Untitled
Abstract: No abstract text available
Text: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance
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PS256X32
56X32W/D
56X32W
DPS256X32L/DPS256X32W/DPS256X32WA
64-Pin
30A056-00
DPS256X32L/DPS256X32W/DPS256X32WA
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM PS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8
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DPS256X32V3
PS256X32V
DPS256X32V3
100ns
120ns
150ns
30A044-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit CMOS SRAM MICROSYSTEMS PS256X32L/PS256X32W D ES C R IP T IO N : T he D PS256X32L/PS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM m odule, intended for high performance computers and digital signal processing applications.
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PS256X32L/DPS256X32W
DPS256X32L/DPS256X32W
64-Pin
DPS256X32L/DPS256X32W
30A056-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM M ICRO S YSTEM S PS256X32CV3/D PS256X32BV3 DESCRIPTION: The PS256X32CV3/PS256X32BV3 "VER SA-STAC K” module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted
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PS256X32C
PS256X32B
DPS256X32CV3/DPS256X32BV3
DPS256X32CV3/DPS256X32BV3
DPS256X32BV3
DPS256X32CV3
500mV
DPS256X32CV3only)
30A044-03
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Untitled
Abstract: No abstract text available
Text: □PM PS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless
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DPS256X32V3
PS256X32V3
DPS256X32V3
30A04400
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180x32
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit CMOS SRAM M ICROSYST E M S PS256X32V3 DESCRIPTION: The D PS256X32V3 "V E R S A -S T A C K ” m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8
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DPS256X32V3
DPS256X32V3
120ns
180x32
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A1048
Abstract: 1431 T WE 251
Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256 X 3 2 L/DPS256 X 32 W D ESC RIPTIO N : The D PS256X32L/D PS256X32W is a 256K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended for high performance computers and digital signal
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DPS256X32L/DPS256X32W
DPS256X32IVD
PS256X32W
64-Pin
DPS256
L/DPS256
DPS256X32L/DPS256X32W
30A056-00
27ST41S
A1048
1431 T
WE 251
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A16E
Abstract: No abstract text available
Text: PS256X32V3 □PM Dense-Pac Microsystems, Inc. CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS256X32V3 "VERSA-STACK" m od ule is a re v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless
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DPS256X32V3
PS256X32V3
DPS256X32V3
30A04400
A16E
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jedec 64-pin simm
Abstract: Dense pac
Text: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance
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DPS256X32L/DPS256X32W/DPS256X32WA
64-Pin
30A056-00
jedec 64-pin simm
Dense pac
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PS1M
Abstract: 36PIN 32 PIN
Text: R E F E R E N C E SIZE SHAM PART N U M B E R 4 Megabit 6 Megabit 8 Megabit 9 Megabit SIZE \ I O R G A N IZ A T IO N SPEED ns 256Kx8 25, 35, 45, 55, 70 32-Pin DIP 47 32-Pin 32-Pin 36-Pin 36-Pin SOJ SOL SOJ SOL 53 PACKAG E PAGE I I' K ( ) I ) 11 ( I DPS256S8AP
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DPS256S8AP
DPS256S8EJ4
DPS256S8EL4
DPS256S8RJ4
DPS256S8RL4
DPS256S8P
DPS256S8PL
DPS256S8PLL
DPS512S8AP
DPS512S8EI4
PS1M
36PIN
32 PIN
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