Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00838.pdf

    • -
    • White Paper Chun Howe Sim Thermal Mechanical Application Engineer Jason Loh Thermal Mechanical Application Engineer Fanless Cooling for Embedded Applications Intel Corporation January
    • Original

    DSA00838.pdf preview Download Datasheet

    User Tagged Keywords

    37.5x37.5 82801DB 852GM 855GME Al grade 6063 heat and mass transfer INTEL fcBGA PACKAGE thermal resistance JEDEC-51-2 JEDEC51 mmx black anodized aluminum plate Shinetsu X23 ULV373 x23-7783D

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel