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    TSOP-II 44 Search Results

    TSOP-II 44 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TSOP 44 Package

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)


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    FPT-44P-M18 400mil 44-pin FPT-44P-M18) F44025S-1C-1 120mil TSOP 44 Package PDF

    TSOP044-P-0400-3

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-44P-M09) 44-pin plastic TSOP (II)


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    FPT-44P-M09 TSOP044-P-0400-3 44-pin FPT-44P-M09) TSOP044-P-0400-3 PDF

    TSOP 86 Package

    Abstract: tsop 86
    Text: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)


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    FPT-86P-M01 400mil 86-pin FPT-86P-M01) F86001S-1C-1 TSOP 86 Package tsop 86 PDF

    M312L5623MTS

    Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
    Text: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary


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    184pin 200mil 72-bit M312L5620MTS-CB3/A2/B0 M312L5623MTS-CB3/A2/B0 256Mx4( K4H1G0438M) 128Mx8( K4H1G0838M) M312L5623MTS TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3 PDF

    Untitled

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM


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    512MB, 184pin 512Mb 200mil 72-bit M383L6523BTS- PDF

    Untitled

    Abstract: No abstract text available
    Text: 'HYUNDAI HYM572A124A R-Series Unbuffered 1M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A124A is a 1M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168 pin


    OCR Scan
    HYM572A124A 72-bit HY514404B HY5118164B 2048bit HYM572A124ARG/ASLRG/ATRG/ASLTRG 10CH2 4b75Dflfl PDF

    MT48LCM32B2P

    Abstract: MT48LCM32B2 x32s
    Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free


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    MT48LC2M32B2 PC100-compliant 4096-cycle, 09005aef811ce1fe MT48LCM32B2P MT48LCM32B2 x32s PDF

    MT48LC4M32B2P

    Abstract: TP 472
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


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    128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P TP 472 PDF

    MT48LC4M32B2P

    Abstract: x32SDR
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


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    128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P x32SDR PDF

    MT48LC4M32B2P

    Abstract: No abstract text available
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


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    128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P PDF

    MT48LC16M8A2BB

    Abstract: No abstract text available
    Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free


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    128Mb: MT48LC32M4A2 MT48LC16M8A2 MT48LC8M16A2 PC100- PC133-compliant 4096-cycle 09005aef8091e66d x4x8x16 MT48LC16M8A2BB PDF

    Untitled

    Abstract: No abstract text available
    Text: “H Y U N D A I HYM5V72A224A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION The HYM5V72A224A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY51V4404B in 20/26 pin SOJ or TSOP-II, four HY51V18164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048 bit EEPROM on a 168


    OCR Scan
    HYM5V72A224A 72-bit HY51V4404B HY51V18164B HYM5V72A224ARG/ASLRG/ATRG/ASLTRG 17itance DQ0-DQ71) 4b750flfl PDF

    WED3DG6435V-D1

    Abstract: No abstract text available
    Text: WED3DG6435V-D1 -JD1 White Electronic Designs 256MB 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION The WED3DG6435V is a 32Mx64 synchronous DRAM module which consists of eight 32Mx8 SDRAM components in TSOP II package, and one 2Kb EEPROM in an 8 pin TSOP package for Serial Presence Detect which


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    WED3DG6435V-D1 256MB 32Mx64 WED3DG6435V 32Mx8 PC100 PC133 WED3DG6435V-D1 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3DG6435V-D1 -JD1 White Electronic Designs 256MB 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION The W3DG6435V is a 32Mx64 synchronous DRAM module which consists of eight 32Mx8 SDRAM components in TSOP II package, and one 2Kb EEPROM in an 8 pin TSOP package for Serial Presence Detect which are mounted on


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    W3DG6435V-D1 256MB 32Mx64 W3DG6435V 32Mx8 PC100 PC133 PDF

    d947

    Abstract: hy51v18164b
    Text: • « H Y U N D A I H Y M 5 V 7 2 A 1 2 4 A R - S e r ie s Unbuffered 2M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM5V72A124A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY51V4404B in 20/26 pin SOJ or TSOP-II, four HY51V18164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168


    OCR Scan
    72-bit HYM5V72A124A HY51V4404B HY51V18164B 2048bit HYM5V72A124ARG/ASLRG/ATRG/ASLTRG DQ0-DQ71) 1ECM-10-APR96 d947 PDF

    72108A

    Abstract: No abstract text available
    Text: GS72108AGP TSOP Commercial Temp Industrial Temp 7, 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 8 2Mb Asynchronous SRAM Features TSOP-II 256K x 8-Pin Configuration • Fast access time: 7, 8, 10, 12 ns • CMOS low power operation: 135/115/95/80 mA at minimum


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    GS72108AGP 44-pin 72108A PDF

    Untitled

    Abstract: No abstract text available
    Text: Cypress Semiconductor Qualification Report QTP# 98109 VERSION 1.1 June, 2000 44 Ld TSOP Type II Package Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor Assembly: Cypress Philippines


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    CEL9200 8361H 7C1021BC-* PDF

    Untitled

    Abstract: No abstract text available
    Text: 256MB, 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die 66 TSOP-II & 54 sTSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.


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    256MB, 512MB, 184pin 512Mb 64Mx8 sTSOPII-300mil K4H510838D-V* PDF

    Untitled

    Abstract: No abstract text available
    Text: »HYUNDAI HYM572A224A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A224A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOR-II and one 2048bit EEPROM on a 168 pin


    OCR Scan
    HYM572A224A 72-bit HY514404B HY5118164B 2048bit HYM572A224ARG/ASLRG/ATRG/ASLTRG 01CKQ2SXMX. 012SQ18) PDF

    Untitled

    Abstract: No abstract text available
    Text: DDR SDRAM 256MB, 512MB, 1GB Unbuffered SODIMM Pb-Free DDR SDRAM SODIMM 200pin Unbuffered SODIMM based on 512Mb B-die with 64 / 72-bit Non ECC / ECC 66 TSOP(II)/54 sTSOP(II) with Pb-Free (RoHS compliant) Revision 1.2 Oct. 2004 Revision 1.2 Oct. 2004 256MB, 512MB, 1GB Unbuffered SODIMM Pb-Free


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    256MB, 512MB, 200pin 512Mb 72-bit PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend


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    FPT-44P-M10 44-pin FPT-44P-M10) F44015S-1C-2 PDF

    PLCC 68 intel

    Abstract: intel manual 48pin flash programmer circuit
    Text: PROM PROGRAMMERS INTEL FlashPRO-II: Advanced Flash Memory Engineering Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module


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    56-lead 44-lead 60-pin 48-pin PLCC 68 intel intel manual 48pin flash programmer circuit PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18)


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    FPT-44P-M18 44-pin FPT-44P-M18) F44025S-1C-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 300 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17)


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    FPT-44P-M17 44-pin FPT-44P-M17) F44024S-2C-1 PDF