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    PACKAGES TO247 Search Results

    PACKAGES TO247 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGES TO247 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SMD Packages

    Abstract: 8l smd SY69952 128-208L MQUAD 44L-84L 8L-10L 20L-28L 8L-16L 100L
    Text: MOISTURE SENSITIVITY CLASSIFICATION OF MICREL SMD PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 3 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL


    Original     		PDF O-220 O-247 44L-84L 128-208L O-263 32L8L TSOT-23 8L-28L 16L-28L 150X150 SMD Packages 8l smd SY69952 128-208L MQUAD 44L-84L 8L-10L 20L-28L 8L-16L 100L

    EME-6300

    Abstract: eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000
    Text: MOISTURE SENSITIVITY CLASSIFICATION OF MICREL SURFACE MOUNT PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 3 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL


    Original     		PDF O-263 SC-70 MIC2529 MIC2527 SY69952 MIC5400 EME6300 150X150 EME-6300 eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000

    transistor 12n60c

    Abstract: 12N60c equivalent 30N120D1 13N50 equivalent 12n60c MOSFET 1200v 30a MOSFET 1000v 30a 30n120d CS20-22MOF1 12N60c MOSFET
    Text: ISOPLUS Summary Title Page Isolated Discrete Packages A4 - 1 ISOPLUS247TM A4 - 2 ISOPLUS i4-PACTM A4 - 3 ISOPLUS247 – ISOPLUS i4-PACTM Isolated Discrete Packages ISOPLUS247™ is the DCB isolated version of the PLUS247™-package TO247 without a mounting hole . The design


    Original     		PDF ISOPLUS247TM ISOPLUS247TM PLUS247TM-package FBO16-08N FBE22-06N1 21-05QC 22-08N 75-01F 21-08i01 transistor 12n60c 12N60c equivalent 30N120D1 13N50 equivalent 12n60c MOSFET 1200v 30a MOSFET 1000v 30a 30n120d CS20-22MOF1 12N60c MOSFET

    IXAN0022

    Abstract: KU4-499 KU4-495 KU4-498 isoplus ixys cross KU4499 isoplus ixys mounting KU3-381 4490 mosfet
    Text: IXAN0022 Capitalizing on the Advantages of ISOPLUS Products Introduction IXYS Corporation offers unique power packages with internal isolation, and performance and reliability advantages. The IXYS isolated packages include ISOPLUS220TM, ISOPLUS247TM, ISOPLUS


    Original     		PDF IXAN0022 ISOPLUS220TM, ISOPLUS247TM, ISOPLUS264 ISOPLUS220, ISOLPUS247 advantKU4-498/X ISOPLUS220 KU4-498/X O-247 IXAN0022 KU4-499 KU4-495 KU4-498 isoplus ixys cross KU4499 isoplus ixys mounting KU3-381 4490 mosfet

    DO247

    Abstract: K 1603 to-220 QSOP24 QSOP28 SSOP20 SSOP24 TSSOP24 TSSOP28 PD0022 Package and Packing Information ST SMC
    Text: PD0022 Packing information Axial, Throuh hole, Surface mount and Chip scale packages for IPAD , Protection, Rectifiers, Thyristors and ACSwitches 1 Tape and reel delivery mode 1.1 Tape dimensions for Surface mount packages Table 1. Surface mount devices all dimensions in millimeters


    Original     		PDF PD0022 DO247 K 1603 to-220 QSOP24 QSOP28 SSOP20 SSOP24 TSSOP24 TSSOP28 PD0022 Package and Packing Information ST SMC

    PD0022

    Abstract: marking code w2 sot323 marking w0 sot-23 mlp 836 RD91 package QFN-6x6 diode sod-123 marking code 120 STMicroelectronics marking code date SOT 23 TO202 package transistor marking 36L
    Text: PD0022 Packing information Axial, through hole, surface mount and chip scale packages for IPAD , protection, rectifiers, thyristors and ACSs™ 1 Tape and reel delivery mode 1.1 Tape dimensions for surface mount packages Table 1. Surface mount devices - all dimensions in millimeters


    Original     		PDF PD0022 35-8L PD0022 marking code w2 sot323 marking w0 sot-23 mlp 836 RD91 package QFN-6x6 diode sod-123 marking code 120 STMicroelectronics marking code date SOT 23 TO202 package transistor marking 36L

    IXAN0021

    Abstract: MOSFET Based Chopper IXAN0022 VWM350-0075P FMM150-0075P IXUC100N055 IXUC200N055 VMM1500-0075P trench relay MOSFET Based Chopper applications
    Text: IXAN0021 New Trench Power MOSFETs in Isolated Packages Abstract Andreas Lindemann IXYS Semiconductor GmbH Postfach 1180, D { 68619 Lampertheim www.IXYS.net This paper presents a new family of power semiconductor components with low voltage trench MOSFETs in isolated packages: MOSFET and packaging technologies are brie y


    Original     		PDF IXAN0021 IXAN0022 IXAN0021 MOSFET Based Chopper IXAN0022 VWM350-0075P FMM150-0075P IXUC100N055 IXUC200N055 VMM1500-0075P trench relay MOSFET Based Chopper applications

    IXAN0029

    Abstract: D8203-3 ixan00 AB-9801 D-68623 IXFX55N50 PLUS247 SIL-PAD to-247 MOSFET IGBT THEORY AND APPLICATIONS 300Kpa
    Text: IXAN0029 AB-9801 New Packages for Pressure Mounting APPLICATION BRIEF AB-9801 Prepared by Ralph E. Locher Introduction The use of pressure to mount discrete power semiconductor packages to heat sinks has been rapidly growing for many reasons. When properly executed, it has proven to be a cost effective technique and


    Original     		PDF IXAN0029 AB-9801 800-S® 900-S® PLUS247TM D-68623; IXAN0029 D8203-3 ixan00 AB-9801 D-68623 IXFX55N50 PLUS247 SIL-PAD to-247 MOSFET IGBT THEORY AND APPLICATIONS 300Kpa

    1262-33

    Abstract: IXTP44N10T IXTH200N10T ixtp76n075 IXTA60N10T IXTQ130N10T IXTP98N075T IXTP130N10T IXTP240N055T IXTP64N055T
    Text: TrenchMV 55V-100V Power MOSFETs The ISOPLUS™ Advantage All IXYS ISOPLUS packages are manufactured with an internal direct-copper-bonded (DCB) isolated substrate, are UL certified and provide integral backside case isolation. These packages provide high isolation capability (up to 2500V), improve creepage distance and dramatically reduce total thermal resistance.


    Original     		PDF 5V-100V) O-247 PLUS220 ISOPLUS220TM PLUS220SMD O-252 O-220 O-263 1262-33 IXTP44N10T IXTH200N10T ixtp76n075 IXTA60N10T IXTQ130N10T IXTP98N075T IXTP130N10T IXTP240N055T IXTP64N055T

    TRANSISTOR SMD CODE PACKAGE SOT89 52 10A

    Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
    Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


    Original     		PDF

    TO220 HEATSINK DATASHEET

    Abstract: to220 mica 7721-7PPS Bush TO3 SILICONE MICA SHEET DATA SHEET 50A227B WARTH TO3P package 50B247A to3 HEATSINK
    Text: MOUNTING HARDWARE HEATSINKS & MOUNTINGS WASHERS Economical, commercial grade silicone rubber insulating washers reinforced with glass fibre. Flame retardant to UL94V-0. Supplied specifically for the packages shown below. Colour - Grey. TO220 TO3P/TO247 TO3


    Original     		PDF UL94V-0. O3P/TO247 50B220A 50B247A 50B003A 50A220A 50A220B 50A103A O5/TO39 TO220 HEATSINK DATASHEET to220 mica 7721-7PPS Bush TO3 SILICONE MICA SHEET DATA SHEET 50A227B WARTH TO3P package 50B247A to3 HEATSINK

    TO247 package

    Abstract: TO247 package dissipation KD501 TO218 package BW38-4 Heatsinks TO247 TO220 HEATSINK DATASHEET KL50-1 SW63-2 AV17
    Text: HEATSINKS & MOUNTINGS TO202 package HEATSINKS KM series continued 6273B/PB 19.1 L High power dissipation, extruded heatsinks designed to accommodate one or more TO218/TO247 packages via a clip retaining feature clips available separately . Shaped to minimise


    Original     		PDF 6273B/PB O218/TO247 6273B 6273PB 100mm 150mm EAD063NN EAD063TH CLIP-04 EAN025BH TO247 package TO247 package dissipation KD501 TO218 package BW38-4 Heatsinks TO247 TO220 HEATSINK DATASHEET KL50-1 SW63-2 AV17

    triac 131-6

    Abstract: l6232e btb24 application notes l6254a1 ST L6201 application note MC 1200 Motor Control Board ST L6203 application note L298HN H-Bridge BTB16-600CW UNIVERSAL MOTOR SPEED CONTROL CIRCUIT diac BZW06-376B
    Text: Selection Guide for Motor Control S T M P U T T I N G I C R O E L E C T R O N I C S Y O I O U F Y N O U R C O N T R O L M O T O R DEDICATED POWER PACKAGES* Max247 ISOTOP MULTIWATT15 PENTAWATT Power SO-36 MULTIWATT11 Power SO-20 * Short selection of innovative power packages


    Original     		PDF Max247 MULTIWATT15 SO-36 MULTIWATT11 SO-20 14bit 8/10bit TQFP44 TQFP64 PLCC44/SDIP42 triac 131-6 l6232e btb24 application notes l6254a1 ST L6201 application note MC 1200 Motor Control Board ST L6203 application note L298HN H-Bridge BTB16-600CW UNIVERSAL MOTOR SPEED CONTROL CIRCUIT diac BZW06-376B

    AN-1031

    Abstract: No abstract text available
    Text: Application Note AN-1031 Lead Bending Considerations for International Rectifier’s Power Semiconductor Packages By Doug Butchers and Mark Steers, International Rectifier Table of Contents Page Lead Bending .2


    Original     		PDF AN-1031 AN-1031

    Untitled

    Abstract: No abstract text available
    Text: C40 Heat Sink System For TO-247, TO-264 and SOT-227 Packages The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development)


    Original     		PDF O-247, O-264 OT-227 OT-227 C40-058-AE CLA-T247-21E O-247 O-264

    circuit diagram wireless spy camera

    Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
    Text: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint


    Original     		PDF DFN1006D-2 OD882D) DFN1010D-3 OT1215) DFN2020MD-6 OT1220) DFN1608D-2 OD1608) DSN0603 OD962) circuit diagram wireless spy camera PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143

    w2 mark 5 pin mosfet smd

    Abstract: Philips SC07 Small-signal Transistors transistor bf 175
    Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


    Original     		PDF

    za sot353

    Abstract: M3D423 sot440 SOT195 M3D452 SOD70 package semiconductor packages semiconductors CROSS-REFERENCE Chapter 8 Philips SOD-61A
    Text: SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy 1 Wed May 12 11:40:55 1999 CHAPTER 1 PACKAGE OVERVIEW SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy Philips Semiconductors 2 Wed May 12 11:40:55 1999 Discrete Semiconductor Packages Package overview


    Original     		PDF M3D176 SC-88 SC-88A SC-89 OT128B OT346 OT143R OT428 OT186 OT323 za sot353 M3D423 sot440 SOT195 M3D452 SOD70 package semiconductor packages semiconductors CROSS-REFERENCE Chapter 8 Philips SOD-61A

    Untitled

    Abstract: No abstract text available
    Text: STFW3N150, STH3N150-2, STP3N150, STW3N150 N-channel 1500 V, 2.5 A, 6 Ω typ., PowerMESH Power MOSFETs in TO-3PF, H2PAK-2, TO-220 and TO247 packages Datasheet - production data Features TAB Order codes 1 VDS RDS on max. ID PTOT 2 3 1 3 STFW3N150 63 W 2


    Original     		PDF STFW3N150, STH3N150-2, STP3N150, STW3N150 O-220 STFW3N150 STH3N150-2 STP3N150 O-220

    power DIODES

    Abstract: M3D423 M3D087 M3D333 TO-220F JEDEC 3D sot223 M3D302 TO220 SMALL heatsink M3D295 SOD115
    Text: DISCRETE SEMICONDUCTORS Package Overview Power Diodes 1998 Nov 19 Philips Semiconductors Power Diodes Package Overview PACKAGE OVERVIEW The following table contains a listing of discrete packages in ascending order. The list contains the description of the


    Original     		PDF M3D116 OT428 M3D300 OT429 M3D314 OT457 M3D302 DO-214AC MS-013AC power DIODES M3D423 M3D087 M3D333 TO-220F JEDEC 3D sot223 M3D302 TO220 SMALL heatsink M3D295 SOD115

    Power Diodes

    Abstract: M3D118 power diode package SOD106A hermetically sealed IMPLOTEC SSOP20 package M3D121 TO220 SMALL heatsink SOD115
    Text: DISCRETE SEMICONDUCTORS Package Overview Power Diodes 1998 Dec 07 Philips Semiconductors Power Diodes Package Overview PACKAGE OVERVIEW The following table contains a listing of discrete packages in ascending order. The list contains the description of the


    Original     		PDF M3D116 M3D300 OT429 M3D314 OT457 M3D302 DO-214AC OD106 SC-46 Power Diodes M3D118 power diode package SOD106A hermetically sealed IMPLOTEC SSOP20 package M3D121 TO220 SMALL heatsink SOD115

    AN-994

    Abstract: MQFP64 PLCC-44 SOT 663 footprint
    Text: Application Note AN-994 Maximizing the Effectiveness of Your SMD Assemblies by Gil Alivio, John Ambrus, Tim McDonald, Richard Dowling Table of Contents Page How We Measure Rth JA .2 Thermal Characterization of Surface Mount Packages .3


    Original     		PDF AN-994 AN-994 MQFP64 PLCC-44 SOT 663 footprint

    Transistor Arrays

    Abstract: transistor SST 126 IMD6 transistor 136 138 140
    Text: "Transistors Surface Mounted Leaded Packages Available-«> Packages Available-110 POWER MOSFET-112 POWER MOSFET- ei MPT • CPT F5 • PSD


    OCR Scan     		PDF ailable-------------------------------110 SFET----------------------------------112 T0-220FP O-247 OT-23) SC-59/Japemw PSIP12Pin. LF12Pin Transistor Arrays transistor SST 126 IMD6 transistor 136 138 140

    FIP450

    Abstract: T0447 PAD46ABS FULLPAK FP450
    Text: APPLICATION NOTE 972A Thermal and Mechanical Considerations For FullPak Applications HEXFET is a trademark o f International Rectifier by Peter Wood indicated. The requirem ents for such packages are listed below: Plastic Packages Plastic m olded sem iconductors


    OCR Scan     		PDF O-247AC c384V AN-972A TD-247 O-220 PAD43ABS PAD44ABS PAD46ABS O-247 FIP450 T0447 FULLPAK FP450