tsop series
Abstract: TSOP-16 TSOP tsop datasheet mitsumi transistor 20a mitsumi 22 TSOP-20A
Text: Package MITSUMI Packages TSOP Series Units : mm TSOP-16B 0.15+0.10 -0.05 5.0±0.3 0.5±0.2 9 4.4±0.2 16 1 8 0.65 0~10° 0.10 0.22±0.10 TSOP-20A TSOP-24A 0.10 0.10±0.05 1.1±0.1 (1.0) 0.525 max. 6.4±0.3 TSOP-16A
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TSOP-16B
TSOP-20A
TSOP-24A
TSOP-16A
tsop series
TSOP-16
TSOP
tsop datasheet
mitsumi
transistor 20a
mitsumi 22
TSOP-20A
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TSOP 48 socket
Abstract: No abstract text available
Text: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series
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000MOhm
TSOP 48 socket
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Untitled
Abstract: No abstract text available
Text: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor
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2fu smd transistor
Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Text: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR
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TC55V1001ASTI/ASRI
TC55V2001STI/SRI
TC55V020FT/TR
TC55V2161FTI
TC55V200FT/TR
TC55V040FT/TR
TC55V400FT/TR
TC58VT
TC75S55FU
2fu smd transistor
Infrared sensor TSOP 1738
diode ESM 765
tsop Ir sensor
smd 1608
TSOP44 Package layout
TSOP infrared
infrared sensor (TSOP 1738)data sheet
Compact High-Current and Low VF Surface Mounting Device SBD
TC58V16BFT
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TSOP RECEIVER
Abstract: TSOP IR ir led receiver bs12 "ir receiver" 19326 led Metal holder smd 83 tsop 38 TSOP1236TB1
Text: General Information Vishay Semiconductors General Information PRODUCT DESIGNATION AND SELECTION FOR TSOP IR RECEIVER MODULES Description of the TSOP series field codes: T S O P 1 Z Ammo pack optional : Vishay IR receiver Product groups: (blank), 3, 5, 7, 8, 9
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TSOP1236TB1
17-Sep-08
TSOP RECEIVER
TSOP IR
ir led receiver
bs12
"ir receiver"
19326
led Metal holder
smd 83
tsop 38
TSOP1236TB1
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s29al004d55
Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032
Text: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)
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Am29LV400B
S29AL004D
Am29LV800B/D
S29AL008D
Am29LV160D
MBM29LV160TE/BE
S29AL016D
Am29LV160M
S29AL016M
Am29DL32xG
s29al004d55
S29AL016D70TFI010
am29LV8000
S29PL064J70BFI120
S29AL016D70BFI020
Am29LV8000B
S29JL064H90TFI000
S29AL008D70TFI020
S29JL032H70TFI020
S29JL032
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TSOP-16
Abstract: tsop series A-1003B
Text: TSOP Series Ultra Precision Molded Resistor Networks The content of this specification may change without notification 1/01/06 Custom solutions are available. HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance
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Abstract: No abstract text available
Text: HN58V256A Series, HN58V257A Series Ordering Information Type No. Access time Package HN58V256AFP-12 120 ns 400 mil 28-pin plastic SOP FP-28D HN58V256AT-12 120 ns 28-pin plastic TSOP (TFP-28DB) HN58V257AT-12 120 ns 8 x 14 mm2 32-pin plastic TSOP (TFP-32DA)
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HN58V256A
HN58V257A
HN58V256AFP-12
HN58V256AT-12
HN58V257AT-12
28-pin
FP-28D)
TFP-28DB)
32-pin
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. TSOP This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil. TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide
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184pin
512Mb
400mil.
184-pin
268max
256Mb
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HYMD564M646C
Abstract: d431 DDR266 DDR266B DDR333 DDR400 DDR400B HYMD532M646C hynix ddr hynix ddr sdram
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered
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200pin
512Mb
400mil
200-pin
DDR400,
DDR333
HYMD564M646C
d431
DDR266
DDR266B
DDR400
DDR400B
HYMD532M646C
hynix ddr
hynix ddr sdram
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hynix ddr400 sdram 1Gb
Abstract: DDR200 DDR266 DDR266A DDR266B DDR333 hynix ddr hynix module suffix
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. TSOP This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil. TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide
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184pin
512Mb
400mil.
184-pin
256Mb
HYMD525G726CSP4M
hynix ddr400 sdram 1Gb
DDR200
DDR266
DDR266A
DDR266B
DDR333
hynix ddr
hynix module suffix
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Untitled
Abstract: No abstract text available
Text: Gold Termination TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP G 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES
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Untitled
Abstract: No abstract text available
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered
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200pin
512Mb
400mil
200-pin
DDR400,
512MB,
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Untitled
Abstract: No abstract text available
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered
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200pin
512Mb
400mil
200-pin
DDR400,
512MB,
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Untitled
Abstract: No abstract text available
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered
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200pin
512Mb
400mil
200-pin
DDR400,
DDR333
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D431
Abstract: DDR266 DDR266B DDR333 DDR400 DDR400B hynix module suffix DDR333 production drawing
Text: 200pin Unbuffered DDR SDRAM SO-DIMMs based on 512Mb B ver. TSOP This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 400mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 512Mb B ver. based unbuffered
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200pin
512Mb
400mil
200-pin
DDR400,
512MB,
HYMD564M646B
D431
DDR266
DDR266B
DDR333
DDR400
DDR400B
hynix module suffix
DDR333 production drawing
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DDR200
Abstract: DDR266 DDR266A DDR266B DDR333 hynix module suffix
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. TSOP This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 400mil. TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide
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184pin
512Mb
400mil.
184-pin
256Mb
HYMD525G726BS
DDR200
DDR266
DDR266A
DDR266B
DDR333
hynix module suffix
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HYMD264646D8J-D43
Abstract: HYMD232646D8J-D43 hynix HYMD264646D8J-D43 DDR266 DDR266A DDR266B DDR333 DDR400 DDR400B 256mb ddr333 200 pin
Text: 184pin Unbuffered DDR SDRAM DIMMs based on 256Mb D ver. TSOP This Hynix unbuffered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 400 mil TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based unbuffered DIMM series provide
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184pin
256Mb
184-pin
1184pin
512MB,
HYMD264726D
157MAX
HYMD264646D8J-D43
HYMD232646D8J-D43
hynix HYMD264646D8J-D43
DDR266
DDR266A
DDR266B
DDR333
DDR400
DDR400B
256mb ddr333 200 pin
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Untitled
Abstract: No abstract text available
Text: TSOP Series Ultra Precision Molded Resistor Networks Tin Lead Termination HOW TO ORDER TSOP S 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1%
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Untitled
Abstract: No abstract text available
Text: 184pin Unbuffered DDR SDRAM DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered DIMM series provide
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184pin
512Mb
400mil
184-pin
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HYMD512646cp8j
Abstract: HYMD512646CP8J-D43 DDR266 DDR266B DDR333 DDR400 DDR400B HYMD532646CP6-H HYMD532646CP6J hynix module suffix
Text: 184pin Unbuffered DDR SDRAM DIMMs based on 512Mb C ver. TSOP This Hynix unbuffered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 400mil TSOP II packages on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered DIMM series provide
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184pin
512Mb
400mil
184-pin
HYMD512646cp8j
HYMD512646CP8J-D43
DDR266
DDR266B
DDR333
DDR400
DDR400B
HYMD532646CP6-H
HYMD532646CP6J
hynix module suffix
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Untitled
Abstract: No abstract text available
Text: 1C 235 SERIES tsop •Applicable 1C Dimensions FEATURES • Open top type sockets for TSOP packages. • Unique, compact design ensures high-density mounting of burn-in inboards. • Unique contact design ensures outstanding contact reliability especially in monitored burn-in operations.
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000MQ
100VDC
700VAC
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Untitled
Abstract: No abstract text available
Text: 1C 197 SERIES TSOP 0.5rwn pitch •O u tlin e Dimensions CD FEATURES • SMT type sockets for TSOP Type-1 mounting. • Require no jigs for IC removal. • Mounting in IC identical foot patterns. • Low profile design with package height 2.45 to 2.50mm.
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500MO
at500VDC
250VAC
IC197â
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Untitled
Abstract: No abstract text available
Text: 1C 191 SERIES tsop- i •Applicable 1C Dimensions T FEATURES i • Open lop type sockets for TSOP Type I packages. • 1C packages are attached and detached by vertical operation of the cover. a f O1 • A unique contact design ensures outstanding contact reliability.
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IC191â
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