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AMD XC2V3000-4BG728I IC FPGA 516 I/O 728MBGA
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BG728 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
BG728 Abstract: BGG728 Text: R Molded BGA BG728/BGG728 Package PK045 (v1.1) April 13, 2006 728-BALL MOLDED BGA (BG728/BGG728) 2001, 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.	Original	PDF	BG728/BGG728) PK045 728-BALL BG728 BGG728
Untitled Abstract: No abstract text available Text: R Plastic BGA BG728 Package PK045 (v1.0) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.	Original	PDF	BG728) PK045
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
XQR2V3000-4CG717V Abstract: XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000 Text: R < B L QPro Virtex-II 1.5V Radiation-Hardened QML Platform FPGAs DS124 v1.2 December 4, 2006 Product Specification Summary of Radiation Hardened QPro Virtex-II Features • • • • • • • • • • • • • Industry First Radiation Hardened Platform FPGA	Original	PDF	DS124 MIL-PRF-38535 XQR2V3000-4CG717V XQR2V1000-4BG575R XQR2V6000-4CF1144H XQR2V3000-4CG717M XQR2V1000-4BG575N AH165 CG717 XQR2V3000-4BG728R XQR2V1000-4FG456R XQR2V6000
CLK180 Abstract: MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver Text: Application Note: Virtex-II Series R 644-MHz SDR LVDS Transmitter/Receiver Author: Ed McGettigan XAPP622 v1.2 July 2, 2002 Summary This application note describes single data rate (SDR) transmitter and receiver interfaces operating at up to 644 MHz, using 17 Low-Voltage Differential Signaling (LVDS) pairs (one	Original	PDF	644-MHz XAPP622 XC2V3000-FF1152 CLK180 MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver
XC2V1000 Pin-out Abstract: Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V1500 XC2V250 XC2V40 XC2V500 Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031-1 v1.7 October 2, 2001 Advance Product Specification Summary of Virtex -II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates	Original	PDF	DS031-1 18-Kbit 18-bige. XC2V1500 FG676 FF1152, FF1517, BF957 DS031-3, DS031-1, XC2V1000 Pin-out Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V250 XC2V40 XC2V500
datasheet transistor said horizontal tt 2222 Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
12x12 bga thermal resistance Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations	Original	PDF	UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
FG676 Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
1156-BALL Abstract: bga 896 411PI BF957 132-ball package Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns	Original	PDF	Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package
MS-034-AAn-1 Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
BG5751 Abstract: No abstract text available Text: R Using Single-Ended SelectI/O Resources Summary The Virtex-II FPGA series includes a highly configurable, high-performance single-ended SelectI/O resource that supports a wide variety of I/O standards. The SelectI/O resource includes a robust set of features, including programmable control of output drive strength,	Original	PDF	UG002 BG5751
XQ2V1000-4FG456N Abstract: XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 CF1144 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000 Text: ds122_1_1.fm Page 1 Wednesday, January 7, 2004 9:15 PM QPro Virtex-II 1.5V Military QML Platform FPGAs R DS122 v1.1 January 7, 2004 Product Specification Summary of QPro Virtex™-II Features • • • • • • • • Industry First Military Grade Platform FPGA Solution	Original	PDF	DS122 MIL-PRF-38535 CF1144 XQ2V1000-4FG456N XQ2V1000 Virtex Qpro xq2v1000-4bg575n CG717 matrix m21 vhdl code for carry select adder using ROM XQ2V1000-4BG XQ2V3000
wireless encrypt Abstract: BF957 Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031 v1.1 December 6, 2000 Advance Product Specification Summary of Virtex -II Features • • Industry First Platform FPGA solution IP-Immersion architecture - Densities from 40K to 10M system gates	Original	PDF	DS031 18-Kbit wireless encrypt BF957

FF1152 Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package Text: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428	Original	PDF	FG256 FG456 FG676 BG575 BG728 FF896 FF1152 FF1517 CS144 UG002 UG002 BF957 led flip-chip BGA Package
ra1613 Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations	Original	PDF	210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
XC2V1500 Abstract: XC2V80 XC2V1000 XC2V2000 XC2V250 XC2V40 XC2V500 lightning event counter AF124 XC2V4000 Text: Virtex -II Platform FPGAs: Introduction and Overview R DS031-1 v1.9 September 26, 2002 Advance Product Specification Summary of Virtex-II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates	Original	PDF	DS031-1 18-bit 18-bit BG728 DS031-4 XC2V1500 XC2V80 XC2V1000 XC2V2000 XC2V250 XC2V40 XC2V500 lightning event counter AF124 XC2V4000
BG728 Abstract: CS144 FG256 FG676 xc2v1000 AE38 65B11 AF124 J377 Model 435 load cell Text: Virtex -II Platform FPGAs: Complete Data Sheet R DS031 October 14, 2003 Product Specification This document includes all four modules of the Virtex-II Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics	Original	PDF	DS031 DS031-1 DS031-3 DS031-2 CS144) FG256) BG728) FF1152) BF957) DS031-4 BG728 CS144 FG256 FG676 xc2v1000 AE38 65B11 AF124 J377 Model 435 load cell
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
17x17 bga thermal resistance Abstract: BG728 12x12 bga thermal resistance Text: R Thermal Data Thermal Considerations Due to the variety of applications in which Virtex-II FPGA devices are likely to be used, it is traditionally a challenge to predict the power requirements, and thus the thermal management needs, of a particular application. Virtex-II devices in general are	Original	PDF	UG002 17x17 bga thermal resistance BG728 12x12 bga thermal resistance
Untitled Abstract: No abstract text available Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031-3 v1.5 April 23, 2001 Advance Product Specification Virtex -II Electrical Characteristics Virtex-II devices are provided in -4, -5, and -6 speed grades, with -6 having the highest performance. commercial device). However, only selected speed grades	Original	PDF	DS031-3 XC2V1500 FG676 DS031-3, DS031-4, DS031-1, DS031-2, DS031-4
bt 1696 Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are	Original	PDF
vhdl code for rsa Abstract: vhdl code for lvds driver 3x3 multiplier USING PARALLEL BINARY ADDER verilog code for An Efficient FPGA Implementation of Binary Coded Decimal Digit Adders and Multipli jesd B100 SelectRAM vhdl code for lvds receiver verilog code for lvds driver CLK180 XC2V2000 Text: R Chapter 2 Design Considerations 1 Summary This chapter covers the following topics: • Using Global Clock Networks • Using the Digital Clock Manager DCM • Using Block SelectRAM Memory • Using Distributed SelectRAM Memory • Using Shift Register Look-Up Tables	Original	PDF	8b/10b UG002 vhdl code for rsa vhdl code for lvds driver 3x3 multiplier USING PARALLEL BINARY ADDER verilog code for An Efficient FPGA Implementation of Binary Coded Decimal Digit Adders and Multipli jesd B100 SelectRAM vhdl code for lvds receiver verilog code for lvds driver CLK180 XC2V2000

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AMD XC2V3000-4BG728I

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BG728 Datasheets Context Search

BG728

Untitled

qfn 3x3 tray dimension

XQR2V3000-4CG717V

CLK180

XC2V1000 Pin-out

datasheet transistor said horizontal tt 2222

12x12 bga thermal resistance

FG676

1156-BALL

MS-034-AAn-1

BG5751

XQ2V1000-4FG456N

wireless encrypt

FF1152

ra1613

XC2V1500

BG728

xilinx topside marking

xilinx part marking

17x17 bga thermal resistance

Untitled

bt 1696

vhdl code for rsa