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    SMC Corporation of America JCDQ32-40

    CYLINDER, COMPACT GLOBAL, DBL ACT, SGL ROD, JCQ SERIES | SMC Corporation JCDQ32-40
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    RS JCDQ32-40 Bulk 5 Weeks 1
    • 1 $94.13
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    SMC Corporation of America JCDQ32-45

    CYLINDER, COMPACT GLOBAL, DBL ACT, SGL ROD, JCQ SERIES | SMC Corporation JCDQ32-45
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS JCDQ32-45 Bulk 5 Weeks 1
    • 1 $97.13
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    SMC Corporation of America JCDQ32-40-M9BL

    CYLINDER, COMPACT GLOBAL, DBL ACT, SGL ROD, JCQ SERIES | SMC Corporation JCDQ32-40-M9BL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS JCDQ32-40-M9BL Bulk 5 Weeks 1
    • 1 $238.88
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    DQ324 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply


    Original     		PDF AS4DDR32M72PBG1 32Mx72 333Mbps 23mm-1 208-PBGA

    Untitled

    Abstract: No abstract text available
    Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M72PBG 32Mx72 AS4DDR232M72PBG

    ACT-D16M96S

    Abstract: BSA1 BS-B1
    Text: Standard Products ACT-D16M96S High Speed 16MegaBit x 96 3.3V Synchronous DRAM Multichip Module May 29, 2007 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ Six 6 low power 4M x 16 x 4 banks Synchronous Dynamic Random Access Memory chips in one MCM


    Original     		PDF ACT-D16M96S 16MegaBit 50-MHz 192-cycle SCD3370 BSA1 BS-B1

    Untitled

    Abstract: No abstract text available
    Text: MEMORY MODULE DDR2 SDRam 128Mx72-BGA 3D2D8G72UB3369 DDR2 Synchronous Dynamic Ram 8Gbit DDR2 SDRam organized as 128Mx72, based on 128Mx16 MODULE Pin Assignment Top View BGA 208 - (11x19 - Pitch 1.00mm) (TOP VIEW - VIEWED BY TRANSPARENCY) 11 10 9 8 7 6 5 4


    Original     		PDF 128Mx72-BGA 3D2D8G72UB3369 128Mx72, 128Mx16 11x19 128Mx72 MMXX00000000XXX 3DFP-0369-REV

    Untitled

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    BA5 marking

    Abstract: DQ112-127 BA7 marking HMD4M144D9WG DQ113 BA6 marking BA6137 DQ99
    Text: HANBit HMD4M144D9WG 64Mbyte 4Mx144 200-pin ECC Mode 4K Ref. DIMM Design 5V Part No. HMD4M144D9WG GENERAL DESCRIPTION The HMD4M144D9WG is a 4Mbit x 144bit dynamic RAM high-density memory module. The module consists of eight CMOS 4Mx16bit DRAMs in 50-pin TSOP packages and one CMOS 4M x 16bit DRAM in 50pin TSOP package


    Original     		PDF HMD4M144D9WG 64Mbyte 4Mx144) 200-pin HMD4M144D9WG 144bit 4Mx16bit 50-pin 16bit BA5 marking DQ112-127 BA7 marking DQ113 BA6 marking BA6137 DQ99

    100MHZ

    Abstract: 133MHZ WED3DL644V
    Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by


    Original     		PDF WED3DL644V 4Mx64 WED3DL644V 4x1Mx64. 4Mx16 133MHZ, 125MHZ 100MHZ. 100MHZ 133MHZ

    W72M64V-XBX

    Abstract: No abstract text available
    Text: W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Preliminary FEATURES ! Access Times of 100, 120, 150ns ! Unlock Bypass Program command ! Packaging • Reduces overall programming time when issuing multiple program command sequences


    Original     		PDF W72M64V-XBX 2Mx64 150ns 13x22mm 100ns 120ns W72M64V-XBX

    W78M64VP-XSBX

    Abstract: W78M64VP
    Text: White Electronic Designs W78M64VP-XSBX 8Mx64 Flash 3.3V Page Mode Multi-Chip Package FEATURES  Secured Silicon Sector region  Access Times of 110, 120ns • 128-word sector for permanent, secure identification through an 8-word random Electronic


    Original     		PDF W78M64VP-XSBX 8Mx64 120ns 13x22mm W78M64VP-XSBX W78M64VP

    AS4DDR264M72PBG

    Abstract: AS4DDR232M72APBG
    Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M72APBG 32Mx72 AS4DDR264M72PBG AS4DDR232M72APBG

    AS4DDR264M72PBG

    Abstract: H11M1
    Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG1 64Mx72 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • Proprietary Enchanced Die Stacked iPEM


    Original     		PDF AS4DDR264M72PBG1 64Mx72 dat008 AS4DDR264M72PBG H11M1

    m5e8

    Abstract: No abstract text available
    Text: iPEM 4.2 Gb SDRAM-DDR2 AS4DDR264M64PBG1 64Mx64 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES 58% Space Savings 49% I/O reduction vs Individual CSP approach Reduced part count Reduced trace lengths for lower parasitic


    Original     		PDF AS4DDR264M64PBG1 64Mx64 m5e8

    Untitled

    Abstract: No abstract text available
    Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR264M72PBG 64Mx72 AS4DDR264M72PBG

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W78M64V-XSBX PRELIMINARY 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing


    Original     		PDF W78M64V-XSBX 8Mx64 120ns 13x22mm 8Mx64, 2x8Mx32 4x8Mx16

    bsc 60h

    Abstract: No abstract text available
    Text: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging • • 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing


    Original     		PDF W72M64V-XBX 2Mx64 150ns 13x22mm 2x2Mx32 100ns 120ns 150ns bsc 60h

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    AS4DDR232M72PBG

    Abstract: AS4DDR264M72PBG
    Text: i PEM 2.4 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M72PBG 32Mx72 AS4DDR232M72PBG AS4DDR264M72PBG

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    000FFFFH

    Abstract: 0x0055
    Text: White Electronic Designs W78M64VP-XSBX *ADVANCED 8Mx64 Flash 3.3V Page Mode Multi-Chip Package FEATURES  Secured Silicon Sector region  Access Times of 110, 120ns • 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random


    Original     		PDF W78M64VP-XSBX 8Mx64 120ns 13x22mm 128KB 000FFFFH 0x0055

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by


    Original     		PDF WED3DL644V 4Mx64 WED3DL644V 4x1Mx64. 4Mx16 133MHZ, 125MHZ 100MHZ.

    Untitled

    Abstract: No abstract text available
    Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR264M72PBG 64Mx72 AS4DDR264M72PBG

    Untitled

    Abstract: No abstract text available
    Text: iPEM 4.2 Gb SDRAM-DDR2 AS4DDR264M64PBG1 64Mx64 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • Proprietary Enchanced Die Stacked iPEM


    Original     		PDF AS4DDR264M64PBG1 64Mx64 AS4DDR264M64PBG1

    AS4DDR232M72APBG

    Abstract: No abstract text available
    Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS  DDR2 Data rate = 667, 533, 400  Available in Industrial, Enhanced and Military Temp  Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M72APBG 32Mx72 AS4DDR232M72APBG 2010Preliminary