Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT82 Search Results

    SF Impression Pixel

    SOT82 Price and Stock

    Fischer Elektronik GmbH & Co KG

    Fischer Elektronik GmbH & Co KG KK-92-SOT-82

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey KK-92-SOT-82 Bulk 100
    • 1 -
    • 10 -
    • 100 $0.1785
    • 1000 $0.1785
    • 10000 $0.1785
    Buy Now

    Fischer Elektronik GmbH & Co KG KK-32-SOT-82

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey KK-32-SOT-82 Bulk 50
    • 1 -
    • 10 -
    • 100 $0.1784
    • 1000 $0.1784
    • 10000 $0.1784
    Buy Now

    Fischer Elektronik GmbH & Co KG THF-409-SOT-32-SOT-82

    Retaining Spring for Transistors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey THF-409-SOT-32-SOT-82 Bulk 500
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.12412
    • 10000 $0.12412
    Buy Now

    Fischer Elektronik GmbH & Co KG KK 32 SOT 82

    Heat Sink, 60 K/W, Sot-82 Rohs Compliant: Yes |Fischer Elektronik KK 32 SOT 82
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark KK 32 SOT 82 Bulk 10
    • 1 -
    • 10 $0.312
    • 100 $0.291
    • 1000 $0.222
    • 10000 $0.222
    Buy Now

    Fischer Elektronik GmbH & Co KG KK 92 SOT 82

    Heat Sink, 80 K/W, Sot-82 Rohs Compliant: Yes |Fischer Elektronik KK 92 SOT 82
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark KK 92 SOT 82 Bulk 10
    • 1 -
    • 10 $0.312
    • 100 $0.291
    • 1000 $0.222
    • 10000 $0.222
    Buy Now

    SOT82 Datasheets (15)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    SOT82 STMicroelectronics SOT82 - ASD & DISCRETES - TOURS Original PDF
    SOT820-1 NXP Semiconductors Plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink Original PDF
    SOT821-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm Original PDF
    SOT82_127 NXP Semiconductors Tube pack; standard product orientation; 12NC ending 127 Original PDF
    SOT822-1 NXP Semiconductors Plastic, heatsink small outline package; 16 leads Original PDF
    SOT822-1 NXP Semiconductors Footprint for reflow soldering SOT822-1 Original PDF
    SOT823-1 NXP Semiconductors Plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm Original PDF
    SOT824-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm Original PDF
    SOT825-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm Original PDF
    SOT825-1 NXP Semiconductors Footprint for reflow soldering SOT825-1 Original PDF
    SOT826-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm Original PDF
    SOT826-1 NXP Semiconductors Footprint for reflow soldering SOT826-1 Original PDF
    SOT827-1 NXP Semiconductors Plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) Original PDF
    SOT829-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm Original PDF
    SOT82 DPG AGRATE STMicroelectronics SOT82 DEDICATED PRODUCT PACKAGE Original PDF

    SOT82 Datasheets Context Search

    Catalog Datasheet
    Type
    Document Tags
    PDF

    BUX100

    Abstract: No abstract text available
    Text: Philips Semiconductors Product specification Silicon diffused power transistor BUX100 GENERAL DESCRIPTION High voltage, high speed glass passivated npn power transistor in a SOT82 envelope intended for use in high frequency electronic lighting ballast applications.


    OCR Scan
    BUX100 711Dfi 711005b BUX100 PDF

    690 lc

    Abstract: BUW14
    Text: Philips Semiconductors Product specification Silicon diffused power transistor BUW14 GENERAL DESCRIPTION High-voltage, high-speed, glass passivated npn power transistor in a SOT82 envelope intended for use in converters, inverters, switching regulators, motor control systems and switching applications.


    OCR Scan
    BUW14 1002b 007761G 711002b 690 lc BUW14 PDF

    BT148-600R

    Abstract: No abstract text available
    Text: TO -22 AB BT148-600R SCR 13 March 2014 Product data sheet 1. General description Planar passivated SCR with sensitive gate in a SIP3 SOT82 plastic package intended for use in general purpose switching and phase control applications. These devices are intended to be interfaced directly to microcontrollers, logic integrated circuits and other


    Original
    BT148-600R BT148-600R PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSOP16: plastic, heatsink small outline package; 16 leads SOT822-1 A E D E2 X c y HE v A D1 e3 2x D2 bp2 w 16 12 Q A2 E1 A pin 1 index A1 (A3) A4 θ 1 Lp 11 Z e (6×) e1 (2×) bp1 (5×) e2 (4×) detail X w w bp (10×) Q 5 Unit(1) mm max


    Original
    HSOP16: OT822-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline Plastic single-ended package; 3 leads in-line SOT82 E A q P D L1 Q L 1 2 3 c w M b e e1 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A b c D E e e1 L L1 max. P Q q w mm 2.8 2.3 0.88 0.65 0.58 0.47 11.1 10.5 7.8 7.2


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area ∅v ∅w b 1/2 e


    Original
    LFBGA228: OT821-1 PDF

    BT151

    Abstract: BTA151 500R 800R BT145 bt151 specification
    Text: Philips Semiconductors Product specification Thyristors sensitive gate GENERAL DESCRIPTION Glass passivated, sensitive gate thyristors in a plastic envelope, intended for use in general purpose switching and phase control applications. PINNING - SOT82 PIN


    Original
    BTA151 BTA151Repetitive BT151 500R 800R BT145 bt151 specification PDF

    bta16 600b transistor

    Abstract: bta16-600b LM317* switching STPS series 2A VOLTAGE REGULATOR TO-220 BTA06-600B bta40-600b application BTA40600B TO-220 transistor package LM338K
    Text: PHOTOCOPIERS RECOMMENDED PRODUCTS FROM SGS-THOMSON POWER SUPPLY Cont’d POWER SUPPLY Type Package L78xx L79xx L78Mxx LM317 LM317MDT LM323 LM337 LM338K LM350K L78Sxx L78Lxx LM723 1.5A Series TO-220/Isowatt 220/TO-3 1.5A Series TO-220/Isowatt 220/TO-3 0.5A Series TO-220/Isowatt 220/DPAK/SOT194/SOT82


    Original
    L78xx L79xx L78Mxx LM317 LM317MDT LM323 LM337 LM338K LM350K L78Sxx bta16 600b transistor bta16-600b LM317* switching STPS series 2A VOLTAGE REGULATOR TO-220 BTA06-600B bta40-600b application BTA40600B TO-220 transistor package LM338K PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Product specification Silicon diffused power transistor BUX100 GENERAL DESCRIPTION High voltage, high speed glass passivated npn power transistor in a SOT82 envelope intended for use in high frequency electronic lighting ballast applications.


    OCR Scan
    BUX100 PDF

    Untitled

    Abstract: No abstract text available
    Text: N AUER PHILIPS/DISCRETE bSE D • bbSB'lBl QQSflSb3 ^36 « A P X Philips Sem iconductors Product specification Silicon diffused power transistor BUW14 GENERAL DESCRIPTION High-voltage, high-speed, glass passivated npn power transistor in a SOT82 envelope intended for use in


    OCR Scan
    BUW14 005flSfc bb53131 S0T82 PDF

    BUX100

    Abstract: transistor ""
    Text: Philips Semiconductors Product specification Silicon diffused power transistor BUX100 GENERAL DESCRIPTION High voltage, high speed glass passivated npn power transistor in a SOT82 envelope intended for use in high frequency electronic lighting ballast applications.


    OCR Scan
    BUX100 100mA 7110flBb DD77647 DD776M6 BUX100 transistor "" PDF

    sot821

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area


    Original
    LFBGA228: OT821-1 sot821 PDF

    BUX86P

    Abstract: BUX 88 BUX 88 S bux c BUX87P bux 86p
    Text: Philips Semiconductors Product specification Silicon Diffused Power Transistor BUX86P BUX87P GENERAL DESCRIPTION High voltage, high speed glass passivated npn power transistors in a SOT82 envelope intended for use in converters, inverters, switching regulators, motor control systems and switching applications.


    OCR Scan
    BUX86P BUX87P 711002b BUX86P BUX 88 BUX 88 S bux c BUX87P bux 86p PDF

    mmic e3

    Abstract: 4350B BLM6G22-30 BLM6G22-30G HSOP16
    Text: BLM6G22-30; BLM6G22-30G W-CDMA 2100 MHz to 2200 MHz power MMIC Rev. 01 — 3 March 2008 Objective data sheet 1. Product profile 1.1 General description 30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 2100 MHz to 2200 MHz. Available in gull wing for surface mount SOT822-1 or flat lead


    Original
    BLM6G22-30; BLM6G22-30G OT822-1) OT834-1) BLM6G22-30 BLM6G22-30G mmic e3 4350B HSOP16 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    LFBGA183 OT825-1 OT825-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint for reflow soldering of HSOP16 package sr −0.075 mm around copper 0.40 SOT822-1 sr +0.075 mm around copper 1.60 4 x 0.60 (10 ×) 11.78 8.86 6.82 4.78 2.74 1.20 (2 ×) 0.45 5.90 7.62 12.90 1.10 (5 ×) sp −0.025 mm


    Original
    HSOP16 OT822-1 sot822-1 OT822-1 PDF

    smps with uc3842 and tl431

    Abstract: lm317 SO-8 LM337 TO-3 sg3525a smps op-amp lm723 LM338K LM350K ST90R30 2K EPROM Single Schottky diode TO-220
    Text: PRINTERS RECOMMENDED PRODUCTS FROM SGS-THOMSON POWER SUPPLY Type POWER SUPPLY Cont’d Description L78xx L79xx L78Mxx LM317 LM317MDT LM323 LM337 LM338K LM350K L78Sxx L78Lxx LM723 1.5A Series TO-220/Isowatt 220/TO-3 1.5A Series TO-220/Isowatt 220/TO-3 0.5A Series TO-220/Isowatt 220/DPAK/SOT194/SOT82


    Original
    L78xx L79xx L78Mxx LM317 LM317MDT LM323 LM337 LM338K LM350K L78Sxx smps with uc3842 and tl431 lm317 SO-8 LM337 TO-3 sg3525a smps op-amp lm723 LM338K LM350K ST90R30 2K EPROM Single Schottky diode TO-220 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1 1/2 e e Y V T P M K H F D B ball A1 index area y y1 C ∅v M C A B b ∅w M C W e U R N L


    Original
    TFBGA256: OT829-1 MO-195 PDF

    Untitled

    Abstract: No abstract text available
    Text: B TO -2 20A SOT82 Tube pack; standard product orientation; 12NC ending 127 Rev. 1 — 22 November 2012 Packing information 1. Packing method Item Material Printed plano box Tape Labels Tube Turnlock Seal Cardboard carbon coated Polypropylene Paper Polyvinylchloride


    Original
    msc070 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSOP16: plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink D SOT820-1 A E c y X heatsink side v HE M A Dh 16 9 A A2 Eh A 3 A1 θ pin 1 index Lp L detail X 1 8 e Z w bp M 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original
    HSOP16: OT820-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm SOT823-1 c y X A 60 61 41 40 ZE e A A2 E HE A 3 A1 θ w M Lp bp pin 1 index L detail X 21 80 20 1 w M bp e v M A ZD B D HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original
    LQFP80: OT823-1 136E19 MS-026 PDF

    BUX86P

    Abstract: BUX87P bux 86p
    Text: Philips Semiconductors Product specification Silicon Diffused Power Transistor BUX86P BUX87P GENERAL DESCRIPTION High voltage, high speed glass passivated npn power transistors in a SOT82 envelope intended for use in converters, inverters, switching regulators, motor control systems and switching applications.


    Original
    BUX86P BUX87P BUX86P BUX87P bux 86p PDF

    m2 m2.5 m3 bolt tensile

    Abstract: torque for SELF TAPPING SCREW Crystal washer heatsink TO126 TO126 transistor torque of screw for pcb SOT-82
    Text: Philips Semiconductors Mounting instructions TO126; SOT82 GENERAL DATA AND INSTRUCTIONS Heatsink compound General rules The thermal resistance from mounting base to heatsink Rth mb-h can be reduced by applying a metallic oxide compound between the contact surfaces. Values given


    Original
    PDF

    BU724A

    Abstract: philips BU724A
    Text: PHILIPS INTERNATIONAL MSE D O 711005b 0030=121 M Q P H I N BU724A 7~-33-2f — SILICON DIFFUSED POWER TRANSISTORS M onolithic high-voltage npn Darlington transistors w ith integrated speed-up diode in a SOT82 envelope, intended fo r fast switching applications such as small m otor control and switch-mode power supplies


    OCR Scan
    711005b BU724A -33-2f 711QflSb 711002b BU724A philips BU724A PDF