PS256X Search Results

Contextual Info: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM PS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM MICROSYSTEMS PS256X32L/PS256X32W D ES C R IP T IO N : T he D PS256X32L/PS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM m odule, intended for high performance computers and digital signal processing applications.

Contextual Info: □P M PS256X16A3 Dense-Pac Microsystems, Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D PS256X16A 3 "D E N S E -S T A C K " module is a revo lutio n ary new m em ory subsystem usin g D e n se -P a c M ic ro s y s te m s ' ceram ic Stackable

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM M ICRO S YSTEM S PS256X32CV3/D PS256X32BV3 DESCRIPTION: The PS256X32CV3/PS256X32BV3 "VER SA-STAC K” module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted

Contextual Info: □PM PS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless

180x32

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM M ICROSYST E M S PS256X32V3 DESCRIPTION: The D PS256X32V3 "V E R S A -S T A C K ” m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8

A1048

Abstract: 1431 T WE 251
Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256 X 3 2 L/DPS256 X 32 W D ESC RIPTIO N : The D PS256X32L/D PS256X32W is a 256K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended for high performance computers and digital signal

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM D PS256X16Cn3/PS256X16Bn3 DESCRIPTION: The PS256X16Cn3/PS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

A16E

Contextual Info: PS256X32V3 □PM Dense-Pac Microsystems, Inc. CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS256X32V3 "VERSA-STACK" m od ule is a re v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless

jedec 64-pin simm

Abstract: Dense pac
Contextual Info: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance

PS8551L4

Abstract: PS2581 PS2581A NEC PS2581 PS9451 PS9317 PS9817A-1 ps9122 PS9302 ps2805c
Contextual Info: IC output optocoupler Transistor optocoupler May 2009 Introduction Based on all in-house technologies Bipolar, CMOS and Bi-CMOS NEC Electronics can offer a complete portfolio of optoisolation products. The long of experience of NEC Electronics in developing and manufacturing highest quality optoelectronic products is reflected in hundreds

1431 T

Abstract: SH 05.22 DPS256X36L AL154
Contextual Info: D E N S E - P A 9 Megabit CMOS SRAM C MICROSYSTEMS PS256X36L PRELIM ÎNARY D E S C R IP T IO N : The PS256X36L is a 25 6K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

PC123 optocoupler

Abstract: opto coupler TLP250 opto coupler 817 ps9402 TLP121-4 Optocoupler HCPL 501 HCPL-501 cosmo 817 PS8551L4 PS9303
Contextual Info: Optocoupler Selection Guide www.renesas.eu 2010.08 Introduction Renesas offers a leading portfolio of high performance optocouplers. Key features enabling customers to develop market leading products include 5KV isolation voltage, minimum CMR of 25KV/us and wide

opto 2581A

Abstract: NEC 2581A NEC 2501A NEC 2561A PS284x-4x TLP520 nl701 NEC 2501 NEC 2561A w 2581A
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM PS256X16Cn3/PS256X16Bn3 MICROSYSTEMS DESCRIPTION: The PS256X16Cn3/PS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

opto coupler 2561A

Abstract: NEC 2501 Opto coupler NEC 2581A NEC 2561A nl701 nec 2501 PS2501-1-L varistor BS415 MATSUSHITA compressor codes 2501 PHOTOCOUPLER
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

nec optocoupler

Abstract: PS27XX PS25XX ps2741 PS9701 ps2805-4 Nemko USA
Contextual Info: NEC Optocoupler Families 1C o u t p u t Ultra High Speed 10M PS9701 « A PS2741 A ♦ High Speed (1M) I High Power output PS28XX Family PS27XX Family 2.5 KV Isolation CTR Rank Options: 80-2,000 Available on tape and reel 3.75 KV Isolation CTR Rank Options: 10-6,500

pc111 optocoupler

Abstract: qtc 2531 qtc 2630 qtc 2731 qtc 2530 qtc 2631 LH1571 PC123 optocoupler PC923 equivalent 74ol6000 equivalent
Contextual Info: OPTOCOUPLERS CROSS REFERENCE INDEX 1. SHARP . 1 2. TOSHIBA . 2 3. SIEMENS. 6 4. QTC . 9

NEC 2561A

Abstract: nec 2501 NEC 2581A opto coupler 2561A NEC 2501A NEC 2561A w 2581A NEC 2501 Opto coupler 2501 photocoupler opto 2581A
Contextual Info: NEPOC Photocoupler Family OC MOSFET™ Family Device Overview 2005 When the product s listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.

48-PIN

Contextual Info: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead

A273D

Abstract: 16J3 512X32 48pin
Contextual Info: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32

tx8205

Contextual Info: < DENSE-PAC MICROSYSTEMS ,p 8 Megabit High Speed CMOS SRAM PS256X32CV3/PS256X32BV3 DESCRIPTION: T h e D P S 2 5 6 X 3 2 C V 3 /D P S 2 5 6 X 3 2 BV3 "V E R S A -S T A C K " m o d u le is a re v o lu tio n a ry n e w h ig h speed m e m o ry subsystem us in g Dense-Pac

PS1M

Abstract: 36PIN 32 PIN
Contextual Info: R E F E R E N C E SIZE SHAM PART N U M B E R 4 Megabit 6 Megabit 8 Megabit 9 Megabit SIZE \ I O R G A N IZ A T IO N SPEED ns 256Kx8 25, 35, 45, 55, 70 32-Pin DIP 47 32-Pin 32-Pin 36-Pin 36-Pin SOJ SOL SOJ SOL 53 PACKAG E PAGE I I' K ( ) I ) 11 ( I DPS256S8AP