Untitled
Abstract: No abstract text available
Text: Package Outline 25-Ball fpBGA Package Outline GA 5.70x5.00mm body, 1.20mm height (max), 0.75mm pitch D 7 6 5 4 3 2 1 Note 2 A B Terminal A1 Corner Index Area (D/4 x E/4) Note 1 SE E C E1 D e E F e D1 Top View SD Bottom View View B A2 Seating Plane A A1 Φb
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25-Ball
DSPD-25fpBGAGA
B092208
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Untitled
Abstract: No abstract text available
Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 69% space savings vs. FPBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB
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FPBGA
Abstract: ga 25 diode M918 package diode
Text: Tape and Reel Specification M918 Tape and Reel Option Fine Pitch Ball Grid Array Package GA 25 / 26 Ball W P Direction of Feed Package Suffix Package Type GA fpBGA 050708 Ball Count Tape Width (W) 25 12 26 16 (mm) Pocket Pitch (P) Reel Diameter Units per Reel
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GSDC048U
Abstract: GSDC048GU
Text: GSDC048U 48-Bump BGA 6 mm x 8 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 48-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—48-Bump FPBGA (Package U)
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GSDC048U
48-Bump
Dimensions--48-Bump
SDC048U
GSDC048GU
GSDC048U
GSDC048GU
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PDF
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GSDC165AE
Abstract: GSDC165GAE
Text: GSDC165AE 165-Bump BGA 15 mm x 17 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package E)
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GSDC165AE
165-Bump
Dimensions--165-Bump
GSDC165GAE
GSDC165AE
GSDC165GAE
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GSDC119B
Abstract: BGA14 GSDC119GB
Text: GSDC119B 119-Bump BGA 14 mm x 12 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 119-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—119-Bump FPBGA (Package B, Variation 2)
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GSDC119B
119-Bump
Dimensions--119-Bump
GSDC119GB
GSDC119B
BGA14
GSDC119GB
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GSDC165D
Abstract: GSDC165GD BGA L
Text: GSDC165D 165-Bump BGA 13 mm x 15 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package D)
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GSDC165D
165-Bump
Dimensions--165-Bump
GSDC165GD
GSDC165D
GSDC165GD
BGA L
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Untitled
Abstract: No abstract text available
Text: ispXPGA Evaluation Board User’s Guide October 2004 ebug02_02 Lattice Semiconductor ispXPGA Evaluation Board User’s Guide Introduction The ispXPGA Evaluation Board is a versatile platform that enables the user to program, evaluate, and de-bug a design for the Lattice ispXPGA architecture. The board features a 900-ball fpBGA ispXPGA device with SMA connectors for access to the device’s High Speed Interface sysHSI™ and other I/Os. Connectors are also available to
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ebug02
900-ball
20MHz
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 625 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. Sq. 625-25AB .984 25 625-35AB .984 (25) 625-45AB .984 (25) 625-60AB .984 (25) Material: Aluminum, Black Anodized Fin Height
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625-25AB
625-35AB
625-45AB
625-60AB
625-25-T4
625-45-T4
625-60-T4
1-866-9-OHMITE
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 658 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Base Dimensions in. mm Dimension “A” in. (mm) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 658-35AB 1.100 (27.9) sq 0.350 (8.9)
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658-25AB
658-35AB
658-45AB
658-60AB
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight lbs. (grams) 624-25AB 624-35AB 624-45AB 624-60AB .827 (21)
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624-25AB
624-35AB
624-45AB
624-60AB
624-25-T4
624-35-T4
624-45-T4
624-60-T4
1-866-9-OHMITE
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PDF
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FPBGA
Abstract: No abstract text available
Text: Package Dimensions—119-Bump FPBGA Package B, Variation 3 TOP VIEW A1 1 2 3 4 5 6 BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 7 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U 20.32 22±0.10 1.27 A B C D E F G H J K L M N P R T U B SEATING PLANE
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Dimensions--119-Bump
FPBGA
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Untitled
Abstract: No abstract text available
Text: Package Dimensions—165-Bump FPBGA Package GE (MCM A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.40~0.60 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 17±0.05 1.0 A B C D E F G H
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Dimensions--165-Bump
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100-Pin Package Pin-Out Diagram
Abstract: GS71024
Text: GS71024T/U 64K x 24 1.5Mb Asynchronous SRAM TQFP, FPBGA Commercial Temp Industrial Temp Features 8, 10, 12, 15 ns 3.3 V VDD Fine Pitch BGA Bump Configuration • Fast access time: 8, 10, 12, 15 ns • CMOS low power operation: 190/160/130/110 mA at minimum cycle time.
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GS71024T/U
GS71024
GS71024Rev1
1999C
2/2000D
2/2000D;
100-Pin Package Pin-Out Diagram
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BGA 64 PACKAGE thermal resistance
Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight
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624-25AB
624-35AB
624-45AB
624-60AB
BGA 64 PACKAGE thermal resistance
BGA PACKAGE thermal resistance
624-25AB
612-Series
643-35AP
655-53AB
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HL832nxa
Abstract: VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 26-Jul-2010 15.0mm x 15.0mm x 1.7mm FPBGA-324
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A1004-04
26-Jul-2010
FPBGA-324
VPP1552BFG
VPP1552BFG8
26-Oct-2010
JESD22-A113
LBGA-167
JESD22-A118
JESD22-A104
HL832nxa
VPP1552BFG
HL832NX-A
HL-832NXA
HL832NXA-EX
GE100LFCS
HL832-NX-A
HL832
KE1250LKDS
HL832NX
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LX128
Abstract: No abstract text available
Text: ispGDX2 Data Sheet Revision History Date Version Page Change Summary April, 2003 05 - Previous Lattice release Updated Data Sheet to reflect production release of the LX64 and LX128 devices. - AC/DC Specifications - 100- and 208-ball fpBGA Logic Signal Connections
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LX128
208-ball
LX64V/B/C
330MHz
360MHz.
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Untitled
Abstract: No abstract text available
Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 69% space savings vs. FPBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB
W3H64M72E-XSBXF
SN63Pb37
SAC305
256MB"
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W3E32M72S-XSBX
Abstract: No abstract text available
Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266, 333Mbs 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply
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W3E32M72S-XSBX
32Mx72
333Mbs
333Mbs
W3E32M72S-XSBX
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Untitled
Abstract: No abstract text available
Text: Package Dimensions—165-Bump FPBGA Package E A1 CORNER TOP VIEW BOTTOM VIEW Ø0.08 M C Ø0.15 M C A B Ø0.40~0.50 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 17±0.05 1.0 A B C D E F G H I J K
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KE-G1250
Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02 DATE: 20-Nov-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers
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A0911-02
20-Nov-2009
FPBGA-176
20-Feb-2010
JESD22-A110-B
JESD22-A104-B
JESD22-A103-B
JESD22-A113
SSTE32882HLBAKG
KE-G1250
AUS308
KE-G1250 mold compound
GE100LFCS
EME-G770
SSTE32882
2025D
GE-100-LFC
HL832NX
SSTE32882HLBAKG
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EME-G770
Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02R1 DATE: 18-Dec-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers
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A0911-02R1
18-Dec-2009
FPBGA-176
20-Feb-2010
JESD22-A110-B
JESD22-A104-B
JESD22-A103-B
JESD22-A113
SSTE32882HLBAKG
EME-G770
KE-G1250
AUS308
KE-G1250 mold compound
HL832NX
GE-100-LFC
Ablestik
AUS-308
GE100LFCS
bt resin HL832NX
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Untitled
Abstract: No abstract text available
Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply
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W3E32M64S-XSBX
32Mx64
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Untitled
Abstract: No abstract text available
Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 69% space savings vs. FPBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB
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