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    Abstract: No abstract text available
    Text: ShE D • BDBÜbüT 0 0 0 1 0 5 1 S34 W V C T VTB Process Photodiodes V T B 8 4 4 0 , 41, 42 E G & G VACTEC T-4 1-5 1 PACKAGE DIMENSIONS inch mm CASE 21 PRODUCT DESCRIPTION P la n a r s ilic o n p h o to d io d e in a recessed ceramic package. Chip is coated with a protective layer of epoxy.


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    PDF VTB8440 VTB8441 VTBB442

    VTB8440

    Abstract: VTB8441 VTBB442 V 14 K 320
    Text: SbE ]> • BDBDbQ^ 0001051 IVCT S34 VTB Process Photodiodes V T B 8 4 4 0 , 41, 4 2 E G & G VACTEC T-41-51 PACKAGE DIMENSIONS inch mm C A S E 21 8 mm C ER A M IC CHIP ACTIVE AREA: .008 In2 (5.16 mm2) PRODUCT DESCRIPTION P la n a r s ilic o n p h o to d io d e in a


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    PDF VTB8440, T-41-51 VTB8440 VTB8441 VTBB442 1001c, 7x1013 x1013 VTB8440 VTB8441 VTBB442 V 14 K 320