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    A0220 Search Results

    A0220 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    TPS7A0220PDQNR Texas Instruments 200mA, nanopower-IQ (25 nA), low-dropout (LDO) voltage regulator with enable 4-X2SON -40 to 125 Visit Texas Instruments Buy
    TPS7A0220PDBVR Texas Instruments 200mA, nanopower-IQ (25 nA), low-dropout (LDO) voltage regulator with enable 5-SOT-23 -40 to 125 Visit Texas Instruments Buy
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    A0220 Price and Stock

    Texas Instruments TPS7A0220PDQNR

    IC REG LINEAR 2V 200MA 4X2SON
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey TPS7A0220PDQNR Cut Tape 3,077 1
    • 1 $0.69
    • 10 $0.491
    • 100 $0.3853
    • 1000 $0.32999
    • 10000 $0.32999
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    TPS7A0220PDQNR Digi-Reel 3,077 1
    • 1 $0.69
    • 10 $0.491
    • 100 $0.3853
    • 1000 $0.32999
    • 10000 $0.32999
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    TPS7A0220PDQNR Reel 3,000 3,000
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    • 10000 $0.31384
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    Mouser Electronics TPS7A0220PDQNR 3,676
    • 1 $0.69
    • 10 $0.441
    • 100 $0.359
    • 1000 $0.33
    • 10000 $0.295
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    Ameya Holding Limited TPS7A0220PDQNR 175,286
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    Texas Instruments TPS7A0220PDBVR

    IC REG LINEAR 2V 200MA SOT23-5
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    DigiKey TPS7A0220PDBVR Digi-Reel 992 1
    • 1 $1.3
    • 10 $0.946
    • 100 $0.7588
    • 1000 $0.66056
    • 10000 $0.66056
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    TPS7A0220PDBVR Cut Tape 992 1
    • 1 $1.3
    • 10 $0.946
    • 100 $0.7588
    • 1000 $0.66056
    • 10000 $0.66056
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    Mouser Electronics TPS7A0220PDBVR 1,905
    • 1 $0.94
    • 10 $0.831
    • 100 $0.674
    • 1000 $0.674
    • 10000 $0.273
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    Ameya Holding Limited TPS7A0220PDBVR 117,604
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    Microchip Technology Inc DSC6001HE2A-022.0000

    MEMS OSC XO 22.0000MHZ CMOS SMD
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    DigiKey DSC6001HE2A-022.0000 Bag 793 1
    • 1 $1.04
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    Bristol Electronics DSC6001HE2A-022.0000 700
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    NAC DSC6001HE2A-022.0000 Bag 1
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    Microchip Technology Inc DSC6001HI2A-022.0000

    MEMS OSC XO 22.0000MHZ CMOS SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DSC6001HI2A-022.0000 Bag 775 1
    • 1 $1.3
    • 10 $1.3
    • 100 $1.3
    • 1000 $1.3
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    NAC DSC6001HI2A-022.0000 Bag 300
    • 1 $1.29
    • 10 $1.29
    • 100 $1.17
    • 1000 $1.05
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    Master Electronics DSC6001HI2A-022.0000
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    Vishay Sfernice RCMA0220001FEA20

    SFERNICE FIXED RESISTORS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey RCMA0220001FEA20 Ammo Pack 500 500
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    • 1000 $17.95124
    • 10000 $17.95124
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    RCMA0220001FEA20 Cut Tape 500 1
    • 1 $35.35
    • 10 $22.572
    • 100 $17.9512
    • 1000 $17.9512
    • 10000 $17.9512
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    Find more A0220 price and stock on Findchips.com

    A0220 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Protection Relays & Controls ARC Detectors A0220 Description Arc Detecting Point Sensor The A0220 Arc Detector is a photo electric sensor. It has a sensitive area of 180˚. Sensor signal is a mA current signal of 0.5 mA / klux. The sensor includes 10 m of shielded


    Original     		PDF A0220 A0220 D0100, D0900, D0910, D0920, D1000 PGR-8800

    VN10K

    Abstract: No abstract text available
    Text: VN10K Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN10K 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		PDF VN10K VN10K A022009

    2N7000

    Abstract: No abstract text available
    Text: 2N7000 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7000 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF 2N7000 2N7000 A022009

    TN2124

    Abstract: No abstract text available
    Text: TN2124 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2124 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF TN2124 TN2124 A022009

    Untitled

    Abstract: No abstract text available
    Text: bulgin a brand of Elektron Technology Mains Filters Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with two attenuation options –


    Original     		PDF 136-137ith PX0587, PX0587/SE, PX0588 PS25/Axx20/xx00 PS26/Axx20/xxxx PS25/A0220/xx

    A0100

    Abstract: No abstract text available
    Text: 65 & 100 Amp Filter Connector Female Power Connector ACARA ORDERING INFORMATION Crimp Termination Pre-wired Termination Part Number AFC065-PC/4AWG AFC065-PC/6AWG AFC065-PC/M25 AFC065-PC/M16 AFC100-PC/2AWG AFC100-PC/4AWG AFC100-PC/M35 AFC100-PC/M25 C/M25


    Original     		PDF fC065-PC/6AWG AFC065-PC/M25 AFC065-PC/M16 AFC100-PC/2AWG AFC100-PC/4AWG AFC100-PC/M35 AFC100-PC/M25 AFC065-PE/020 AFC065-PE/030 AFC065-PE/050 A0100

    3.5mm female 5 pole pcb mount

    Abstract: Tyco PBT 007 298-08-01100 PM318MOOLSC Socket strip 2x3 0.1 inch 701-23-02107 PM208FOOLOO 701-13-02107 Tyco ELCON Drawer Series Connectors EMC 2309 power supply connector
    Text: Anderson Power Products Index Anderson Power Products®, an ISO 9001:2000 certified company, is a world leader in the design and manufacture of quick-disconnect power connectors. Our connectors are rated from 30 amps to 450 amps and up to 250 or 600 volts, AC/DC and comply with major worldwide specifications. With over one hundred years of power connection


    Original     		PDF

    2N6660

    Abstract: 2N6660-1
    Text: 2N6660 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6660 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF 2N6660 2N6660 A022009 2N6660-1

    VN0808

    Abstract: No abstract text available
    Text: VN0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN0808 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF VN0808 VN0808 A022009

    TN2130

    Abstract: No abstract text available
    Text: TN2130 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2130 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF TN2130 TN2130 A022009

    VP2106

    Abstract: No abstract text available
    Text: VP2106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VP2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF VP2106 VP2106 A022009

    B1000

    Abstract: No abstract text available
    Text: 150 & 250 Amp p Filter Connector Female Power Connector lim ry ina Pre ACARA Pre-wired Termination Part Number AFC150-PC/2/0 AFC150-PC/1/0 AFC150-PC/M70 AFC150-PC/M50 AFC250-PC/4/0 AFC250-PC/2/0 AFC250-PC/M95 AFC250-PC/M70 Part Number AFC150-PE/020 AFC150-PE/030


    Original     		PDF AFC150-PC/1/0 AFC150-PC/M70 AFC150-PC/M50 AFC250-PC/4/0 AFC250-PC/2/0 AFC250-PC/M95 AFC250-PC/M70 AFC150-PE/020 AFC150-PE/030 AFC150-PE/050 B1000

    2n6661 bonding pad lay-out

    Abstract: 2N6661
    Text: 2N6661 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6661 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF 2N6661 2N6661 A022009 2n6661 bonding pad lay-out

    2N7002 Die Specification

    Abstract: 2N7002
    Text: 2N7002 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7002 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF 2N7002 2N7002 A022009 2N7002 Die Specification

    d46b

    Abstract: k399 a06407 p935 a0540 7F39 q231 ML-ND M315 50436
    Text:  !"#$%&' & >+17-0.,G,(B(H!"#$%&%'(" * )$AI%@A'D,J!$A@K@A')@L% MLN$D,%LB!"#$%&'(& A:7402+1O7,A0./-1234-0. N34+ P= !>@O7,A0./-1234-0. A0./-12+6,P= !1+<31+6,P= !"#$%&'#%&#()%"(*)#+(*,&-+./,)0. ,"CD@,JI@%,QNB,&CJA@$%A$RP'J$N,@%NSJ)Q@'D ,!'QTCIJ@%AISC)'@U'%CQBLBAB


    Original     		PDF -B502B4? 6-741-E I-7401= E0316b d46b k399 a06407 p935 a0540 7F39 q231 ML-ND M315 50436

    A01103

    Abstract: A020 Herotek A0105116A A0105216A A0105316A A0215115A herotek, a01202
    Text: MINIATURE WIDEBAND RF AMPLIFIERS 0.1 – 2.0 GHz FEATURES • More Than One Octave Band Frequency Range • Small Size With Removable Connectors for Drop-In Integration • Low Power Consumption Options • Flat Gain Response • Internal Regulator Circuit for Unregulated Power


    Original     		PDF 100mW A0220105A A0220205A A0220305A A0120106A A0120206A A0120306A 0606-3-1B A01103 A020 Herotek A0105116A A0105216A A0105316A A0215115A herotek, a01202

    DN3145

    Abstract: No abstract text available
    Text: DN3145 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) DN3145 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF DN3145 DN3145 A022009

    2N7008

    Abstract: No abstract text available
    Text: 2N7008 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7008 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF 2N7008 2N7008 A022009

    VN2106

    Abstract: No abstract text available
    Text: VN2106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		PDF VN2106 VN2106 A022009

    7408, 7404, 7486, 7432

    Abstract: RF400U functional diagram of 7400 and cd 4011 ls 7404 180 nm CMOS standard cell library TEXAS INSTRUMENTS 74191 4BITS s273 buffer 74374 7408 CMOS cmos 7404
    Text: TGC100 Series CMOS Gate Arrays RELEASE 3.0, REVISED JANUARY 1990 • Twelve Arrays with up to 26K Available Gates • Fast Prototype Turnaround Time • Extensive Design Support - Design Libraries Compatible with Daisy, Valid, and Mentor CAE Systems - Tl Regional ASIC Design Centers


    OCR Scan     		PDF TGC100 20-mA Sink/12mA TDB10LJ 120LJ TDC11LJ TDN11LJ 100MHz 7408, 7404, 7486, 7432 RF400U functional diagram of 7400 and cd 4011 ls 7404 180 nm CMOS standard cell library TEXAS INSTRUMENTS 74191 4BITS s273 buffer 74374 7408 CMOS cmos 7404

    HY53C464LS

    Abstract: HY53C464F hy53c464 hy53c464lf HY53C464LF70 HY53C464S An-313
    Text: HY53C464 Seríes " H Y U N D A I 64K X 4-bit CMOS DRAM DESCRIPTION Hie HY53C464 is fast dynamic RAM organized 65,536 x 4-bit. The HY53C464 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.


    OCR Scan     		PDF HY53C464 330mil 18pin CMO442) 335ie P-021 A02-20-MA HY53C464LS HY53C464F hy53c464lf HY53C464LF70 HY53C464S An-313

    434 289

    Abstract: 54175 S085 54151 gen 24lJ IPI04LJ NA220 DTB20
    Text: TGC100M MILITARY SERIES 1-/im CMOS GATE ARRAYS Release 2.0, A PR IL 1989 * AC PERFORMANCE TEST STRUCTURE Fully Characterized for M ilitary Applications — Product Fully Compliant w ith the Requirements of M IL -S T D -883 Paragraph 1.2.1 Is Available — Production Processing Is in Accordance


    OCR Scan     		PDF TGC100M 0010LJ LH110LJ 434 289 54175 S085 54151 gen 24lJ IPI04LJ NA220 DTB20

    TSC500

    Abstract: 324 EZ 948 BU221 bf063 ST EZ 728 358 ez 802 bfs 417 130 nm CMOS standard cell library ST BF080 bf068
    Text: TSC500 SERIES 1-pm CMOS STANDARD CELLS RELEASE 1.2, APRIL 1989 • High-Performance, 1-pin EPIC CMOS Efficiently Achieves System-Level Designs BOND PAD COMPILER RAM MSI FUNCTION • TSC500 Library Includes Macros for - Static RAMs, Register Files - First-In First-Out Memories


    OCR Scan     		PDF TSC500 64-mA TP000LJ TP006LJ TP008LJ TP009LJ TP010LJ 324 EZ 948 BU221 bf063 ST EZ 728 358 ez 802 bfs 417 130 nm CMOS standard cell library ST BF080 bf068

    HY53C464LS

    Abstract: LASCR HY53C464S HY53C464 MCS131 MAY94 HY53C464LF HY53C464LS70 hy53c464lf70
    Text: HY53C464 Series »HYUNDAI 64K X 4-bit CMOS DRAM DESCRIPTION The HY53C464 is feist dynamic RAM organized 65,536 x 4-bit. The HY53C464 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.


    OCR Scan     		PDF HY53C464 330mil 18pin 1AA02-20-MAY94 4b750flà HY53C464S HY53C464LS LASCR MCS131 MAY94 HY53C464LF HY53C464LS70 hy53c464lf70