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    BK-4

    Abstract: qfp304 QFP304-P-4040-0
    Text: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP304-P-4040-0 50-BK4 BK-4 qfp304

    QFP304

    Abstract: No abstract text available
    Text: QFP304-P-4040-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 12.37 TYP. 2 版/96.11.28


    Original     		PDF QFP304-P-4040-0 50-BK4 QFP304

    4040

    Abstract: QFP304 4040 datasheet QFP304-P-4040-0
    Text: QFP304-P-4040-0.50-BK4 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF QFP304-P-4040-0 50-BK4 4040 QFP304 4040 datasheet

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    qfp144p

    Abstract: 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80
    Text: J2N0016-38-81 作成：1998年 8月 前回作成：1996年10月 パッケージ l n パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI／Oピン数等からお客様の 要求に合ったパッケージをお選びください。


    Original     		PDF J2N0016-38-81 SSOP32-P-430-1 QFP44-P-910-0 80-2K QFP56-P-910-0 65-2K QFP60-P-1519-1 QFP64-P-1414-0 80-BK QFP128-P-2828-0 qfp144p 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80

    2035 zilog

    Abstract: zilog 2035 TC81221F set top box block diagram TX3904 QFP304 LSI ASIC MIPS R3000A toshiba semiconductor catalog TX39
    Text: SYSTEM CATALOG FOR DIGITAL SET TOP BOXES Set Top Box Block Diagram Example of Digital Satellite Broadcast Set Top Box for Japanese Systems Tuner TD7627FN TA1248F F-Syn. I/Q Demo. Modem Codec TC90A48F TC90A32F QPSK System MPU TX39 Software Modem Video Encoder


    Original     		PDF TD7627FN TA1248F TC90A48F TC90A32F TC81220CF TC90A43F TC9293AF 2035 zilog zilog 2035 TC81221F set top box block diagram TX3904 QFP304 LSI ASIC MIPS R3000A toshiba semiconductor catalog TX39

    PBGA352 35

    Abstract: QFP44-P-910-0 QFP64-P-1414-0 QFP80-P-1420-0 SSOP32-P-430-1 mirror P-LFBGA224-1515-0 160-28X
    Text: FJXLSC-PKG-04 作成：2000 年 9 月 前回作成：1998 年 8 月 パッケージ ● • パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI ／O ピン数等からお客様の御要求に合ったパ


    Original     		PDF FJXLSC-PKG-04 SSOP32-P-430-1 QFP44-P-910-0 80-2K QFP56-P-910-0 65-2K QFP60-P-1519-1 QFP64-P-1414-0 80-BK QFP80-P-1420-0 PBGA352 35 mirror P-LFBGA224-1515-0 160-28X

    425M

    Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
    Text: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3


    Original     		PDF P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240

    QSJ-50074

    Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20
    Text: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4


    Original     		PDF 300mil QSJ44400 DIP8P3002 DIP14P3002 DIP16P3002 DIP18P3002 DIP20P3002 DIP22P3002 DIP8G3002 QSJ-50074 QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20

    Untitled

    Abstract: No abstract text available
    Text: HCT-900 HCT-900 Hand Held Convection Tool SMT Component Rework A Versatile Hot Air Tool for SMT Soldering and De-soldering The OK International HCT-900 Hand Held Convection Tool offers a low cost versatile rework solution for a wide variety of production and rework


    Original     		PDF HCT-900 HCT-900 HCT-900-11 HCT-900-21 HCT-900-10 H-SL16 H-P20 PLCC-28 H-P32

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    QSJ52627

    Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
    Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 7 章 包装 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 7 章部分とな ります。


    Original     		PDF 300mil QSJ-44400 DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1 54-S1 QSJ52627 B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    TSOP 173 g

    Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
    Text: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4


    Original     		PDF 10sec QFP56-P-910-K SnPb9557030 JU-11T 30sec TSOP 173 g TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    sac 326

    Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
    Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要


    Original     		PDF PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance

    koki solder paste

    Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY


    Original     		PDF JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1

    Untitled

    Abstract: No abstract text available
    Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite


    OCR Scan     		PDF QFP64 QFP80 QFP100 BQFP100 TQFP100 QFP120 TQFP120 BQFP132 QFP160

    Untitled

    Abstract: No abstract text available
    Text: G—QFP304—4040—0.50 Uniti nn 42, 6±0. 2 39, 2±0, 4 228 153 ?!?!?!?!?!?!?!?!?! !?!?!?!?!?!?!?!?!?!?!?!?!?!? 229 152 31013101310131013101310131013101310131


    OCR Scan     		PDF G-QFP304-4040-0 85TYP

    Untitled

    Abstract: No abstract text available
    Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite


    OCR Scan     		PDF QFP64 QFP80 QFP100 BQFP100 TQFP120 BQFP132 25mils QFP160 QFP184

    Untitled

    Abstract: No abstract text available
    Text: G—QFP304—4040—0.50 Uniti nn Nov.2003


    OCR Scan     		PDF