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    Abstract: ISOPLUS247 D-68623 IXFR55N50 IXFX55N50 SIL-PAD to-247
    Text: IXAN0031 New ISOPLUS247TM Power Package Features 2500V Internal Isolation Revolutionary Approach Improves Thermal Conductance and Reliability pability because the thermal expansion coefficient IXYS Corporation has introduced a new, isoof the silicon die matches that of the DCB;


    Original
    PDF IXAN0031 ISOPLUS247TM O-247, 6RIWIDFH70 ISOPLUS247 IXFR55N50 IXFX55N50 D-68623 IXAN0031 ISOPLUS247 SIL-PAD to-247