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    SOLDERING PASTE Search Results

    SOLDERING PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDERING PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    washing machine circuit diagram

    Abstract: washing machine circuit circuit diagram of toshiba washing machine washing machine washing machine electric circuit WASHING machine controller rohm mcr mvr21 Ultrasonic washing washing machine control
    Text: Soldering conditions Resistors Soldering conditions for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended conditions for reflow soldering 2/5 Recommended conditions for flow soldering 2/5 Recommended conditions for manual soldering 2/5


    Original     		PDF

    TSOP8

    Abstract: liquid (WATER) Level Controller TOSHIBA GLASS MOLD water level control circuit diagram water level controller circuit diagram 750H ST-100S ROHM USD alpha 400 circuit diagrams pine alpha st-100s arakawa chemical
    Text: Soldering conditions Leaded type Diodes Condition of soldering for Leaded type Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of soldering dip 2/4 Condition of hand soldering 2/4 Tolerance range for heatproof of soldering 2/4


    Original     		PDF

    M705-GRN360-K2V

    Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V M705-GRN360 1SS376 1SS355 1SS380 750H ST-100S
    Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    washing machine circuit diagram

    Abstract: circuit diagram of toshiba washing machine washing machine electric circuit washing machine circuit washing machine toshiba 750H ESR10 MCR006 MCR01 MCR03
    Text: Soldering conditions Resistors Soldering condition for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Recommended condition of hand soldering 2/4 Recommended condition of washing


    Original     		PDF

    M705-GRN360-K2-V

    Abstract: M705-GRN360-K2V M705-GRN360 TOSHIBA GLASS MOLD M705-GRN-360-K2-V solder paste M705-GRN360-K2-V 1SS376 M705-GRN360-K2 1SS355 1SS380
    Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    M705-GRN360-K2V

    Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 1SS355 UMD2 ROHM rohm surface mounted transistor series VMD2 M705 water level controller circuit diagram
    Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    pine alpha st-100s arakawa chemical

    Abstract: 2SB1051K tssop8 package 750H ST-100S
    Text: Soldering conditions Surface mount type Transistors Condition of soldering for Surface mount type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Condition of hand soldering


    Original     		PDF

    2sc5083

    Abstract: TO220FN water level control circuit diagram to126 to126 case TO220SD water level controller circuit diagram liquid (WATER) Level Controller TO126 package TO126 transistor
    Text: Soldering conditions Leaded type Transistors Condition of soldering for Leaded type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of flow soldering 2/3 Condition of hand soldering 2/3 Tolerance range for heatproof of soldering


    Original     		PDF

    M705-GRN360

    Abstract: M705-GRN360-K2V M705-GRN360-K2-V water level control circuit diagram water level controller circuit diagram solder paste M705-GRN360-K2-V 1SS376 M705 M705 solder paste C 245 B
    Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    M705-GRN360-K2V

    Abstract: M705-GRN360 solder paste M705-GRN360-K2-V TOSHIBA GLASS MOLD 1SS376 3pin surface mount transistor M705 water level control circuit diagram M705-GRN360-K2-V C 245 B
    Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    M705-GRN360-K2V

    Abstract: M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 M705-GRN360 1SS355 UMD2 ROHM 1SS355 1SS380 750H ST-100S
    Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering


    Original     		PDF

    rohm mcr

    Abstract: MCR Series MNR15 750H MCR006 MCR01 MNR02 PMR03 PMR25 PMR50
    Text: Soldering conditions for Resistors Lead free paste Sn-3Ag-0.5Cu version Resistors Soldering conditions for Resistors Lead free paste (Sn-3Ag-0.5Cu) version CONTENTS Recommended conditions for reflow soldering 2/5 Recommended conditions for flow soldering


    Original     		PDF R0039A rohm mcr MCR Series MNR15 750H MCR006 MCR01 MNR02 PMR03 PMR25 PMR50

    senju solder paste

    Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste


    Original     		PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


    Original     		PDF OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil

    Systems

    Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
    Text: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered


    Original     		PDF

    2SB1051K

    Abstract: 750H ST-100S VMN3 TSST8 lpts 2sb1051
    Text: Design Support Document RECOMMENDABLE CONDITION OF SOLDERING SURFACE MOUNTED DEVICE CONDITION OF SOLDERING FOR SURFACE MOUNTED DEVICE DISCRETE TRANSISTOR LEAD FREE (Sn-3Ag-0.5Cu) VERSION CONTENTS RECOMMENDABLE CONDITION OF REFLOW SOLDERING 2/5 RECOMMENDABLE CONDITION OF FLOW SOLDERING


    Original     		PDF R1010A 2SB1051K 750H ST-100S VMN3 TSST8 lpts 2sb1051

    hallsensor 120

    Abstract: hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e
    Text: Application Note 27703.2* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of


    Original     		PDF GH-062-4 hallsensor 120 hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e

    hallsensor

    Abstract: hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR
    Text: Application Note 27703.2 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of


    Original     		PDF GH-062-4 hallsensor hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR

    TQFP80 footprint

    Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		PDF SSOP16 OT369-1) SSOP20 OT266-1) QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) TQFP80 footprint TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64

    Application Note 27703

    Abstract: Allegro
    Text: SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as long as normal, good


    Original     		PDF GH-062-1 Application Note 27703 Allegro

    profile wave soldering

    Abstract: No abstract text available
    Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination


    OCR Scan     		PDF 22-Sep-99

    Untitled

    Abstract: No abstract text available
    Text: Fujrrsu Recommended Soldering Process Recommended Soldering Process: Soldering by hand: 350+/-10 degrees at the tip of the soldering iron for 3 seconds. Soldering dip: 260+/-5 degrees for 10+/-1 seconds. SMT mounting: Many mays can be used for SMT reflow. The most common is Vapor phase or infrared


    OCR Scan     		PDF 500grams.

    Untitled

    Abstract: No abstract text available
    Text: Philips Components Soldering SOLDERING PLASTIC MINI­ PACKS By hand-held soldering iron or pulse-heated solder tool Fix the component by first soldering two, diagonally opposite, end leads. Apply the heating tool to the flat part of the lead only. Contact time must


    OCR Scan     		PDF