BGA256 17 X 17
Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Text: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape
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BGA256:
OT811-1
MS-034
BGA256 17 X 17
BGA256
MS-034
BGA-256
sot811
BGA256 17
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e
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BGA256:
OT811-1
MS-034
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PDF
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BGA256
Abstract: BGA256 17 X 17 STLC8100 STLC8201 BGA256 1700
Text: STLC8201 DUAL BAND WIRELESS LAN BASEBAND PROCESSOR DATA BRIEF 1 • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ FEATURES Tri Mode 802.11a 802.11g and 802.11b compliant. AgileRF allows fully automated roaming between different modes.
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STLC8201
BGA256
BGA256 17 X 17
STLC8100
STLC8201
BGA256 1700
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CE51484
Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.
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CG/CE46
CG/CE51
S-19176
ASIC-TB-20033-9/95
CE51484
micron 100 ball BGA
BGA256
BGA 256 PACKAGE power dissipation
CG51114
BGA352
BGA576
CE51364
CG51284
BGA-576
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PDF
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BGA256
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA256:
OT471-1
BGA256
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PDF
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D 2395
Abstract: BGA256 17 X 17 BGA256 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L
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BGA256:
OT471-1
MS-034
D 2395
BGA256 17 X 17
BGA256
MS-034
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PDF
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sot471
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT471-1
sot471
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x
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BGA256:
OT471-1
MS-034
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PDF
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BGA256
Abstract: sot466 BGA256 17 X 17
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT466-1
BGA256
sot466
BGA256 17 X 17
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PDF
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BGA256
Abstract: BGA256 17 X 17
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA256:
OT466-1
BGA256
BGA256 17 X 17
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PDF
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ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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ADV0505
and14
12C-0707-E19
12F-1111-119
1F3-1313-D19
1F1-1717-A19
12U-1919-G19
12Y-2323-919
12Y-3333-419
12Y-3535-419
ADV0505
FBGA-484
daewon tray
daewon
FBGA672
PEAK TRAY bga
1f1-1717-a19
12C-0707-E19
FBGA256
Daewon BGA 7x7
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PDF
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BGA256
Abstract: MS-034 BGA256 17 X 17 BGA-256 BGA256 17
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L
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BGA256:
OT466-1
MS-034
ED-7311-9A
BGA256
MS-034
BGA256 17 X 17
BGA-256
BGA256 17
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PDF
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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PDF
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PCB layout guidelines for NXP MCUs in BGA packages
Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,
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AN10778
LPC175x,
LPC176x,
LPC177x,
LPC178x,
LPC181x,
LPC182x,
LPC183x,
LPC185x,
LPC431x,
PCB layout guidelines for NXP MCUs in BGA packages
LBGA256
AN10778
LPC2468 reflow solder profile
land pattern for TSOP 2 54 pin
NXP lpc
LPC175x
LFBGA256
lpc433x
TSOP 54 land pattern
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PDF
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MB86297A
Abstract: power generation POWER COMMAND Hmi 211 MB87P2020-A MB88F332 mercedes 352 LQFP256 GPU board diagram D-68307 yuv422 RGB gdc tv tuner
Text: PRODUCT OVERVIEW GRAPHICS SOLUTIONS GRAPHICS SOLUTIONS Graphics Controllers & Development Tools PRODUCT OVERVIEW GRAPHICS SOLUTIONS Copyright 2009 Fujitsu Limited Tokyo, Japan and Fujitsu Microelectronics Europe GmbH. Designed and produced in the UK. Printed on
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ARM926EJ-S
FME-G04-0209
MB86297A
power generation POWER COMMAND Hmi 211
MB87P2020-A
MB88F332
mercedes 352
LQFP256
GPU board diagram
D-68307
yuv422 RGB
gdc tv tuner
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PDF
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ATMEL 420
Abstract: HIGH VOLTAGE SCR 6kv C51 Microcontroller nds videoguard iso7816 Smart Cards Reader AT83c26 at91so101 nds smart card security AT89STK-09 QFN64
Text: MICROCONTROLLER Contact Smart Card Readers ICs INTEGRATED SOLUTIONS Compliant with Major Industry Standards EMV , PC/SC Workgroup, WHQL, ISO 7816, GSM 11.11 Atmel offers a wide range of smart card readers ICs. Compliant with major industry standards, they provide easy-to-implement and
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4007E-SCR-01/06/3M
AT83C24
ATMEL 420
HIGH VOLTAGE SCR 6kv
C51 Microcontroller
nds videoguard
iso7816 Smart Cards Reader
AT83c26
at91so101
nds smart card security
AT89STK-09
QFN64
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PDF
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AMR926EJ-S
Abstract: MB86R03 MB86298 MB88F332 MB86R02 1280x480 MB86297 schematic diagram lcd monitor fujitsu MB86R01 starterkit TOP227
Text: FUJITSU GDCs QUESTIONS & ANSWERS FUJITSU SEMICONDUCTOR AMERICA, Inc. Revision 1.7 July 2010 Revision History Date Version Page Change Count July 2010 1.7 64 May 12, 2009 1.6 65 Apr 23, 2008 1.5 65 July 17, 2007 1.4 59 Reformatting and reorganization, MB86R02,
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MB86R02,
MB86R03,
MB86298
MB88F332
MB86R01
MB86276,
MB86277,
MB86291
QFP208,
MB86292,
AMR926EJ-S
MB86R03
MB88F332
MB86R02
1280x480
MB86297
schematic diagram lcd monitor fujitsu
MB86R01 starterkit
TOP227
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PDF
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SAA7136E
Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
Text: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders
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SAA7130H
SAA7134H
SAA7133H
SAA7135H
SAA7131E
SAA7136E
SAA7136HS
OT425
LQFP128)
SAA7136E
saa7136
SAA7135
TO-220F JEDEC
SAA7134
hso16
philips SAA7134
SAA7131E
Philips SAA7130
SAA7133
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PDF
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CG46533
Abstract: . rp 700 pc -24 CG46833 CG46134 SQFP100 CE46F10 CE46F20 CE46F30 CE46F40 CE46F50
Text: FUJITSU Novem ber 1995 Edition 1.5 DATA SHEET '• CG/CE46 0.65 Micron High Performance, Low Power CMOS Gate Arrays Description The Fujitsu CG46 is a high performance, 0.65 im drawn channel length, digital CMOS gate array family. The CE46 is a 0.65 urn drawn channel length, digital CMOS embedded gate array
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OCR Scan
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CG/CE46
CG/CE46
374175b
001173b
CG46533
. rp 700 pc -24
CG46833
CG46134
SQFP100
CE46F10
CE46F20
CE46F30
CE46F40
CE46F50
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PDF
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RFPP
Abstract: No abstract text available
Text: ICs for Communications Interworking Element IWE8 PXB 4220 Version 2.0 Preliminary Delta Sheet 07.97 T4220-XV20-L1-7600 PXB 4220 Revision History: Current Version: 07.97 Previous Version: Preliminary Data Sheet 11.96 Page in previous Version Page (in new
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T4220-XV20-L1-7600
0000H
RFPP
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sfh g15
Abstract: BGA256 PI5X1018 diode v6 N9
Text: PI5X1018
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PI5X1018
18-Bit,
10-Port
10-way
Ultra4321
256-Pin
50Max.
PI5X1018NA
NA256)
PS8365E
sfh g15
BGA256
PI5X1018
diode v6 N9
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PDF
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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Untitled
Abstract: No abstract text available
Text: PI5X1018
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PI5X1018
18-Bit,
10-Port
10-way
25ohm
256-Pin
50Max.
PI5X1018NA
NA256)
PS8365E
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PDF
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hitachi sh3
Abstract: fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller
Text: MICROCONTROLLER WORKSHOPS Graphic Controller 1 1 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com 1 PC graphics sets standards 2 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com
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30-Jan-01
hitachi sh3
fujitsu fr-v
HQFP208
HQFP256
MB86290A
MB86291
MB87J2120
uPD72254Y
bga256 power dissipation
Bluetooth Base band controller
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PDF
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