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    Netpatibles S-C47DLC80D-NP

    SFP CWDM MODULE 1.25G 80KM
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    SC47D Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: Panasonic AN7140 5W • « W Audio Power Amplifier Circuits * A N 7140 l ì , Unit : mm ¡t°— y ~ f > V 7 :J t , 7 y 'í * - t ? K 6 ~ 16V , ^ j s L L t z m i Y t ^ h i X i ^ o Af£ < tr — :s là 9 t ’ y ■ >> 7 )V 4 s =7 'f > ■CH'ftoBon t ■


    OCR Scan     		AN7140 82Qft) PDF

    UPD4011BG

    Abstract: UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304
    Text: 目 次 1. パッケージの標準化 1.1 EIAJ規格 1.2 JEDEC規格 1.3 IEC規格 2. NECにおけるパッケージ名称 3. EIAJにおけるパッケージ・コード 3.1 パッケージ・コードの構成 4. 外形図面用照合文字と寸法表示例


    Original     		M7A98 C10535J) SC47D) SC47D NEC2070 RS481) PD4011BGT1 PD4011BG PD421000LA10E1 PD421000LA100 UPD4011BG UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304 PDF

    MIL-STD-750C

    Abstract: SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701
    Text: パッケージ動向 1-1 パッケージ実装動向 電子機器ニーズ 性能・外形・実装性の最適設計 多機能 性 高速 能 高出力 小形 外 薄形 形 軽量 実 自動化 装 システム化 性 高密度化 実装動向 パッケージ動向


    Original     		MIL-STD-202F, MIL-STD-750C MIL-STD-883E C7021 C7022 ISO14001 MIL-STD-750C SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701 PDF

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747 PDF

    BGA and QFP Package mounting

    Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
    Text: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density


    Original     		PDF

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF