Contextual Info: Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT501A v B D A F y B U q v B v C A C U2 E P L 1 2 3 4 bp e1 e w M 10 c z A d e2 U1 Q 20 mm scale DIMENSIONS mm are the original dimensions UNIT

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Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D388 BGY1816S UHF amplifier module Product specification Supersedes data of 1999 Apr 13 2000 Oct 17 Philips Semiconductors Product specification UHF amplifier module BGY1816S FEATURES PINNING - SOT501A

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Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D388 BGY1816S UHF amplifier module Product specification Supersedes data of 1999 Jan 07 1999 Apr 13 Philips Semiconductors Product specification UHF amplifier module BGY1816S FEATURES PINNING - SOT501A

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Contextual Info: DISC RETE S E M IC O N D U C TO R S ATA S&flEET B GY 1816 S UHF amplifier module 1998 A pr 07 P relim inary specification File under Discrete S em iconductors, SC 19a Philips Semiconductors PHILIPS PHILIPS Philips S e m ico nd uctors Prelim inary specification

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Contextual Info: CHAPTER 6 PACKING METHODS page Introduction 6-2 Glossary of terms 6-2 Packing methods in exploded view 6-3 Packing quantities, box dimensions and carrier shapes 6 - 13 Philips Semiconductors Discrete Semiconductor Packages Packing Methods Chapter 6 INTRODUCTION

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Contextual Info: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

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Contextual Info: SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy 1 Wed May 12 11:40:55 1999 CHAPTER 1 PACKAGE OVERVIEW SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy Philips Semiconductors 2 Wed May 12 11:40:55 1999 Discrete Semiconductor Packages Package overview

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Contextual Info: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

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Contextual Info: SC18_1999_.book : SC18_CHAPTER_6_1999 1 Wed May 12 11:40:55 1999 CHAPTER 6 PACKING METHODS page Introduction 6-2 Glossary of terms 6-2 Packing methods in exploded view 6-3 Packing quantities, box dimensions and carrier shapes 6 - 13 SC18_1999_.book : SC18_CHAPTER_6_1999

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Contextual Info: DISCRETE SEMICONDUCTORS BGY1816S UHF amplifier module 1999 Apr 13 Product specification Supersedes data of 1999 Jan 07 Philips Sem iconductors PHILIPS PHILIPS Philips Semiconductors Product specification UHF amplifier module BGY1816S FEATURES P IN N IN G -S O T501A