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    AMD Xilinx XQR2V6000-4FF1152NES

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    XQR2V6000 Datasheets (6)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    XQR2V6000-4CF1144H Xilinx IC FPGA 1.5/3.3V 1144FLIP-CHIP Original PDF
    XQR2V6000-4CF1144M Xilinx IC FPGA 1.5/3.3V 1144Flip-Chip Original PDF
    XQR2V6000-4CFG1144H Xilinx IC FPGA 1.5/3.3V 1144Flip-Chip Original PDF
    XQR2V6000-4CFG1144M Xilinx IC FPGA 1.5/3.3V 1144BGA Original PDF
    XQR2V6000-4FF1152N Xilinx IC FPGA 1.5/3.3V 1152FBGA Original PDF
    XQR2V6000-4FFG1152N Xilinx IC FPGA 1.5/3.3V 1152FBGA Original PDF

    XQR2V6000 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    VQFP44 package

    Abstract: isp Cable Version 3.0 VQ44 XQR18V04 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N
    Text: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.4 December 15, 2003 5 Features • Description Operating Temperature Range: –55° C to +100° C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5


    Original     		PDF XQR18V04 DS082 CascadV04CC44M XQR18V04CC44V XQR18V04VQ44N XQ18V04. VQFP44 package isp Cable Version 3.0 VQ44 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XQR18V04

    Abstract: XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000
    Text: R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support • Program/erase temperature range: 0°C to +85°C


    Original     		PDF XQR18V04 DS082 XQ18V04. UG112, XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000

    XQR2V3000-4CG717V

    Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000
    Text: R < B L QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v1.2 December 4, 2006 Product Specification Summary of Radiation Hardened QPro Virtex-II Features • • • • • • • • • • • • • Industry First Radiation Hardened Platform FPGA


    Original     		PDF DS124 MIL-PRF-38535 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000

    XAPP987

    Abstract: voter XAPP988 XAPP216 RAM SEU fpga radiation CREME96 Upsets XAPP779 XQR2V6000
    Text: Application Note: FPGAs Single-Event Upset Mitigation Selection Guide R Author: Brendan Bridgford, Carl Carmichael, and Chen Wei Tseng XAPP987 v1.0 March 18, 2008 Summary This application note discusses different aspects of single-event upsets and recommends


    Original     		PDF XAPP987 XAPP987 voter XAPP988 XAPP216 RAM SEU fpga radiation CREME96 Upsets XAPP779 XQR2V6000

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    XQR18V04

    Abstract: XQR4000XL CLCC44 CLCC-44 XQVR1000 XQVR300 XQVR600 XQR2V1000
    Text: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.5 October 5, 2004 5 Features • Product Specification Description Operating Temperature Range: –55°C to +100°C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5


    Original     		PDF XQR18V04 DS082 XQ18V04. XQR4000XL CLCC44 CLCC-44 XQVR1000 XQVR300 XQVR600 XQR2V1000

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XAPP779

    Abstract: UG156 SRL16 voter UG002 XQR2V6000 XQR2V1000 2V1000
    Text: Application Note: Virtex-II FPGAs R XAPP779 v1.1 February 19, 2007 Summary Correcting Single-Event Upsets in Virtex-II Platform FPGA Configuration Memory Authors: Brendan Bridgford, Carl Carmichael, Chen Wei Tseng Designers of space-based application must be concerned with the effect of single-event upsets


    Original     		PDF XAPP779 XAPP779 UG156 SRL16 voter UG002 XQR2V6000 XQR2V1000 2V1000

    QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM

    Abstract: DS126 XQR17V16CC44V XQR17V16CC44M fpga radiation QPro Family XQ17V16 xilinx series 7 seu XQR17V16VQ44R QProXQR17V16
    Text: QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM R DS126 v1.0 December 18, 2003 8 Features • Latch-Up Immune to LET >120 MeV/cm2/mg • Guaranteed TID of 50 kRad(Si) per spec 1019.5 • Fabricated on Epitaxial Substrate • 16Mbit storage capacity


    Original     		PDF XQR17V16 16Mbit DS126 XQR17V16 44-pin XQR17V16CC44M XQR17V16CC44V QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM DS126 XQR17V16CC44V XQR17V16CC44M fpga radiation QPro Family XQ17V16 xilinx series 7 seu XQR17V16VQ44R QProXQR17V16

    XQR2V3000-4CG717V

    Abstract: No abstract text available
    Text: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — R 1 2 3 QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v2.0 April 7, 2014 Product Specification Summary of Radiation-Hardened QPro Virtex-II FPGA Features • • • • • • •


    Original     		PDF DS124 MIL-PRF-38535 XQR2V3000-4CG717V

    CB228

    Abstract: CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300
    Text: QPRO Logic Cells RAMbus MULTs DLLs Flip-Flops Max I/Os 64 PG84, CB100 XQR4013XL 3.3 10-30K 1368 18K 393632 – – 1536 192 CB228 60 360 80 PG84 XQR4036XL 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – –


    Original     		PDF CB100 XQR4013XL 10-30K CB228 XQR4036XL 22-65K XC3042* PG132, CB228 CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300

    XQR2V3000-4CG717V

    Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V3000-4BG728R XQR2V3000-4BG728 CG717 XQR2V1000-4BG575N XQR2V1000-4BG575 CF1144
    Text: ds124.fm Page 1 Tuesday, January 20, 2004 6:23 PM QPro Virtex-II 1.5V Radiation Hardened QML Platform FPGAs R DS124 v1.1 January 8, 2004 Product Specification Summary of Radiation Hardened QPro Virtex™-II Features • Industry First Radiation Hardened Platform FPGA


    Original     		PDF ds124 DS124 MIL-PRF-38535 CF1144 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V3000-4BG728R XQR2V3000-4BG728 CG717 XQR2V1000-4BG575N XQR2V1000-4BG575

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    XQ18V04

    Abstract: XQR18V04 XQVR1000 XQVR300 XQVR600 XQR2V1000
    Text: ARCHIVED DATA SHEET - NO LONGER SUPPORTED R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support


    Original     		PDF XQR18V04 DS082 XQ18V04. UG112, XQ18V04 XQVR1000 XQVR300 XQVR600 XQR2V1000

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95