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    DRAM REFRESH Search Results

    DRAM REFRESH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMS4030JL Rochester Electronics LLC TMS4030 - DRAM, 4KX1, 300ns, MOS, CDIP22 Visit Rochester Electronics LLC Buy
    4164-15FGS/BZA Rochester Electronics LLC 4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006ZA) Visit Rochester Electronics LLC Buy
    4164-12JDS/BEA Rochester Electronics LLC 4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 120 NS ACCESS TIME - Dual marked (8201008EA) Visit Rochester Electronics LLC Buy
    4164-15JDS/BEA Rochester Electronics LLC 4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006EA) Visit Rochester Electronics LLC Buy
    UPD48011318FF-FH16-FF1-A Renesas Electronics Corporation Low Latency DRAM, T-LBGA, /Tray Visit Renesas Electronics Corporation

    DRAM REFRESH Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Motorola B13

    Abstract: DRAM controller MCF5307
    Text: MCF5307 DRAM CONTROLLER MCF5307 DRAM CTRL Motorola ColdFire 1- 1 MCF5307 DRAM CONTROLLER MCF5307 MCF5307 DRAM Controller I Addr Gen – Supports 2 banks of DRAM – Supports External Masters – Programmable Wait States & Refresh Timer – Supports Page Mode and Burst Page


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    PDF MCF5307 MCF5307 32-bit Motorola B13 DRAM controller

    M13S2561616A-5TG

    Abstract: 90-FBGA M12L64164A-7T M13S2561616A -5T M11B416256A-25JP diode 6BG 90FBGA M12L128168A-6TG M12L16161A TSOPII
    Text: Product Selection Guide of ESMT DRAM Density 4Mb Updated Date : 11/06/2006 Organization Description 256Kb*16 EDO DRAM 5V EDO DRAM 5V EDO DRAM 3.3V EDO DRAM 3.3V Refresh 512 512 512 512 Speed 25ns 35ns 35ns 35ns Package Part Number Pb-free Sample MP Now Now


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    PDF 256Kb 40/44L-TSOPII M11B416256A-25JP M11B416256A-35TG M11L416256SA-35JP M11L416256SA-35TG 40L-SOJ 44-40L-TSOPII 128Mb M13S2561616A-5TG 90-FBGA M12L64164A-7T M13S2561616A -5T M11B416256A-25JP diode 6BG 90FBGA M12L128168A-6TG M12L16161A TSOPII

    3524CP

    Abstract: 2MX40 RAM128KX8 DIP HM624256 HM62832 16Mbit FRAM Dram 168 pin EDO 8Mx8 hm62256 flash 32 Pin PLCC 16mbit HN27C1024
    Text: Memory Shortform, May '97 Memory Products Fast Page Mode DRAM DRAM EDO DRAM Synchronous DRAM SRAM Low Power SRAM Fast SRAM Non Volatile EPROM & OTPROM Memories EEPROM FRAM Fast Page Mode DRAM Modules EDO DRAM Modules SDRAM Modules FLASH Memory FLASH FLASH CARDS


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    PDF HB56U132 HB56H132 HB56U232 HB56H232 HN62W454B 512kx8 256kx16 HN62W4416N 16Mbit 1Mx16 3524CP 2MX40 RAM128KX8 DIP HM624256 HM62832 16Mbit FRAM Dram 168 pin EDO 8Mx8 hm62256 flash 32 Pin PLCC 16mbit HN27C1024

    dram controller

    Abstract: CRTC 4M DRAM EDO
    Text: DRAM Controller 1/4 64-bit DRAM Controller Uses Unified Memory Architecture UMA The System memory and Graphics Frame Buffer use the same memory space and memory hardware DRAM Controller consists of 2 domains: Host Clock domain CPU & PCI bridge DRAM refresh cycles


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    PDF 64-bit 64-bit 32-bit 50/60/70ns dram controller CRTC 4M DRAM EDO

    3654P

    Abstract: DRAM 4464 jeida dram 88 pin MB814260 4464 dram 1024M-bit 4464 64k dram MB81G83222-008 mb814400a-70 4464 ram
    Text: To Top / Lineup / Index Product Line-up Memory Volatile memory 4M-bit DRAM 5.0V RAM 4M-bit DRAM (3.3V) 16M-bit DRAM (5.0V) 16M-bit DRAM (3.3V) 16M-bit SDRAM 64M-bit SDRAM SGRAM DRAM Modules (5.0V) DRAM Modules (3.3V) SDRAM Modules Non-Volatile memory Rewritable


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    PDF 16M-bit 64M-bit 68-pin) 88-pin) MB98C81013-10 MB98C81123-10 MB98C81233-10 MB98C81333-10 3654P DRAM 4464 jeida dram 88 pin MB814260 4464 dram 1024M-bit 4464 64k dram MB81G83222-008 mb814400a-70 4464 ram

    toshiba toggle mode nand

    Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
    Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit


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    PDF 64M128M 66MHz 100MHz 200MHz) 500/600MHz 800MHz 400MHz 800MHz) X16/X18X32 PhotoPC550 toshiba toggle mode nand TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP

    A3-12

    Abstract: MACH210A
    Text: module dram title ' PLX TECHNOLOGY * PROPRIETARY INFORMATION * DRAM: DRAM Control MACH Engineer: DLR Product: PCI 9060/DRAM Demo Board Part Number: xxx-xxxx-xxxx Revision 1.0 08-31-95 Copyright PLX Technology, 1995 ' "device declaration dram device 'MACH210A';


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    PDF 9060/DRAM MACH210A' PCI9060 1Mx32 A3-12 MACH210A

    Untitled

    Abstract: No abstract text available
    Text: DRAM MODULE Revision History Version 0.0 June 1998 • The 4th. generation of 16M DRAM components are applied for this module. KMM466F104CT1-L KMM466F124CT1-L KMM466F104CT1-L KMM466F124CT1-L DRAM MODULE KMM466F104CT1-L & KMM466F124CT1-L EDO Mode 1M x 64 DRAM SODIMM using 1Mx16, 1K/4K Refresh 3.3V, Low power/Self-Refresh


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    PDF KMM466F104CT1-L KMM466F124CT1-L KMM466F124CT1-L 1Mx16, KMM466F10 1Mx64bits

    rx69

    Abstract: BA715 Rx71 C-Cube microsystems C-Cube VRP3 CL4020 Rx68 MD235 MD28
    Text: 5 DRAM Interface Functional Description This chapter describes the functional operation of the VRP3’s DRAM interface. It consists of these sections: • ■ ■ ■ ■ ■ ■ 5.1, DRAM Configurations 5.2, DRAM Connections 5.3, Address Mapping 5.4, Interleaved DRAM Accesses


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    PDF CL4020 CL4040, speeds67 74ABT841 CL4040 rx69 BA715 Rx71 C-Cube microsystems C-Cube VRP3 Rx68 MD235 MD28

    RRH cl2

    Abstract: BBU RRH
    Text: MT4C4001 J L 1 MEG X 4 DRAM I^IICRDN DRAM 1 MEG x 4 DRAM DRAM STANDARD OR LOW POWER, EXTENDED REFRESH FEATURES • 1,024-cycle refresh distributed across 16ms (MT4C4001J) or 128ms (MT4C4001J L) • Industry-standard x4 pinout, timing, functions and packages


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    PDF MT4C4001 024-cycle MT4C4001J) 128ms MT4C4001J 20-Pin RRH cl2 BBU RRH

    1Mx4

    Abstract: No abstract text available
    Text: DRAM MODULE 4 Mega Byte KMM5361203W/WG Fast Page Mode 1Mx36 DRAM SIMM , 1K Refresh, 5V Using 1Mx16 B/W DRAM and 1Mx4 Quad CAS DRAM GENERAL DESCRIPTION FEATURES • Performance Range: The Samsung KMM5361203W is a 1M bit x 32 Dynamic RAM high density memory module The


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    PDF KMM5361203W/WG 1Mx36 1Mx16 KMM5361203W 42-pin 24-pin 72-pin 1Mx4

    KM416C1200AJ

    Abstract: km44c1003cj kmm5361203aw
    Text: DRAM MODULE 4 Mega Byte KMM5361203AW/AWG Fast Page Mode 1Mx36 DRAM SIMM , 1K Refresh, 5V Using 1Mx16 B/W DRAM and 1Mx4 Quad CAS DRAM GENERAL DESCRIPTION FEATURES • Performance Range: The Samsung KMM5361203AW is a 1M bit x 36 Dynamic RAM high density memory module. The


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    PDF KMM5361203AW/AWG 1Mx36 1Mx16 KMM5361203AW 42-pin 24-pin 72-pin KM416C1200AJ km44c1003cj

    KM44C4100ak

    Abstract: KMM5364103AK
    Text: DRAM MODULE KMM5364103AK/AKG Fast Page Mode 4Mx36 DRAM SIMM, 2K Refresh, 5V Using 16M Quad CAS DRAM - 16 Mega Byte 7 GENERAL DESCRIPTION FEATURES The Samsung KMM5364103AK is a 8M bit x 36 Dynamic RAM high density memory module using Parity with 16M Quad CAS DRAM. The Samsung


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    PDF KMM5364103AK/AKG 4Mx36 KMM5364103AK 24-pin 28-pin 72-pin 110ns 130ns KM44C4100ak

    Untitled

    Abstract: No abstract text available
    Text: MT4C4001 J L 1 MEG X 4 DRAM (M IC R O N DRAM 1 MEG x 4 DRAM DRAM STANDARD OR LOW POWER, EXTENDED REFRESH FEATURES • 1,024-cycle refresh distributed across 16ms (MT4C4001J) or 128ms (MT4C4001J L) • Industry-standard x4 pinout, timing, functions and packages


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    PDF MT4C4001 024-cycle MT4C4001J) 128ms MT4C4001J MT4C4001J 275mW 20-Pin

    hy57v168010a

    Abstract: hy57v168010 HY57V164010 HY57V161610 400k5
    Text: 16Mbit Synchronous DRAM Series -HYUNDAI HY57V164010- 4Mx4bit Synchronous DRAM HY57V168010- 2Mx8blt Synchronous DRAM HY57V161610- 1Mx16bit Synchronous DRAM DESCRIPTION The HY57V164010, HY57V168010, HY57V161610 are high speed 3.3 Volt synchronous dynamic RAMs


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    PDF 16Mbit HY57V164010, HY57V168010, HY57V161610 512Kbit HY57V164010- HY57V168010- 1SD10-03-NOV96 285ns hy57v168010a hy57v168010 HY57V164010 400k5

    hy57v168010a

    Abstract: hy57v168010 HY57V164010 hy57v168010altc HY57V161610 hy57v16801 hy57v161610a MDQ13 M1023 OV9653
    Text: 16Mbit Synchronous DRAM Series 'HYUNDAI HY57V164010- 4Mx4bit Synchronous DRAM HY57V168010- 2Mx8blt Synchronous DRAM HY57V161610- 1Mx16bit Synchronous DRAM DESCRIPTION The HY57V164010, HY57V168010, HY57V161610 are high speed 3.3 Volt synchronous dynamic RAMs


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    PDF 16Mbit HY57V164010- HY57V168010- HY57V161610- 1Mx16bit HY57V164010, HY57V168010, HY57V161610 512Kbit 1SD10-Q3-NOV96 hy57v168010a hy57v168010 HY57V164010 hy57v168010altc hy57v16801 hy57v161610a MDQ13 M1023 OV9653

    KMM5362203AW-6

    Abstract: kmm5362203aw
    Text: DRAM MODULE 8 Mega Byte KMM5362203AW/AWG Fast Page Mode 7 2Mx36 DRAM SIMM , 1K Refresh, 5V Using 1 Mx16 B/W DRAM and 1Mx4 Quad CAS DRAM GENERAL DESCRIPTION FEATURES The Samsung KMM5362203AW is a 2M bit x 36 Dynamic RAM high density memory module. The • Performance Range:


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    PDF KMM5362203AW/AWG 2Mx36 KMM5362203AW 1Mx16 42-pin 24-pin 72-pin KMM5362203AW-6

    Untitled

    Abstract: No abstract text available
    Text: DRAM MODULE 16 Mega Byte KMM5364103AK/AKG Fast Page Mode 4Mx36 DRAM SIMM, 2K Refresh, 5V Using 16M Quad CAS DRAM GENERAL DESCRIPTION FEATURES The Samsung KMM5364103AK is a 8M bit x 36 Dynamic RAM high density memory module using Parity with 16M Quad CAS DRAM. The Samsung


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    PDF KMM5364103AK/AKG 4Mx36 KMM5364103AK 24-pin 20-pin 72-pin

    MCF5206

    Abstract: RC10 RC11 00FE0000
    Text: SECTION 10 DRAM CONTROLLER 10.1 INTRODUCTION The DRAM controller DRAMC provides a glueless interface between the ColdFire core and external DRAM. The DR a M c supports two banks of DRAM. Each DRAM bank can be from 128 kbyte to 256 Mbyte. The D r A m C can support DRAM bank widths of 8, 16, or 32


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    PDF 33Mhz) 0x00100000 0x000e0000, 0x0010-0x001effff 32-bit 512-byte MCF5206 RC10 RC11 00FE0000

    Untitled

    Abstract: No abstract text available
    Text: DRAM MODULE 32 Mega Byte KMM5368003AK/AG Fast Page Mode 8Mx36 DRAM SIMM, 4K Refresh, 5V Using 16M Quad CAS DRAM with 400 mil Package GENERAL DESCRIPTION FEATURES The Samsung KMM5368003AK is a 8M bit x 36 Dynamic HAM high density memory module using Parity with 16M Quad CAS DRAM. The Samsung


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    PDF KMM5368003AK/AG 8Mx36 KMM5368003AK 24-pin 28-pin 72-pin

    LS764

    Abstract: A12E
    Text: 74LS765 Signelics DRAM Controller DRAM Dual-Ported Controller Preliminary Specification Logic Products FEATURES • Allows two microprocessors to access the same bank of DRAM • Replaces 25 TTL devices to perform arbitration, signal timing, multiplexing, and refresh


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    PDF 74LS765 LS764 30MHz 215mA PLCC-44 N74LS765N* N74LS765A* 6002230S A12E

    74LS764

    Abstract: logic diagram and symbol of DRAM 74LS N74LS764A N74LS764N PLCC-44 18-BlT LS764
    Text: 74LS764 Signetics DRAM Controller DRAM Dual-Ported Controller Product Specification Logic Products FEATURES • Allows two microprocessors to access the same bank of DRAM • Replaces 25 TTL devices to perform arbitration, signal timing, multiplexing, and refresh


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    PDF 74LS764 18-blt 30MHz 74LS764 IN916, IN3064, 500ns logic diagram and symbol of DRAM 74LS N74LS764A N74LS764N PLCC-44 LS764

    74LS764

    Abstract: LS764
    Text: 74LS764 Signetics DRAM Controller DRAM Dual-Ported Controller Product Specification Logic Products FEATURES • Allows two microprocessors to access the same bank of DRAM • Replaces 25 TTL devices to perform arbitration, signal timing, multiplexing, and refresh


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    PDF 74LS764 18-blt 30MHz 215mA PLCC-44 WF06450S IN916, IN3064, 74LS764 LS764

    74LS

    Abstract: 74LS765 N74LS765A N74LS765N PLCC-44
    Text: 74LS765 Signetics DRAM Controller DRAM Dual-Ported Controller Preliminary Specification Logic Products FEATURES • Allows two microprocessors to access the same bank of DRAM • Replaces 25 TTL devices to perform arbitration, signal timing, multiplexing, and refresh


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    PDF LS764 30MHz 74LS765 74LS N74LS765A N74LS765N PLCC-44