2SB1051K
Abstract: 750H ST-100S VMN3 TSST8 lpts 2sb1051
Text: Design Support Document RECOMMENDABLE CONDITION OF SOLDERING SURFACE MOUNTED DEVICE CONDITION OF SOLDERING FOR SURFACE MOUNTED DEVICE DISCRETE TRANSISTOR LEAD FREE (Sn-3Ag-0.5Cu) VERSION CONTENTS RECOMMENDABLE CONDITION OF REFLOW SOLDERING 2/5 RECOMMENDABLE CONDITION OF FLOW SOLDERING
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R1010A
2SB1051K
750H
ST-100S
VMN3
TSST8
lpts
2sb1051
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2SC5083
Abstract: ROHM FTL 2sc4043 TO220SD TO220FN 2SC1740S 2SC1809S 2SC2058S 2SC2926S 2SC4010
Text: Design Support Document RECOMMENDABLE CONDITION OF SOLDERING LEAD TYPE TRANSISTORSUR CONDITION OF SOLDERING FOR LEAD TYPE TRANSISTOR LEAD FREE Sn-3Ag-0.5Cu VERSION CONTENTS RECOMMENDABLE CONDITION OF SOLDERING DIP 2/3 RECOMMENDABLE CONDITION OF HAND SOLDERING
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R1010A
2SC5083
ROHM FTL
2sc4043
TO220SD
TO220FN
2SC1740S
2SC1809S
2SC2058S
2SC2926S
2SC4010
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Untitled
Abstract: No abstract text available
Text: OSBDM-JM60 Users Guide Document Number: OSBDMTAPUG Rev 10.x, 9/2013 OSBDM-JM60 Users Guide, Rev. 10.x, 9/2013 2 Freescale Semiconductor, Inc. Contents Section number Title Page Chapter 1 Introduction to Open Source BDM 1.1 About the Open Source BDM
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OSBDM-JM60
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rohm 01005
Abstract: B14J rohm design support document Rohm
Text: Design Support Document IC Packages TSSOP-B14J 5.0±0.1 Max 5.35 include BURR 4º ±4º 0.5±0.15 6.4±0.2 4.4±0.1 7 1 1PIN MARK +0.05 0.145 –0.03 1.0±0.05 S 0.1±0.05 1.2MAX 0.55 1.0±0.2 8 14 0.08 S 0.65 +0.05 0.245 –0.04 0.08 M (Unit : mm) www.rohm.com
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TSSOP-B14J
R0039A
rohm 01005
B14J
rohm design support document
Rohm
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piezo DMT-1206-I
Abstract: intel FW82801AA manual hp laptop battery pinout hp laptop battery pinout definition dbx-05a dmt-1206 Intel FW82801AA gsc90031 fw82801aa ACA3216M4-060-TL
Text: Intel Pentium® III Processor/840 Development Kit Manual April 2001 Order Number: 273333-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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Processor/840
Processor/840
piezo DMT-1206-I
intel FW82801AA manual
hp laptop battery pinout
hp laptop battery pinout definition
dbx-05a
dmt-1206
Intel FW82801AA
gsc90031
fw82801aa
ACA3216M4-060-TL
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hp laptop battery pinout
Abstract: dbx-05a piezo DMT-1206-I hp laptop ac adapter schematics diagram tms 980 c136 406549-4 dmt-1206 hp 530 motherboard power supply solution FW82801AA C7L3
Text: Intel Pentium® III Processor/840 Development Kit Manual May 2000 Order Number: 273333-002 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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Processor/840
Processor/840
hp laptop battery pinout
dbx-05a
piezo DMT-1206-I
hp laptop ac adapter schematics diagram
tms 980 c136
406549-4
dmt-1206
hp 530 motherboard power supply solution
FW82801AA
C7L3
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Untitled
Abstract: No abstract text available
Text: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request
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SSOP-B16
Abstract: Rohm
Text: SSOP-B16 LSI Assembly Jisso Information • SSOP-B16 16 9 1 8 0.3Min. 1.15 ± 0.1 6.4 ± 0.3 0.10 4.4 ± 0.2 5.0 ± 0.2 0.65 0.15 ± 0.1 0.1 0.22 ± 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SSOP-B16
SSOP-B16
Rohm
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SSOP-B14
Abstract: No abstract text available
Text: SSOP-B14 LSI Assembly • SSOP-B14 1.15 ± 0.1 0.10 14 8 1 7 0.3Min. 6.4 ± 0.3 4.4 ± 0.2 5.0 ± 0.2 0.65 0.15 ± 0.1 0.10 0.22 ± 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SSOP-B14
SSOP-B14
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SSOP-B20
Abstract: No abstract text available
Text: SSOP-B20 LSI Assembly • SSOP-B20 20 11 1 10 0.65 0.22 ± 0.1 0.3Min. 6.4 ± 0.3 1.15 ± 0.1 4.4 ± 0.2 0.1± 0.1 6.5 ± 0.2 0.15 ± 0.1 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SSOP-B20
SSOP-B20
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TO220FP-5
Abstract: rohm.co jisso
Text: TO220FP-5 LSI Assembly Jisso Information • TO220FP-5 8.0 0.7 12.0 φ 3.2 7.0 1.2 0.85 13.5Min. 17.0 1.8 10.0 0.8 1.778 The contents described herein are subject to change without notice. Units : mm Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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O220FP-5
TO220FP-5
rohm.co
jisso
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Untitled
Abstract: No abstract text available
Text: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request
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QFP-A64
Abstract: No abstract text available
Text: QFP-A64 LSI Assembly • QFP-A64 16.4±0.3 14.0±0.2 32 64 17 1 0.8 16 0.5 33 49 0.05 2.7±0.1 16.4±0.3 14.0±0.2 48 0.15±0.1 0.35±0.1 0.15 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP-A64
QFP-A64
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SQFP56
Abstract: No abstract text available
Text: SQFP56 LSI Assembly • SQFP56 12.4 ± 0.3 10.0 ± 0.2 43 28 56 15 0.05 1 2.15 ± 0.1 29 0.65 14 0.3 ± 0.1 0.5 12.4 ± 0.3 10.0 ± 0.2 42 0.15 ± 0.1 0.15 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SQFP56
SQFP56
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QFP44
Abstract: No abstract text available
Text: QFP44 LSI Assembly • QFP44 14.0± 0.3 10.0± 0.2 23 34 22 44 12 1 1.2 10.0±0.2 14.0±0.3 33 11 2.15± 0.1 0.05 0.15± 0.1 S 0.8 0.15 S 0.35± 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP44
QFP44
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UQFP160
Abstract: No abstract text available
Text: UQFP160 LSI Assembly • UQFP160 22.0±0.3 20.0±0.2 81 121 80 160 41 0.5 20.0±0.2 22.0±0.3 120 40 1 0.1± 0.1 2.0± 0.1 0.15±0.1 0.4 0.15±0.1 The contents described herein are subject to change without notice. 0.08 Units : mm Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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UQFP160
UQFP160
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QFP32
Abstract: QFP-32
Text: QFP32 LSI Assembly • QFP32 9.0 ±0.3 7.0 ±0.2 17 25 16 32 9 0.4 7.0 ± 0.2 9.0 ± 0.3 24 1 8 0.05 1.45 0.15 ± 0.1 0.15 0.8 0.4 ± 0.1 The contents described herein are subject to change without notice. Units : mm Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP32
QFP32
QFP-32
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sop28
Abstract: No abstract text available
Text: SOP28 LSI Assembly • SOP28 18.5 ±0.2 15 1 14 0.3MIN 7.5± 0.2 28 0.15 ±0.1 0.11 2.2 ±0.1 9.9± 0.3 MAX 18.85 include BURR 1.27 0.4± 0.1 0.1 (Units : mm) The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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Rohm
Abstract: No abstract text available
Text: SOP14 LSI Assembly • SOP14 14 8 1 7 0.3MIN 4.4 ± 0.2 6.2 ± 0.3 8.7±0.2 MAX 9.05 include BURR 0.11 1.5 ± 0.1 0.15±0.1 1.27 0.4±0.1 The contents described herein are subject to change without notice. 0.1 (Units : mm) Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP80
Abstract: No abstract text available
Text: QFP80 LSI Assembly • QFP80 24.0±0.3 20.0±0.2 41 65 40 80 25 24 0.05 2.7±0.1 1 0.8 0.35±0.1 1.2 18.0±0.3 14.0±0.2 64 0.15±0.1 0.15 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP80
QFP80
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SQFP100
Abstract: No abstract text available
Text: SQFP100 LSI Assembly • SQFP100 24.0±0.3 20.0±0.2 51 81 50 100 31 30 0.05 2.7±0.1 1 0.65 0.3±0.1 1.2 14.0±0.2 18.0±0.3 80 0.15±0.1 0.15 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SQFP100
SQFP100
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TO-220FP-3
Abstract: TO220FP-3 rohm.co
Text: TO220FP-3 LSI Assembly Jisso Information 12.0 10.0 7.0 φ 3.2 5.0 8.0 13.5Min. 17.0 1.8 • TO220FP-3 1.3 0.8 1 2 3 2.54 The contents described herein are subject to change without notice. 2.54 Units : mm Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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O220FP-3
TO-220FP-3
TO220FP-3
rohm.co
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SSOP-B14
Abstract: No abstract text available
Text: SSOP-B14 LSI Assembly Jisso Information • SSOP-B14 1.15 ± 0.1 0.10 14 8 1 7 0.3Min. 6.4 ± 0.3 4.4 ± 0.2 5.0 ± 0.2 0.65 0.15 ± 0.1 0.10 0.22 ± 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SSOP-B14
SSOP-B14
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SSOP-B16
Abstract: No abstract text available
Text: SSOP-B16 LSI Assembly • SSOP-B16 16 9 1 8 0.3Min. 1.15 ± 0.1 6.4 ± 0.3 0.10 4.4 ± 0.2 5.0 ± 0.2 0.65 0.15 ± 0.1 0.1 0.22 ± 0.1 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SSOP-B16
SSOP-B16
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