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    SOT549 Search Results

    SOT549 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT549-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT549-1 NXP Semiconductors Footprint for reflow soldering SOT549-1 Original PDF
    SOT549-3 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Original PDF

    SOT549 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HTSSOP32

    Abstract: SOT549
    Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2


    Original     		PDF HTSSOP32: OT549-1 HTSSOP32 SOT549

    HTSSOP32

    Abstract: sot549
    Text: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-2 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2


    Original     		PDF HTSSOP32: OT549-2 HTSSOP32 sot549

    HTSSOP32

    Abstract: HTSSOP-32
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline HTSSOP32: plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT549-1 E D A X c y HE heatsink side v M A Dh Z 32 17 A2 Eh A3 A A1 pin 1 index θ Lp


    Original     		PDF HTSSOP32: OT549-1 HTSSOP32 HTSSOP-32

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh A3 A1 θ Lp pin 1 index A L detail X


    Original     		PDF HTSSOP32: OT549-3 MO-153

    HTSSOP32

    Abstract: sot549
    Text: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2


    Original     		PDF HTSSOP32: OT549-3 HTSSOP32 sot549

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh A3 A1 A pin 1 index θ Lp L detail X


    Original     		PDF HTSSOP32: OT549-1 MO-153

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HTSSOP32 package SOT549-1 Hx Gx P2 0.125 0.125 nSPx SPx nSPy Hy Gy SLy SPy tot By SPy Ay SPx tot C D2 4x P1 SLx D1 (28×) Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HTSSOP32 OT549-1 sot549-1

    UJA1069TW24

    Abstract: HTSSOP32 J2602 TJA1020 UJA1069 UJA1069TW SAE J2602 transceiver
    Text: UJA1069 LIN fail-safe system basis chip Rev. 03 — 10 September 2007 Product data sheet 1. General description The UJA1069 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Local Interconnect


    Original     		PDF UJA1069 UJA1069 J2602, UJA1069TW24 HTSSOP32 J2602 TJA1020 UJA1069TW SAE J2602 transceiver

    PDTA144E

    Abstract: ISO16750-2 TJA1021 BCP52-16 HTSSOP32 J2602 UJA1079A SAE J2602 transceiver ECU microcontroller UJA1079
    Text: UJA1079A LIN core system basis chip Rev. 01 — 9 July 2010 Product data sheet 1. General description The UJA1079A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a Local Interconnect Network


    Original     		PDF UJA1079A UJA1079A J2602, UJA1079A/xx/WD PDTA144E ISO16750-2 TJA1021 BCP52-16 HTSSOP32 J2602 SAE J2602 transceiver ECU microcontroller UJA1079

    Untitled

    Abstract: No abstract text available
    Text: TDA8932B Class-D audio amplifier Rev. 04 — 18 December 2008 Product data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω


    Original     		PDF TDA8932B TDA8932B

    ISO11898-3

    Abstract: UJA1061TW TJA1054 HTSSOP32 J2602 TJA1020 TJA1054A TJA1055 UJA1061 ecu repair
    Text: UJA1061 Fault-tolerant CAN/LIN fail-safe system basis chip Rev. 06 — 9 March 2010 Product data sheet 1. General description The UJA1061 fail-safe System Basis Chip SBC replaces basic discrete components that are common in every Electronic Control Unit (ECU) with a Controller Area Network (CAN)


    Original     		PDF UJA1061 UJA1061 ISO11898-3 TJA1054, TJA1054A TJA1055 UJA1061TW TJA1054 HTSSOP32 J2602 TJA1020 TJA1055 ecu repair

    BAT14

    Abstract: BAT42 HTSSOP32 TJA1041 TJA1041A UJA1066
    Text: UJA1066 High-speed CAN fail-safe system basis chip Rev. 03 — 17 March 2010 Product data sheet 1. General description The UJA1066 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Controller Area Network


    Original     		PDF UJA1066 UJA1066 TJA1041 TJA1041A, BAT14 BAT42 HTSSOP32 TJA1041A

    PDTA144E

    Abstract: No abstract text available
    Text: UJA1075A High-speed CAN/LIN core system basis chip Rev. 02 — 28 January 2011 Product data sheet 1. General description The UJA1075A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area


    Original     		PDF UJA1075A UJA1075A TJA1042, PDTA144E

    PDTA144E

    Abstract: No abstract text available
    Text: UJA1078 High-speed CAN/dual LIN core system basis chip Rev. 02 — 27 May 2010 Product data sheet 1. General description The UJA1078 core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area


    Original     		PDF UJA1078 UJA1078 TJA1042, PDTA144E

    PDTA144E

    Abstract: UJA1076A ecu repair DATA Sheet IC 555 BCP52-16 HTSSOP32 TJA1042 ECU microcontroller 0304-07 spi flash controller
    Text: UJA1076A High-speed CAN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1076A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area


    Original     		PDF UJA1076A UJA1076A TJA1042, UJA1076A/xx/WD PDTA144E ecu repair DATA Sheet IC 555 BCP52-16 HTSSOP32 TJA1042 ECU microcontroller 0304-07 spi flash controller

    ISO16750-2

    Abstract: PDTA144E UJA1078A ecu repair TJA1021 BCP52-16 HTSSOP32 J2602 TJA1042 ECU microcontroller
    Text: UJA1078A High-speed CAN/dual LIN core system basis chip Rev. 2 — 28 January 2011 Product data sheet 1. General description The UJA1078A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area


    Original     		PDF UJA1078A UJA1078A TJA1042, ISO16750-2 PDTA144E ecu repair TJA1021 BCP52-16 HTSSOP32 J2602 TJA1042 ECU microcontroller

    PDTA144E

    Abstract: UJA1079A
    Text: UJA1079A LIN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1079A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a Local Interconnect Network


    Original     		PDF UJA1079A UJA1079A J2602, UJA1079A/xx/WD PDTA144E

    TDA8932BT

    Abstract: TDA8932BTW TDA8932B tda8932 AES17 HTSSOP32 SO32 classd 5.1 circuit diagram schematics stu* audio amplifier RSN1012
    Text: TDA8932B Class-D audio amplifier Rev. 04 — 18 December 2008 Product data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω


    Original     		PDF TDA8932B TDA8932B TDA8932BT TDA8932BTW tda8932 AES17 HTSSOP32 SO32 classd 5.1 circuit diagram schematics stu* audio amplifier RSN1012

    UJA1061TW

    Abstract: HTSSOP32 ISO11898-3 J2602 TJA1020 TJA1054 TJA1054A TJA1055 UJA1061
    Text: UJA1061 Fault-tolerant CAN/LIN fail-safe system basis chip Rev. 04 — 27 April 2007 Product data sheet 1. General description The UJA1061 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Controller Area Network


    Original     		PDF UJA1061 UJA1061 ISO11898-3 TJA1054, TJA1054A TJA1055 UJA1061TW HTSSOP32 J2602 TJA1020 TJA1054 TJA1055

    hall effect ic 6838

    Abstract: 6838 hall effect sensor 6838 sensor hall 6838 hall sensor 6838 hall effect 6838 hall elements schematic diagram brushless motor control Hall Effect sensor 6838 schematic diagram disk drive motor controller 6838 hall
    Text: INTEGRATED CIRCUITS DATA SHEET SZA1015 Brushless Motor Controller BMC12 Product specification Supersedes data of 2000 Sep 19 File under Integrated Circuits, IC01 2001 Jul 11 Philips Semiconductors Product specification Brushless Motor Controller (BMC12)


    Original     		PDF SZA1015 BMC12) 753503/02/pp20 hall effect ic 6838 6838 hall effect sensor 6838 sensor hall 6838 hall sensor 6838 hall effect 6838 hall elements schematic diagram brushless motor control Hall Effect sensor 6838 schematic diagram disk drive motor controller 6838 hall

    TDA10086

    Abstract: 8psk HTSSOP32 TDA8260TW TDA8261TW anzac BB1518 23tkb 5 to 32 decoder using 4 t0 16 decoders transistor SMD FLO 14
    Text: INTEGRATED CIRCUITS DATA SHEET TDA8261TW Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer Preliminary specification 2003 May 28 Philips Semiconductors Preliminary specification Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer TDA8261TW


    Original     		PDF TDA8261TW SCA75 753504/01/pp24 TDA10086 8psk HTSSOP32 TDA8260TW TDA8261TW anzac BB1518 23tkb 5 to 32 decoder using 4 t0 16 decoders transistor SMD FLO 14

    PDTA144E

    Abstract: UJA1076ATW UJA1076A
    Text: UJA1076A High-speed CAN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1076A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area


    Original     		PDF UJA1076A UJA1076A TJA1042, UJA1076A/xx/WD PDTA144E UJA1076ATW

    Untitled

    Abstract: No abstract text available
    Text: TDA8932B Class-D audio amplifier Rev. 01 — 14 February 2007 Preliminary data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω


    Original     		PDF TDA8932B TDA8932B

    Untitled

    Abstract: No abstract text available
    Text: TDA8932B Class-D audio amplifier Rev. 02 — 29 March 2007 Preliminary data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω


    Original     		PDF TDA8932B TDA8932B