Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TSOP 48 THERMAL RESISTANCE Search Results

    TSOP 48 THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 48 THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.


    Original     		300mil 64P4B 16P2P 20P2N 375mil 28P2V 300mil 26P3D 400mil TSOP 48 thermal resistance TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V PDF

    84-1LMI

    Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
    Text: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		400-mil S320CR 84-1LMI Gold1021-ZSC CY7C1021-ZSC 84-1LMI Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead


    Original     		12x20 TSOP 48 thermal resistance TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48 PDF

    2420

    Abstract: TSOP 48 thermal resistance 140C JESD22
    Text: Qualification Report October 1996, QTP #95072/95516, Version 2.1 Thin Small Outline Package 28 Lead TSOP Type 1 CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 28 Lead TSOP Alloy 42 Hyundai, Korea


    Original     		RE49510965 CY7C199-ZC CY7C199-ZC 2420 TSOP 48 thermal resistance 140C JESD22 PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024 PDF

    TSOP 48 thermal resistance

    Abstract: 130C 8361H CY62148 CY62148V JESD22 tsop package MSL
    Text: Cypress Semiconductor Package Qualification Report QTP# 000805 VERSION 1.0 October 2000 32 Lead 400 mil TSOP type ll package and Moisture Level 3 Chip Pac Hyundai Korea CYPRESS TECHNICAL CONTACT FOR QUALITFICATION DATA: Ed Russell Reliability Director (408) 432–7069


    Original     		CY62148 CY62148V R52LD-3) 30C/60 CY62148-ZSC TSOP 48 thermal resistance 130C 8361H CY62148 CY62148V JESD22 tsop package MSL PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CY14B104L/CY14B104N 4-Mbit 512K x 8/256K x 16 nvSRAM Feature Functional Description • 15 ns, 25 ns, and 45 ns access times • Internally organized as 512K x 8 or 256K x 16 • Hands-off automatic STORE on power down with only a small capacitor


    Original     		CY14B104L/CY14B104N 8/256K CY14B104L/CY14B104N to10ns to15ns PDF

    TSOP 54 Package

    Abstract: TSOP 48 thermal resistance TSOP 54 PIN TSOP 54 Package used in where TSOP II 54 TSOP II 54 Package
    Text: PRELIMINARY CY14B104L/CY14B104N 4-Mbit 512K x 8/256K x 16 nvSRAM Feature Functional Description • 15 ns, 25 ns, and 45 ns access times • Internally organized as 512K x 8 or 256K x 16 • Hands-off automatic STORE on power down with only a small capacitor


    Original     		CY14B104L/CY14B104N 8/256K CY14B104L/CY14B104N to10ns to15ns TSOP 54 Package TSOP 48 thermal resistance TSOP 54 PIN TSOP 54 Package used in where TSOP II 54 TSOP II 54 Package PDF

    sac 326

    Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
    Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要


    Original     		PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance PDF

    TSOP 54 PIN

    Abstract: TSOP 54 Package CY14B104L CY14B104N
    Text: PRELIMINARY CY14B104L, CY14B104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 20 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L) CY14B104N) CY14B104L/CY14B104N TSOP 54 PIN TSOP 54 Package CY14B104L CY14B104N PDF

    TSOP II 54

    Abstract: TSOP 48 thermal resistance junction to case TSOP 48 thermal resistance TSOP 54 thermal resistance
    Text: PRELIMINARY CY14B104L, CY14B104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 20 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L/CY14B104N TSOP II 54 TSOP 48 thermal resistance junction to case TSOP 48 thermal resistance TSOP 54 thermal resistance PDF

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CY14B104L, CY14B104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L/CY14B104N PDF

    CY14B104L

    Abstract: CY14B104N
    Text: PRELIMINARY CY14B104L, CY14B104N 4-Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L) CY14B104N) CY14B104L/CY14B104N CY14B104L CY14B104N PDF

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    SRAM 54-PIN TSOP

    Abstract: No abstract text available
    Text: PRELIMINARY CY14B104L/CY14B104N 4-Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns and 25 ns access times • Internally organized as 512K x 8 or 256K x 16 • Hands-off automatic STORE on power down with only a small capacitor • STORE to QuantumTrap nonvolatile elements is initiated


    Original     		CY14B104L/CY14B104N 8/256K CY14B104L/CY14B104N to10ns to15ns SRAM 54-PIN TSOP PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CY14B104L, CY14B104N 4-Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L) CY14B104N) CY14B104L/CY14B104N PDF

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    TSOP 54 Package

    Abstract: CY14B104L CY14B104N
    Text: CY14B104L, CY14B104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 20 ns, 25 ns, and 45 ns Access Times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off Automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L) CY14B104N) CY14B104L/CY14B104N TSOP 54 Package CY14B104L CY14B104N PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 54 Package TSOP 54 PIN 44TSOP
    Text: PRELIMINARY CY14E104L/CY14E104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 15 ns, 20 ns, 25 ns, and 45 ns access times ■ Internally organized as 512K x 8 (CY14E104L) or 256K x 16 (CY14E104N) ■ Hands off automatic STORE on power down with only a small


    Original     		CY14E104L/CY14E104N 8/256K CY14E104L) CY14E104N) CY14E104L/CY14E104N TSOP 48 thermal resistance TSOP 54 Package TSOP 54 PIN 44TSOP PDF

    Untitled

    Abstract: No abstract text available
    Text: CY14B104L, CY14B104N 4 Mbit 512K x 8/256K x 16 nvSRAM Features Functional Description • 20 ns, 25 ns, and 45 ns Access Times ■ Internally organized as 512K x 8 (CY14B104L) or 256K x 16 (CY14B104N) ■ Hands off Automatic STORE on power down with only a small


    Original     		CY14B104L, CY14B104N 8/256K CY14B104L/CY14B104N PDF