renesas 32-Bit RISC Microcomputer RISC engine Family / SH7780 Series SH7730 Rev.1.00 Revision Date: Sep. 19, 2007 R8A77301 Rev. 1.00 Sep. 19, 2007 Page ii of xlviii Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
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Original
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REJ09B0359-0100
SH7730Group
32-Bit
SH7780
SH7730
R8A77301
SH7730
xl 3358
philips tea 1090
7 segment display LT 542
capacitor a475
ic tea 1090
SAB 8048 P 220 SM 590
R8A77301C266FPV
TEA 1091
IC data book free download
LT 542 seven segment display data sheet
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PDF
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